Double-side cooling type power module and producing method thereof
First Claim
1. A power module comprising:
- an upper substrate;
a lower substrate;
a first semiconductor chip and a second semiconductor chip disposed between the upper substrate and the lower substrate;
an output terminal lead disposed under a lower surface of the upper substrate, wherein the first and second semiconductor chips are electrically connected to the output terminal lead;
a first polarity terminal lead disposed over an upper surface of the lower substrate and electrically connected to the first semiconductor chip; and
a second polarity terminal lead disposed over the upper surface of the lower substrate and electrically connected to the second semiconductor chip,a first spacer formed between the first semiconductor chip and the output terminal lead such that the upper substrate, the output terminal lead, the first spacer, the first semiconductor chip, the first polarity terminal lead and the lower substrate are arranged in order, wherein the first spacer is braze-bonded to the output terminal lead whereas the first spacer is solder-bonded to the first semiconductor chip; and
a second spacer formed between the second semiconductor chip and the second polarity terminal lead such that the upper substrate, the output terminal lead, the second semiconductor chip, the second spacer and the second polarity terminal lead and the lower substrate are arranged in order, wherein the second spacer is braze-bonded to the second polarity terminal lead whereas the second spacer is solder-bonded to the second semiconductor chip.
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Accused Products
Abstract
Disclosed herein are a double-side cooling type power module and a producing method thereof. The double-side cooling type power module includes a pair of semiconductor chips disposed between an upper substrate and a lower substrate. The double-side cooling type power module includes output terminal leads configured to be disposed on a lower surface of the upper substrate and each connected to the pair of semiconductor chips, respectively; a plus terminal lead configured to be disposed at one side of an upper surface of the lower substrate to be connected to any one semiconductor chip selected from the pair of semiconductor chips; and a minus terminal lead configured to be disposed at the other side of the upper surface of the lower substrate to be connected to the other semiconductor chip of the pair of semiconductor chips.
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Citations
4 Claims
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1. A power module comprising:
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an upper substrate; a lower substrate; a first semiconductor chip and a second semiconductor chip disposed between the upper substrate and the lower substrate; an output terminal lead disposed under a lower surface of the upper substrate, wherein the first and second semiconductor chips are electrically connected to the output terminal lead; a first polarity terminal lead disposed over an upper surface of the lower substrate and electrically connected to the first semiconductor chip; and a second polarity terminal lead disposed over the upper surface of the lower substrate and electrically connected to the second semiconductor chip, a first spacer formed between the first semiconductor chip and the output terminal lead such that the upper substrate, the output terminal lead, the first spacer, the first semiconductor chip, the first polarity terminal lead and the lower substrate are arranged in order, wherein the first spacer is braze-bonded to the output terminal lead whereas the first spacer is solder-bonded to the first semiconductor chip; and a second spacer formed between the second semiconductor chip and the second polarity terminal lead such that the upper substrate, the output terminal lead, the second semiconductor chip, the second spacer and the second polarity terminal lead and the lower substrate are arranged in order, wherein the second spacer is braze-bonded to the second polarity terminal lead whereas the second spacer is solder-bonded to the second semiconductor chip. - View Dependent Claims (2, 3, 4)
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Specification