Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device

• US 10,033,913 B2
• Filed: 03/30/2017
• Issued: 07/24/2018
• Est. Priority Date: 03/12/2016
• Status: Active Grant

• Current Assignee: Ningbo Sunny Opotech Company Limited (Sunny Optical Technology (Group) Co., Ltd.)
• Original Assignee: Ningbo Sunny Opotech Company Limited (Sunny Optical Technology (Group) Co., Ltd.)
• Inventors: Wang, Mingzhu, Zhao, Bojie, Tanaka, Takehiko, Guo, Nan, Chen, Zhenyu, Jiang, Heng, Luan, Zhongyu, Xi, Fengsheng, Chen, Feifan, Ding, Liang
• Primary Examiner(s): SPINKS, ANTOINETTE T
• Application Number:
  US15/473,605
• Publication Number:
  US 20170264802A1
• Time in Patent Office: 481 Days
• CPC Class Codes: B29C 45/14639 for obtaining an insulating effect, e.g. for electrical components
• CPC Class Codes: B29L 2031/3481 Housings or casings incorporating or embedding electric or electronic elements
• CPC Class Codes: G02B 13/001 Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras G02B23/243 takes precedence
• CPC Class Codes: G02B 13/004 having four lenses
• CPC Class Codes: G02B 3/0075 characterized by non-optical structures, e.g. having integrated holding or alignment means
• CPC Class Codes: G02B 5/201 in the form of arrays
• CPC Class Codes: G02B 7/006 Filter holders
• CPC Class Codes: G02B 7/021 for more than one lens
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 27/14634 Assemblies, i.e. Hybrid structures
• CPC Class Codes: H01L 27/14636 Interconnect structures
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 27/14687 Wafer level processing
• CPC Class Codes: H01L 27/1469 Assemblies, i.e. hybrid integration
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H04N 23/45 for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
• CPC Class Codes: H04N 23/51 : Housings
• CPC Class Codes: H04N 23/54 : Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/55 : Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H05K 3/284 : for encapsulating mounted components H05K1/185 takes precedence

Abstract

An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.

Claims

1. An array imaging module, comprising:

at least two optical lenses; and

at least a molded photosensitive assembly, which comprises;

at least a circuit board which has two or more receiving chambers provided in a top lateral side thereof, wherein said circuit board comprises at least two sets of electronic elements electrically coupled at said circuit board outside said two or more receiving chambers respectively;

at least two photosensitive units, each having a photosensitive area and a non-photosensitive area provided on a top side thereof, electrically coupled at said circuit board, wherein at least one of said photosensitive units is received in at least one of said receiving chambers to reduce a height difference between said top lateral side of said circuit board and said top side of said photosensitive unit so as to reduce a thickness of said molded photosensitive assembly, wherein one or more connecting elements electrically connect said non-photosensitive areas of said at least two photosensitive units with said circuit board respectively;

a molded base integrally coupled at said circuit board to integrally encapsulate and enclose said electronic elements and said connecting elements therein to form an integrated body to prevent said electronic elements and connecting elements from exposing to outside and isolate said electronic elements and connecting elements with each other to prevent mutual interference therebetween, so as to reduce a distance between every two said electronic elements and said connecting elements and a thickness of said molded base to reduce a size of said molded photosensitive assembly, wherein said molded base has at least two optical windows formed therein to communicate and align with said at least two photosensitive units respectively to define at least two photosensitive paths for said at least two photosensitive units respectively, wherein said at least two optical windows are extended upwardly and outwardly from said two non-photosensitive areas of said at least two photosensitive units respectively, such that each of said optical windows is configured to have a tapered size that a cross section of each of said optical windows is gradually increased from bottom to top to prevent stray light reflection to said photosensitive unit, wherein said molded base is molded to have a flat top side adapted to install said at least two optical lenses thereon and located along said at least two photosensitive paths of said at least two photosensitive units respectively such that said at least two optical windows form at least two light channels between said photosensitive units and said optical lenses respectively so as to further reduce a thickness of said array imaging module while ensuring good light coaxial alignment of said optical lenses with said photosensitive units at the same time, wherein said molded base comprises at least two outer ring bodies molded on said circuit board to encircle two of said receiving chambers and said at least two photosensitive units respectively and a connecting body molded on said circuit board and mold-connected between said two outer ring bodies to form a reinforcing rib to enhance a rigidity of said circuit board and to spacedly separate said two outer ring bodies by said connecting body, wherein said two tapered optical windows are formed in said two outer ring bodies respectively to communicate with said photosensitive areas of said two photosensitive units respectively;

a base frame overlappedly coupled at said bottom lateral side of said circuit board so as to reinforce a strength of said circuit board, retain a flatness of said circuit board, and enhance heat dissipating of said circuit board and said photosensitive units; and

one or more light filters, wherein said top side of said molded base is molded to have one or more flat outer lateral top surfaces and one or more flat inner lateral top surfaces located below said one or more outer lateral top surfaces respectively to form step-ladder configuration and define one or more indention slots in said top side of said molded base, wherein said one or more light filters are coupled at said one or more inner lateral top surfaces within said one or more indention slots of said top side of said molded base and positioned above said optical windows and said photosensitive units, wherein said optical lenses are coupled at said outer lateral top surfaces to align with said light filters and said photosensitive areas of said photosensitive units along said two photosensitive paths to form said two light channels respectively, wherein said molded base further comprises one or more blocking protrusions protruded from said top side thereof, wherein each of said one or more blocking protrusions is a partition wall protruded between said inner lateral top surface and said outer lateral top surface for blocking adhesive applied on said outer lateral top surface of said molded base to adhere said respective optical lens from entering into said inner lateral top surface.

2. The array imaging module, as recited in claim 1, wherein at least one of said two or more receiving chambers is an indented groove indented in said top lateral side of said circuit board having a bottom surface and a depth less than a thickness of said circuit board.

3. The array imaging module, as recited in claim 2, wherein one end of each of said connecting elements is coupled at said bottom surface of said receiving chamber to electrically connected to said circuit board and another end of each of said connecting elements is electrically connected to said non-photosensitive area of at least one of said photosensitive units received in said receiving chamber, wherein said molded base is molded integrally into a gap between said photosensitive unit and said receiving chamber and to embed and enclose said connecting elements therein.

4. The array imaging module, as recited in claim 1, wherein said at least one of said one or more receiving chambers is a through hole extending through said circuit board and at least one of said photosensitive unit is received in said through hole, wherein one end of each of said connecting elements is electrically connected at said circuit board and another end of each of said connecting elements is electrically connected to said non-photosensitive area of said photosensitive unit received in said receiving chamber, wherein said molded base is molded integrally into a gap between said photosensitive unit and said receiving chamber and to embed and enclose said connecting elements therein.