Illumination device

• US 10,030,857 B2
• Filed: 06/23/2017
• Issued: 07/24/2018
• Est. Priority Date: 05/29/2012
• Status: Active Grant

• Current Assignee: Epistar Corporation
• Original Assignee: Epistar Corporation
• Inventors: Ho, Chih-Ping, Liao, Chih-Wei, Pan, Shyi-Ming
• Primary Examiner(s): Ton, Anabel
• Application Number:
  US15/631,482
• Publication Number:
  US 20170284644A1
• Time in Patent Office: 396 Days
• CPC Class Codes: F21K 9/20 Light sources comprising attachment means
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21K 9/27 Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
• CPC Class Codes: F21K 9/65 specially adapted for changing the characteristics or the distribution of the light, e.g. by adjustment of parts
• CPC Class Codes: F21V 17/10 characterised by specific fastening means or way of fastening F21V17/02 - F21V17/08 take precedence
• CPC Class Codes: F21V 21/00 Supporting, suspending, or attaching arrangements for lighting devices F21V17/00, F21V19/00 take precedence; arrangement of signalling or lighting devices, the mounting or supporting thereof or circuits therefor, for vehicles in general B60Q, stands for supporting apparatus or articles in general F16M11/00; Hand grips
• CPC Class Codes: F21V 21/002 making direct electrical contact, e.g. by piercing F21V21/35 takes precedence
• CPC Class Codes: F21V 21/14 Adjustable mountings
• CPC Class Codes: F21V 23/06 the elements being coupling devices , e.g. connectors
• CPC Class Codes: F21V 29/85 characterised by the material liquid coolants F21V29/56
• CPC Class Codes: F21V 3/02 characterised by the shape
• CPC Class Codes: F21Y 2107/00 Light sources with three-dimensionally disposed light-generating elements
• CPC Class Codes: F21Y 2107/50 on planar substrates or supports, but arranged in different planes or with differing orientation, e.g. on plate-shaped supports with steps on which light-generating elements are mounted
• CPC Class Codes: F21Y 2109/00 Light sources with light-generating elements disposed on transparent or translucent supports or substrates
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/04026 Bonding areas specifically adapted for layer connectors
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/06102 the bonding areas being at different heights
• CPC Class Codes: H01L 2224/06181 : On opposite sides of the body
• CPC Class Codes: H01L 2224/13099 : Material
• CPC Class Codes: H01L 2224/131 : with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/13109 : Indium [In] as principal constituent
• CPC Class Codes: H01L 2224/13144 : Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/1329 : with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/13339 : Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/14 : of a plurality of bump connectors
• CPC Class Codes: H01L 2224/1403 : Bump connectors having different sizes, e.g. different diameters, heights or widths
• CPC Class Codes: H01L 2224/14051 : Bump connectors having different shapes
• CPC Class Codes: H01L 2224/16 : of an individual bump connector
• CPC Class Codes: H01L 2224/16225 : the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/2919 : with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32225 : the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45099 : Material
• CPC Class Codes: H01L 2224/45124 : Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45147 : Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 : Arched
• CPC Class Codes: H01L 2224/48137 : the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48227 : connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 : the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/49107 : on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73204 : the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73265 : Layer and wire connectors
• CPC Class Codes: H01L 2224/81805 : involving forming a eutectic alloy at the bonding interface
• CPC Class Codes: H01L 2224/83385 : Shape, e.g. interlocking features
• CPC Class Codes: H01L 2224/83493 : with a principal constituent of the material being a solid not provided for in groups H01L2224/834 - H01L2224/83491, e.g. allotropes of carbon, fullerene, graphite, carbon-nanotubes, diamond
• CPC Class Codes: H01L 2224/8592 : Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 24/06 : of a plurality of bonding areas
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/14 : of a plurality of bump connectors
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 25/0753 : the devices being arranged next to each other
• CPC Class Codes: H01L 27/156 : two-dimensional arrays
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01L 33/007 : comprising nitride compounds
• CPC Class Codes: H01L 33/08 : with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body H01L27/15 takes precedence
• CPC Class Codes: H01L 33/20 : with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/44 : characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/48 : characterised by the semiconductor body packages
• CPC Class Codes: H01L 33/486 : adapted for surface mounting
• CPC Class Codes: H01L 33/50 : Wavelength conversion elements
• CPC Class Codes: H01L 33/505 : characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/507 : the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/508 : having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

An illumination device includes a supporting base, and a light-emitting element inserted in the supporting base. The light-emitting element includes a substrate having a supporting surface and a side surface, a light-emitting chip disposed on the supporting surface, and a first wavelength conversion layer covering the light-emitting chip and only a portion of the supporting surface without covering the side surface.

Claims

1. An illumination device comprising:

a supporting base; and

a light-emitting element inserted in the supporting base, and comprising;

a substrate having a supporting surface and a side surface;

a light-emitting chip disposed on the supporting surface; and

a first wavelength conversion layer covering the light-emitting chip and only a portion of the supporting surface without covering the side surface.

2. The illumination device of claim 1, further comprising a first connecting conductor formed on the supporting surface and electrically connected to the light-emitting chip by a wire.

3. The illumination device of claim 2, wherein the first connecting conductor extends to an edge of the substrate.

4. The illumination device of claim 2, further comprising a second connecting conductor, wherein the first connecting conductor and the second connecting conductor are disposed at opposite sides of the light-emitting chip.

5. The illumination device of claim 1, wherein the supporting base has a socket for receiving the light-emitting element.

6. The illumination device of claim 1, wherein the supporting base is inclined with respect to the light-emitting element by an angle of 30°

-150°

.

7. The illumination device of claim 1, further comprising a second wavelength conversion layer, wherein the substrate further comprises a main surface opposite to the supporting surface and covered by the second wavelength conversion layer.

8. The illumination device of claim 7, wherein the first wavelength conversion layer and the second wavelength conversion layer have different areas.

9. The illumination device of claim 7, wherein the second wavelength conversion layer does not cover the side surface.

10. The illumination device of claim 1, further comprising a lamp housing enclosing the light-emitting element.

11. An illumination device comprising:

a supporting base; and

a light-emitting element inserted in the supporting base and comprising;

a substrate;

a plurality of light-emitting chips disposed on the supporting base, and having a first chip with a first end, and a last chip with a last end; and

a first connecting conductor disposed on the supporting base and extending beyond the first end.

12. The illumination device of claim 11, further comprising a wavelength conversion layer covering the plurality of light-emitting chips.

13. The illumination device of claim 12, wherein the first connecting conductor is longer than the wavelength conversion layer.

14. The illumination device of claim 12, wherein the wavelength conversion layer has an area less than that of the substrate.

15. The illumination device of claim 11, wherein the first connecting conductor extends to an edge of the substrate.

16. The illumination device of claim 11, wherein the supporting base has a socket for receiving the substrate.

17. The illumination device of claim 11, wherein the first connecting conductor is electrically connected to at least one of the plurality of light-emitting chips by a wire.

18. The illumination device of claim 11, further comprising a second connecting conductor disposed on the substrate and electrically connected to the plurality of light-emitting chips.

19. The illumination device of claim 11, further comprising a lamp housing enclosing the light-emitting element.

20. The illumination device of claim 19, further comprising a base connected to the lamp housing.