Leadless device with overmolded components
First Claim
Patent Images
1. An electronics module in an Implantable Medical Device (IMD), the electronics module comprising:
- a plurality of electrical components connected to form a circuit that includes a terminal;
a potting material supporting the plurality of electrical components, whereinthe plurality of electrical components and the potting material form a circuit sub-module, wherein the terminal is accessible from outside of the circuit sub-module; and
a metallic layer provided on an outer surface of the circuit sub-module, wherein the metallic layer conforms to the outer surface of the circuit sub-module, and the terminal is accessible from outside of the metallic layer;
whereinthe circuit includes a second terminal, and wherein the second terminal is accessible from outside of the circuit sub-module.
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Abstract
An electronics module for use in an Implantable Medical Device (IMD) may include a plurality of electrical components connected to form a circuit that includes a terminal and a potting material that supports the plurality of electrical components. The plurality of electrical components and the potting material together form a circuit sub-module in which the terminal is accessible from outside of the circuit sub-module. A metallic layer that conforms to an outer surface of the circuit sub-module is provided thereon such that the terminal is accessible from outside of the metallic layer.
1150 Citations
19 Claims
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1. An electronics module in an Implantable Medical Device (IMD), the electronics module comprising:
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a plurality of electrical components connected to form a circuit that includes a terminal;
a potting material supporting the plurality of electrical components, whereinthe plurality of electrical components and the potting material form a circuit sub-module, wherein the terminal is accessible from outside of the circuit sub-module; and a metallic layer provided on an outer surface of the circuit sub-module, wherein the metallic layer conforms to the outer surface of the circuit sub-module, and the terminal is accessible from outside of the metallic layer;
whereinthe circuit includes a second terminal, and wherein the second terminal is accessible from outside of the circuit sub-module. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A leadless cardiac pacemaker (LCP) configured to pace a patient'"'"'s heart, the LCP disposable within a chamber of the patient'"'"'s heart, the LCP comprising:
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an electronics module comprising; a plurality of electrical components connected to form a circuit that includes at least a first terminal, a second terminal and a third terminal; a potting material supporting the plurality of electrical components, wherein the plurality of electrical components and the potting material form a circuit sub-module, wherein the first terminal, the second terminal and the third terminal are accessible from outside of the circuit sub-module; and a metallic layer provided on an outer surface of the circuit sub-module, wherein the metallic layer conforms to the outer surface of the circuit sub-module, and the first terminal, the second terminal and the third terminal are accessible from outside of the metallic layer; a plurality of electrodes, the first terminal of the electronics module is operatively coupled to one of the plurality of electrodes; a power source having a first power terminal and a second power terminal, wherein the power source is secured relative to the electronics module with the first power terminal operatively coupled to the second terminal of the electronics module and the second power terminal operatively coupled to the third terminal of the electronics module. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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17. A method of manufacturing a leadless implantable medical device (IMD), the method comprising:
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potting a circuit in a potting material to at least partially encapsulate the circuit within the potting material; applying a metal coating over the potted circuit to provide a moisture barrier to at least part of the potted circuit; attaching the potted circuit to a battery and operatively connecting the circuit to the battery; attaching a fixation mechanism for fixing the IMD to a patient'"'"'s heart; operatively connecting a first electrode to the circuit; and operatively connecting a second electrode to the circuit. - View Dependent Claims (18, 19)
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Specification