Protective circuit substrate

• US 10,032,583 B2
• Filed: 02/17/2016
• Issued: 07/24/2018
• Est. Priority Date: 02/17/2016
• Status: Active Grant

• Current Assignee: Dexerials Corporation
• Original Assignee: Dexerials Corporation
• Inventors: Furuuchi, Yuji, Fujihata, Takashi, Mukai, Koichi
• Primary Examiner(s): Gandhi, Jayprakash N
• Assistant Examiner(s): SUL, STEPHEN SANGJIN
• Application Number:
  US15/045,584
• Publication Number:
  US 20170236665A1
• Time in Patent Office: 888 Days
• CPC Class Codes: H01H 2037/046 being soldered on the printed circuit to be protected
• CPC Class Codes: H01H 37/04 Bases; Housings; Mountings H01H37/5427 takes precedence
• CPC Class Codes: H01H 37/34 Means for transmitting heat thereto, e.g. capsule remote from contact member
• CPC Class Codes: H01H 37/761 with a fusible element forming part of the switched circuit H01H37/767 takes precedence
• CPC Class Codes: H01H 85/046 Fuses formed as printed circuits

Abstract

In a protective circuit substrate having a circuit substrate and a protective element, the protective element including: an insulating substrate; a heat-generating element; first and second electrodes laminated on the insulating substrate; a first and second connecting terminals provided on one side edge of a mounting surface to be mounted to the circuit substrate, the first connecting terminals being continuous with the first and second electrodes; a heat-generating element extracting electrode provided in a current path between the first and second electrodes and electrically connected to the heat-generating element; and a meltable conductor provided between the first and second electrodes, wherein the circuit substrate includes a region for mounting the protective element in which no electrode pattern other than a connecting electrode to the protective element is provided.

Claims

1. A protective circuit substrate having a circuit substrate and a protective element mounted on the circuit substrate, the protective element comprising:

an insulating substrate;

a heat-generating element formed on the insulating substrate;

a first and a second electrodes laminated on the insulating substrate;

a first connecting terminal provided on one side edge of a mounting surface of the insulating substrate to be mounted to the circuit substrate, the first connecting terminal being continuous with the first electrode;

a second connecting terminal provided on another side edge of the mounting surface, the second connecting terminal being continuous with the second electrode;

a heat-generating element extracting electrode provided in a current path between the first and second electrodes and electrically connected to the heat-generating element; and

a meltable conductor laminated on a region extending from the heat-generating element extracting electrode to the first and second electrodes and for interrupting the current path between the first electrode and the second electrode by being melted by heat;

wherein the circuit substrate includes a mounting region for mounting the protective element in which no electrode pattern other than a connecting electrode to the protective element is provided beneath the protective element,

wherein the circuit substrate has a first connecting electrode and a second connecting electrode respectively connected to the first and second connecting terminals,

wherein, outside a mounting region where the protective element is mounted, the first and second connecting electrodes have a first width equal to or wider than a width of the side edges of the insulating substrate on which the first and second connecting terminals are provided and, inside the mounting region, the first and second connecting electrodes have a second width narrower than the width of the side edges of the insulating substrate on which the first and second connecting terminals are provided.

2. The protective circuit substrate according to claim 1,

wherein the first width of the first and second connecting electrodes is wider than a width of the first and second connecting terminals.

3. The protective circuit substrate according to claim 1,

wherein the circuit substrate includes a dummy electrode provided outside the mounting region.

4. The protective circuit substrate according to claim 1,

wherein the circuit substrate is a multi-layered substrate, and conductive patterns are removed across one or more layers beneath the protective element.

5. The protective circuit substrate according to claim 1,

wherein, in the protective element, the first and second electrodes and the first and second connecting terminals are made continuous with each other via a through-hole formed on the central portion of a side edge on which the first and second electrodes are provided.