mmWave antennas and transmission lines on standard substrate materials
First Claim
1. A method comprising:
- disposing of a transmission line on an organic dielectric material on a microelectronic package substrate; and
retaining a portion of the dielectric material on which the transmission line is disposed while removing a portion of the dielectric material from a region adjoining the transmission line where the electromagnetic radiation from the transmission line is predetermined to be greater than another portion of the dielectric material,wherein the package substrate comprises a die mounted thereto.
1 Assignment
0 Petitions
Accused Products
Abstract
A method including disposing a transmission line or an antenna on dielectric material; and removing a portion of the dielectric material from a region adjoining the transmission line or the antenna where the electromagnetic radiation from the transmission line or the antenna is predetermined to be greater than another portion of the dielectric material. An apparatus including a package substrate including a transmission line coupled to an antenna, the transmission line and the antenna disposed on a dielectric layer including an organic dielectric material having a first dielectric constant and a second material having a dielectric constant less than the first dielectric constant, wherein the second dielectric material adjoins a portion of the transmission line or the antenna.
3 Citations
8 Claims
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1. A method comprising:
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disposing of a transmission line on an organic dielectric material on a microelectronic package substrate; and retaining a portion of the dielectric material on which the transmission line is disposed while removing a portion of the dielectric material from a region adjoining the transmission line where the electromagnetic radiation from the transmission line is predetermined to be greater than another portion of the dielectric material, wherein the package substrate comprises a die mounted thereto. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification