Optoelectronic component

• US 10,026,880 B2
• Filed: 09/08/2015
• Issued: 07/17/2018
• Est. Priority Date: 09/09/2014
• Status: Active Grant

• Current Assignee: OSRAM OLED GMBH (Ams-Osram AG)
• Original Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Inventors: Racz, David, Zitzlsperger, Michael, Bogner, Georg
• Primary Examiner(s): Everhart, Caridad
• Application Number:
  US15/509,505
• Publication Number:
  US 20170263829A1
• Time in Patent Office: 1,043 Days
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 2933/0058 relating to optical field-shaping elements
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 2933/0091 Scattering means in or on the semiconductor body or semiconductor body package H01L33/22 takes precedence
• CPC Class Codes: H01L 33/46 Reflective coating, e.g. dielectric Bragg reflector
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/502 Wavelength conversion materials
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

An optoelectronic component includes a carrier, a light source formed on the carrier, the light source having at least one luminous face formed by one or more light emitting diodes, wherein an at least partly transparent lamina is arranged on the luminous face, the lamina having a surface facing the luminous face and a surface facing away from the luminous face, wherein at least one conversion layer and a color scattering layer for generating a color by light scattering are arranged on at least one of the facing and facing-away surfaces, wherein the conversion layer is arranged upstream of the color scattering layer relative to an emission direction of light from the luminous face, such that light emitted by the luminous face can first be converted and then be scattered.

Claims

1. An optoelectronic component, comprising:

a carrier, and

a light source formed on the carrier,

wherein the light source has at least one luminous face formed by one or more light emitting diodes, wherein

an at least partly transparent lamina is arranged on the luminous face,

wherein the lamina has an alignment structure for aligning a further component relative to the component;

wherein the lamina has a surface facing the luminous face and a surface facing away from the luminous face, wherein

at least one conversion layer and a color scattering layer for generating a color by light scattering are arranged on at least one of the facing and facing-away surfaces, wherein

the conversion layer is arranged upstream of the color scattering layer relative to an emission direction of light from the luminous face, such that light emitted by the luminous face can first be converted and then be scattered.

2. The optoelectronic component as claimed in claim 1, wherein the lamina has at least one light-nontransmissive region.

3. The optoelectronic component as claimed in claim 1, wherein the lamina is embodied as a lens.

4. The optoelectronic component as claimed in claim 1, wherein the lamina has a cavity on its facing-away surface, at least one of the conversion layer and the color scattering layer being arranged in the cavity.

5. The optoelectronic component as claimed in claim 1, wherein the facing surface has a cutout in which an electrical contacting of the light source is arranged.

6. The optoelectronic component as claimed in claim 1, wherein the lamina has an elevated structure.

7. The optoelectronic component as claimed in claim 1, wherein the lamina is formed from at least one of the following group of elements:

glass, transparent ceramic, silicone, hybrid material, in particular silicone/epoxy, plexiglas, sapphire.

8. The optoelectronic component as claimed in claim 1, wherein the lamina has a mechanical structure designed to be used for a further processing process of the component.

9. The optoelectronic component as claimed in claim 8, wherein the mechanical structure has a groove on the lamina edge and/or a stop edge for a potting process.

10. The optoelectronic component as claimed in claim 1, wherein the light source and the lamina are encapsulated by molding and are potted up to an upper edge of the lamina, the upper edge facing away from the light source a potting compound, such that the potting compound is flush with the upper edge.

11. The optoelectronic component as claimed in claim 10, wherein the potting compound has a color identical to the color generated by the color scattering layer.

12. A method for producing an optoelectronic component comprising:

providing an at least partly transparent lamina having two opposite surfaces,

forming at least one conversion layer and a color scattering layer for generating a color by light scattering on at least one of the surfaces of the lamina,

providing a carrier, on which is formed a light source having at least one luminous face formed by one or more light emitting diodes,

arranging the lamina on the luminous face, such that one of the surfaces of the lamina forms a surface facing the luminous face and the other surface of the lamina forms a surface facing away from the luminous face, such that

the conversion layer is arranged upstream of the color scattering layer relative to an emission direction of light from the luminous face, such that light emitted by the luminous face can first be converted and then be scattered;

wherein the light source with the lamina arranged on the luminous face are encapsulated by molding and are subsequently potted up to an upper edge of the lamina, the upper edge facing away from the light source by a potting compound, such that the potting compound is flush with the upper edge.

13. The method as claimed in claim 12, wherein the lamina with the conversion layer and the color scattering layer is measured in respect of an optical property before being arranged on the luminous face, wherein the lamina is arranged on the luminous face only if the measured optical property corresponds to a predetermined reference property.

14. An optoelectronic component, comprising:

a carrier, and

a light source formed on the carrier,

wherein the light source has at least one luminous face formed by one or more light emitting diodes, wherein

an at least partly transparent lamina is arranged on the luminous face,

wherein the lamina has a mechanical structure designed to be used for a further processing process of the component;

wherein the lamina has a surface facing the luminous face and a surface facing away from the luminous face, wherein

at least one conversion layer and a color scattering layer for generating a color by light scattering are arranged on at least one of the facing and facing-away surfaces, wherein

the conversion layer is arranged upstream of the color scattering layer relative to an emission direction of light from the luminous face, such that light emitted by the luminous face can first be converted and then be scattered.

15. The optoelectronic component as claimed in claim 14, wherein the mechanical structure has a groove on the lamina edge and/or a stop edge for a potting process.