Ion filter and method of manufacturing same
First Claim
1. An ion filter used for an electron multiplier, the ion filter comprising:
- an insulating substrate;
a first conductive layer formed on one main surface of the insulating substrate; and
a second conductive layer formed on another main surface of the insulating substrate,the ion filter having a plurality of through-holes formed along a thickness direction of the insulating substrate,wherein the one main surface of the insulating substrate is disposed at a downstream side in a moving direction of electrons in a chamber of the electron multiplier and the other main surface of the insulating substrate is disposed at an upstream side in the moving direction of electrons in the chamber of the electron multiplier,wherein a first thickness of the first conductive layer formed on the one main surface of the insulating substrate is thicker than a second thickness of the second conductive layer on the other main surface of the insulating substrate.
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Accused Products
Abstract
An ion filter used for an electron multiplier includes an insulating substrate; a first conductive layer formed on one main surface of the substrate; and a second conductive layer formed on another main surface of the substrate. The ion filter has a plurality of through-holes formed along a thickness direction of the substrate. The one main surface of the substrate is disposed at a downstream side in a moving direction of electrons in a chamber of the electron multiplier and the other main surface of the substrate is disposed at an upstream side in the moving direction of electrons in the chamber of the electron multiplier. A first thickness of the first conductive layer formed on the one main surface of the substrate is thicker than a second thickness of the second conductive layer on the other main surface of the substrate.
8 Citations
7 Claims
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1. An ion filter used for an electron multiplier, the ion filter comprising:
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an insulating substrate; a first conductive layer formed on one main surface of the insulating substrate; and a second conductive layer formed on another main surface of the insulating substrate, the ion filter having a plurality of through-holes formed along a thickness direction of the insulating substrate, wherein the one main surface of the insulating substrate is disposed at a downstream side in a moving direction of electrons in a chamber of the electron multiplier and the other main surface of the insulating substrate is disposed at an upstream side in the moving direction of electrons in the chamber of the electron multiplier, wherein a first thickness of the first conductive layer formed on the one main surface of the insulating substrate is thicker than a second thickness of the second conductive layer on the other main surface of the insulating substrate. - View Dependent Claims (2, 3, 4, 5)
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6. A method of manufacturing an ion filter, the method comprising:
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preparing a substrate comprising an insulating substrate, a conductive layer formed on one main surface of the insulating substrate, and a conductive layer formed on another main surface of the insulating substrate and having a thickness thinner than that of the conductive layer formed on the one main surface; forming a first conductive layer having a predetermined pattern by removing predetermined regions of the conductive layer formed on the one main surface; removing regions of the insulating substrate corresponding to the predetermined regions by irradiation of laser from a side of the one main surface or by etching using etchant from the side of the one main surface; and removing regions of the conductive layer formed on the other main surface by etching using etchant on the conductive layer from both surface sides of the substrate from which the predetermined regions are removed, the regions of the conductive layer formed on the other main surface corresponding to the predetermined regions.
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7. A method of manufacturing an ion filter, the method comprising:
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preparing a substrate comprising an insulating substrate, a conductive layer formed on one main surface of the insulating substrate, and a conductive layer formed on another main surface of the insulating substrate and having a thickness thinner than that of the conductive layer formed on the one main surface; forming a first conductive layer having a predetermined pattern by removing predetermined regions of the conductive layer formed on the one main surface; removing regions of the insulating substrate corresponding to the predetermined regions by irradiation of laser from a side of the one main surface or by etching using etchant from the side of the one main surface; covering with an etching resist a surface of the conductive layer formed on the other main surface of the insulating substrate; and removing regions of the conductive layer formed on the other main surface by etching using etchant on the conductive layer from the side of the one main surface of the substrate from which the predetermined regions are removed, the regions of the conductive layer formed on the other main surface corresponding to the predetermined regions.
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Specification