Substrate with topological features for steering fluidic assembly LED disks
First Claim
Patent Images
1. A method for forming a fluidic assembly direct-emission display panel, the method comprising:
- providing a substrate with a planar top surface and interconnect pads aligned in a plurality of parallel rows;
forming a first film overlying the substrate top surface;
forming a plurality of wells in the first film, each well having a cross-sectional opening, and aligned in a corresponding row and column, exposing a corresponding interconnect pad;
forming a second film overlying the first film; and
forming a plurality of parallel slots in the second film, where each slot has a width greater than the well cross-sectional opening, exposing a corresponding column of wells.
4 Assignments
0 Petitions
Accused Products
Abstract
Embodiments are related to integrated circuit (IC) fabrication and, more particularly, to a fluidic assembly process for the placement of light emitting diodes on a direct-emission display substrate.
12 Citations
7 Claims
-
1. A method for forming a fluidic assembly direct-emission display panel, the method comprising:
-
providing a substrate with a planar top surface and interconnect pads aligned in a plurality of parallel rows; forming a first film overlying the substrate top surface; forming a plurality of wells in the first film, each well having a cross-sectional opening, and aligned in a corresponding row and column, exposing a corresponding interconnect pad; forming a second film overlying the first film; and forming a plurality of parallel slots in the second film, where each slot has a width greater than the well cross-sectional opening, exposing a corresponding column of wells. - View Dependent Claims (2, 3, 4, 5, 6, 7)
-
Specification