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mmWave antennas and transmission lines on standard substrate materials

  • US 10,033,093 B2
  • Filed: 12/27/2013
  • Issued: 07/24/2018
  • Est. Priority Date: 12/27/2013
  • Status: Active Grant
First Claim
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1. A method comprising:

  • disposing of a transmission line on an organic dielectric material on a microelectronic package substrate; and

    retaining a portion of the dielectric material on which the transmission line is disposed while removing a portion of the dielectric material from a region adjoining the transmission line where the electromagnetic radiation from the transmission line is predetermined to be greater than another portion of the dielectric material,wherein the package substrate comprises a die mounted thereto.

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