Touch device and manufacturing method thereof
First Claim
1. A manufacturing method of a touch device, comprising:
- step (A1), providing a cover plate and a first substrate;
step (A2), forming a carrying structure on the first substrate, wherein the carrying structure includes a film;
step (A3), forming a plurality of first sensing electrodes on the carrying structure, wherein the first sensing electrodes and the cover plate are respectively located at two opposite sides of the carrying structure;
step (A4), forming a dielectric layer on the first sensing electrodes, wherein the dielectric layer and the film are respectively located at two opposite sides of the first sensing electrodes;
step (A5), forming a plurality of second sensing electrodes on the dielectric layer, wherein the first sensing electrodes and the second sensing electrodes are respectively located at two opposite sides of the dielectric layer;
step (A6), disposing a second substrate, wherein the second substrate and the dielectric layer are respectively located at two opposite sides of the second sensing electrodes; and
step (A7), removing the first substrate to form a structural assembly, wherein;
the cover plate is laminated to the film of the structural assembly, andthe manufacturing method further comprises;
step (D1), forming a first adhesive layer on a portion of a surface of the first substrate between the steps (A1) and (A2), wherein in the step (A2), the first adhesive layer is located between the film and the first substrate; and
step (D2), cutting along a periphery of the first adhesive layer between steps (A6) and (A7).
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Accused Products
Abstract
A touch device includes a cover plate, a carrying structure, a first sensor layer, a dielectric layer and a second sensor layer. The carrying structure is disposed on the cover plate and includes a film layer and a buffer layer stacked on each other. The film is located between the cover plate and the buffer layer. The first sensor layer is at least disposed on the carrying structure. The first sensor layer and the cover plate are respectively located at two opposite sides of the carrying structure. The dielectric layer is disposed on the first sensor layer. The dielectric layer and the carrying structure are respectively located at two opposite sides of the first sensor layer. The second sensor layer is at least disposed on the dielectric layer. The second sensor layer and the first sensor layer are respectively located at two opposite sides of the dielectric layer.
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Citations
15 Claims
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1. A manufacturing method of a touch device, comprising:
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step (A1), providing a cover plate and a first substrate; step (A2), forming a carrying structure on the first substrate, wherein the carrying structure includes a film; step (A3), forming a plurality of first sensing electrodes on the carrying structure, wherein the first sensing electrodes and the cover plate are respectively located at two opposite sides of the carrying structure; step (A4), forming a dielectric layer on the first sensing electrodes, wherein the dielectric layer and the film are respectively located at two opposite sides of the first sensing electrodes; step (A5), forming a plurality of second sensing electrodes on the dielectric layer, wherein the first sensing electrodes and the second sensing electrodes are respectively located at two opposite sides of the dielectric layer; step (A6), disposing a second substrate, wherein the second substrate and the dielectric layer are respectively located at two opposite sides of the second sensing electrodes; and step (A7), removing the first substrate to form a structural assembly, wherein; the cover plate is laminated to the film of the structural assembly, and the manufacturing method further comprises; step (D1), forming a first adhesive layer on a portion of a surface of the first substrate between the steps (A1) and (A2), wherein in the step (A2), the first adhesive layer is located between the film and the first substrate; and step (D2), cutting along a periphery of the first adhesive layer between steps (A6) and (A7). - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A manufacturing method of a touch device, comprising:
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step (A1), providing a cover plate and a first substrate, wherein the cover plate includes a mask layer; step (A2), forming a carrying structure on the first substrate, wherein; the carrying structure includes a film, and the mask layer is located between the cover plate and the film; step (A3), forming a plurality of first sensing electrodes on the carrying structure, wherein the first sensing electrodes and the cover plate are respectively located at two opposite sides of the carrying structure; step (A4), forming a dielectric layer on the first sensing electrodes, wherein; the dielectric layer is formed with a plurality of openings with positions corresponding to the first sensing electrodes, and the dielectric layer and the film are respectively located at two opposite sides of the first sensing electrodes; step (A5), forming a plurality of second sensing electrodes on the dielectric layer, wherein the first sensing electrodes and the second sensing electrodes are respectively located at two opposite sides of the dielectric layer; step (A6), disposing a second substrate, wherein the second substrate and the dielectric layer are respectively located at two opposite sides of the second sensing electrodes; and step (A7), removing the first substrate to form a structural assembly, wherein; the cover plate is laminated to the film of the structural assembly, and the manufacturing method further comprises; step (H1), forming a plurality of first wires and a plurality of second wires on the dielectric layer between the steps (A5) and (A6), wherein; positions of the first wires correspond to the mask layer, the first wires extend through the openings to be respectively connected to the first sensing electrodes, positions of the second wires correspond to the mask layer, and the second wires are respectively connected to the second sensing electrodes. - View Dependent Claims (12, 13, 14, 15)
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Specification