Diode having vertical structure

• US 10,032,959 B2
• Filed: 03/06/2017
• Issued: 07/24/2018
• Est. Priority Date: 10/26/2001
• Status: Expired due to Term

• Current Assignee: Suzhou Lekin Semiconductor Company Limited
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: Yoo, Myung Cheol
• Primary Examiner(s): TRAN, MINH LOAN
• Application Number:
  US15/451,103
• Publication Number:
  US 20170365742A1
• Time in Patent Office: 505 Days
• Field of Search: None
• CPC Class Codes: H01L 33/0075 comprising nitride compounds
• CPC Class Codes: H01L 33/0093 Wafer bonding; Removal of the growth substrate
• CPC Class Codes: H01L 33/06 within the light emitting region, e.g. quantum confinement structure or tunnel barrier
• CPC Class Codes: H01L 33/10 with a light reflecting structure, e.g. semiconductor Bragg reflector
• CPC Class Codes: H01L 33/12 with a stress relaxation structure, e.g. buffer layer
• CPC Class Codes: H01L 33/32 containing nitrogen
• CPC Class Codes: H01L 33/325 characterised by the doping materials
• CPC Class Codes: H01L 33/405 Reflective materials
• CPC Class Codes: H01L 33/42 Transparent materials
• CPC Class Codes: H01L 33/46 Reflective coating, e.g. dielectric Bragg reflector
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01S 5/3013 AIIIBV compounds

Abstract

A light emitting device can include a GaN layer having a multilayer structure that can include an n-type layer, an active layer, and a p-type layer, the GaN layer having a first surface and a second surface; a conductive structure on the first surface of the GaN layer, the conductive structure includes a first electrode in contact with the first surface of the GaN layer, the first electrode is configured to reflect light from the active layer back through the second surface of the GaN layer; and a metal layer including Au, in which the metal layer serves as a first pad; a second electrode on the second surface of the GaN layer; and a second pad on the second electrode, in which a thickness of the second pad is about 0.5 μm or higher.

Claims

1. A light emitting device, comprising:

a GaN-based layer having a multilayer structure comprising an n-type layer, an active layer, and a p-type layer comprising aluminum, the GaN-based layer having a first surface and a second surface;

a first electrode including at least three layers on the first surface of the GaN-based layer; and

a second electrode and a pad on the second surface of the GaN-based layer,

wherein the active layer comprises AlInGaN,

wherein the first electrode includes Ni and Au,

wherein the second electrode and the pad include Cr and Au, and

wherein first and second layers of the first electrode have a same width and a third layer of the first electrode has a different width than the first and second layers.

2. The light emitting device according to claim 1, wherein the first electrode is overlapped with the second electrode and the pad in a first direction at a cross-sectional edge of the light emitting device, and

wherein the first direction is a thickness direction of the light emitting device.

3. The light emitting device according to claim 1, wherein the second electrode and the pad comprise a metal layer including the Au.

4. The light emitting device according to claim 3, wherein the metal layer is disposed at a bottom of the light emitting device.

5. The light emitting device according to claim 1, further comprising a buffer layer between the first surface of the GaN-based layer and the first electrode.

6. The light emitting device according to claim 5, wherein the buffer layer includes an n-GaN layer.

7. The light emitting device according to claim 1, wherein the n-type layer is doped with silicon with a doping concentration of 10¹⁷ cm⁻

3 or greater.

8. The light emitting device according to claim 1, wherein the p-type layer is doped with magnesium with a doping concentration of 10¹⁷ cm⁻

3 or greater.

9. The light emitting device according to claim 1, wherein the active layer includes 22% to 40% of indium composition.

10. The light emitting device according to claim 1, wherein the GaN-based layer further comprises a p-AlGaN layer.

11. A light emitting device, comprising:

a metal layer;

a reflective conductive layer on the metal layer, the reflective conductive layer serving as a first electrode;

a first-type GaN-based layer having a first surface on the reflective conductive layer;

an active layer on the first-type GaN-based layer, the active layer comprising AlInGaN;

a second-type GaN-based layer on the active layer;

a second electrode on a second surface of the second-type GaN-based layer; and

a pad on the second electrode,

wherein the second surface is opposite the first surface with respect to the active layer,

wherein the reflective conductive layer is configured such that the reflective conductive layer reflects light from the active layer back through the first surface, and

wherein a thickness of the pad is about 0.5 μ

m or higher.

12. The light emitting device according to claim 11, further comprising a cladding layer disposed between the first-type GaN-based layer and the second-type GaN-based layer.

13. The light emitting device according to claim 12, wherein the cladding layer comprises AlGaN.

14. The light emitting device according to claim 11, wherein the first type is n-type and the second type is p-type.

15. The light emitting device according to claim 11, further comprising an undoped gallium-nitride layer on the reflective conductive layer.

16. The light emitting device according to claim 15, wherein the undoped gallium-nitride layer is a buffer layer.

17. The light emitting device according to claim 15, wherein a thickness of the undoped gallium-nitride layer is 30 μ

m to 40 μ

m.