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Hybrid thermal foot and pen storage well

  • US 10,031,557 B1
  • Filed: 01/25/2017
  • Issued: 07/24/2018
  • Est. Priority Date: 01/25/2017
  • Status: Active Grant
First Claim
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1. A system, comprising:

  • a pen device; and

    an Information Handling System (IHS) enclosure comprising a thermal foot that protrudes from the bottom of the IHS enclosure and creates an air gap that allows heated air to escape from vents underneath the IHS enclosure, wherein the thermal foot comprises a cavity that includes a compartment for docking the pen device.

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  • 7 Assignments
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