Plasma processing apparatus
First Claim
1. A plasma processing apparatus comprising:
- a processing chamber disposed inside a vacuum vessel;
a first high-frequency power supply outputting a first high-frequency power for supplying an electric field to generate a plasma for use in processing a sample to be processed inside the processing chamber;
a sample stage disposed inside the processing chamber, on an upper surface of which the sample is placed;
a second high-frequency power supply intermittently outputting a second high-frequency power for generating a bias potential to an electrode disposed inside the sample stage so that a waveform of the second high-frequency power is synchronized with a reference cyclical signal and capable of variably adjusting the output time, anda controller configured to adjust operation of the plasma processing apparatus using a result of detection of a temporal change in a waveform of current or voltage in a transient state of the second high-frequency power, the temporal change in the waveform in the transient state of the second high-frequency power being synchronized with a start of the intermittent output of the second high-frequency power and being detected by comparing, with each other, a plurality of waveforms of current or voltage which are detected in a predetermined time length in the transient state of the second high-frequency power.
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Accused Products
Abstract
The plasma processing apparatus includes: a processing chamber disposed inside a vacuum vessel; a first high-frequency power supply outputting a first high-frequency power for supplying an electric field to generate a plasma for use in processing a sample to be processed inside the processing chamber; a sample stage disposed inside the processing chamber with the sample placed on an upper surface thereof; a second high-frequency power supply intermittently outputting a second high-frequency power for generating a bias potential to an electrode disposed inside the sample stage and capable of variably adjusting the output time; and a function to adjust operation of the plasma processing apparatus using a result of detection of a temporal change in waveform of current or voltage in a transient state of the second high-frequency power in synchronism with start of the intermittent output of the second high-frequency power.
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Citations
11 Claims
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1. A plasma processing apparatus comprising:
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a processing chamber disposed inside a vacuum vessel; a first high-frequency power supply outputting a first high-frequency power for supplying an electric field to generate a plasma for use in processing a sample to be processed inside the processing chamber; a sample stage disposed inside the processing chamber, on an upper surface of which the sample is placed; a second high-frequency power supply intermittently outputting a second high-frequency power for generating a bias potential to an electrode disposed inside the sample stage so that a waveform of the second high-frequency power is synchronized with a reference cyclical signal and capable of variably adjusting the output time, and a controller configured to adjust operation of the plasma processing apparatus using a result of detection of a temporal change in a waveform of current or voltage in a transient state of the second high-frequency power, the temporal change in the waveform in the transient state of the second high-frequency power being synchronized with a start of the intermittent output of the second high-frequency power and being detected by comparing, with each other, a plurality of waveforms of current or voltage which are detected in a predetermined time length in the transient state of the second high-frequency power. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A plasma processing apparatus comprising:
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a processing chamber disposed inside a vacuum vessel; a first high-frequency power supply outputting a first high-frequency power for supplying an electric field to generate plasma for use in processing a sample to be processed inside the processing chamber; a sample stage disposed inside the processing chamber, on an upper surface of which the sample is placed; a second high-frequency power supply outputting a second high-frequency power for generating a bias potential to an electrode disposed inside the sample stage so that a waveform of the second high-frequency power is synchronized with a reference cyclical signal and capable of variably adjusting ON time and OFF time of the output or a ratio thereof, and a controller configured to adjust operation of the plasma processing apparatus using a result of detection of a temporal change in waveform of current or voltage in a transient state of the second high-frequency power, the temporal change in the waveform in the transient stage of the second high-frequency power being synchronized with a start of an ON period of the second high-frequency power and being detected by comparing, with each other, a plurality of waveforms of current or voltage which are detected in a predetermined time length in the transient state of the second high-frequency power. - View Dependent Claims (8, 9, 10, 11)
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Specification