Circuit board structure and manufacturing method thereof

• US 10,039,184 B2
• Filed: 02/08/2017
• Issued: 07/31/2018
• Est. Priority Date: 11/30/2016
• Status: Active Grant

• Current Assignee: Unimicron Technology Corporation
• Original Assignee: Unimicron Technology Corporation
• Inventors: Wu, Ming-Hao, Liu, Wen-Fang
• Primary Examiner(s): Chen, Xiaoliang
• Application Number:
  US15/427,061
• Publication Number:
  US 20180153036A1
• Time in Patent Office: 538 Days
• Field of Search: 174250, 174251, 174254, 174255, 174257-264, 174266, 361746, 361749, 361753, 361762-764, 361767, 361792, 257700, 257702
• CPC Class Codes: H05K 1/111 Pads for surface mounting, e.g. lay-out
• CPC Class Codes: H05K 1/115 Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 2201/0376 Flush conductors, i.e. flush with the surface of the printed circuit
• CPC Class Codes: H05K 2203/0228 Cutting, sawing, milling or shearing
• CPC Class Codes: H05K 2203/025 Abrading, e.g. grinding or sand blasting
• CPC Class Codes: H05K 3/0044 Mechanical working of the substrate, e.g. drilling or punching H05K3/0008 takes precedence
• CPC Class Codes: H05K 3/3452 Solder masks
• CPC Class Codes: H05K 3/4697 having cavities, e.g. for mounting components H05K3/4691 takes precedence

Abstract

A circuit board structure includes an inner circuit structure and a first build-up circuit structure. The inner circuit structure includes a core layer having an upper surface and a lower surface opposite to each other, a first patterned circuit layer disposed on the upper surface, a second patterned circuit layer disposed on the lower surface and a conductive via connecting the first and the second patterned circuit layers. The first build-up circuit structure is disposed on the upper surface of the core layer and covers the first patterned circuit layer, wherein the first build-up circuit structure at least has a cavity, the cavity exposes a portion of the first patterned circuit layer and a cross-sectional profile of an edge of a top surface of the portion of the first patterned circuit layer exposed by the cavity is a curved surface.

Claims

1. A circuit board structure, comprising:

an inner circuit structure, comprising a core layer having an upper surface and a lower surface opposite to each other, a first patterned circuit layer disposed on the upper surface, a second patterned circuit layer disposed on the lower surface, and a conductive via connecting the first patterned circuit layer and the second patterned circuit layer; and

a first build-up circuit structure, disposed on the upper surface of the core layer and covering the first patterned circuit layer, wherein the first build-up circuit structure at least has a cavity, the cavity exposes a portion of the first patterned circuit layer, and a cross-sectional profile of an edge of a top surface of the portion of the first patterned circuit layer exposed by the cavity is a curved surface,

wherein the first build-up circuit structure further comprises an inner dielectric layer, at least a first dielectric layer, at least a first patterned conductive layer, and at least a first conductive via structure penetrating through the inner dielectric and the first dielectric layer, the first patterned conductive layer and the first dielectric layer are sequentially stacked on the inner dielectric layer, the first patterned conductive layer is electrically connected to the first patterned circuit layer via the first conductive via structure,

wherein the cavity further exposes a portion of the inner dielectric layer, the inner dielectric layer comprises a first inner surface and a second inner surface, the first inner surface is higher than the second inner surface, the cavity exposes the second inner surface, and the top surface of the portion of the first patterned circuit layer exposed by the cavity is higher than the second inner surface.

2. The circuit board structure as recited in claim 1, wherein the cavity further exposes a portion of the core layer of the inner circuit structure, the upper surface of the core layer comprises a first upper surface and a second upper surface, the cavity exposes the first upper surface, the second upper surface is higher than the first upper surface, and the top surface of the portion of the first patterned circuit layer exposed by the cavity is higher than the first upper surface.

3. The circuit board structure as recited in claim 1, wherein the cavity further exposes a portion of the upper surface of the portion of the core layer of the inner circuit structure, and a bottom surface of the portion of the first patterned circuit layer exposed by the cavity is aligned with the portion of the upper surface of the core layer.

4. The circuit board structure as recited in claim 1, wherein the portion of the first patterned circuit layer exposed by the cavity comprises at least a pad, at least a circuit or a combination thereof.

5. The circuit board structure as recited in claim 1, further comprising:

a first patterned solder mask layer, at least disposed on a first surface of the first build-up circuit structure relatively far away from the inner circuit structure and the portion of the first patterned circuit layer exposed by the cavity.

6. A circuit board structure, comprising:

an inner circuit structure, comprising a core layer having an upper surface and a lower surface opposite to each other, a first patterned circuit layer disposed on the upper surface, a second patterned circuit layer disposed on the lower surface, and a conductive via connecting the first patterned circuit layer and the second patterned circuit layer; and

a first build-up circuit structure, disposed on the upper surface of the core layer and covering the first patterned circuit layer, wherein the first build-up circuit structure at least has a cavity, the cavity exposes a portion of the first patterned circuit layer, and a cross-sectional profile of an edge of a top surface of the portion of the first patterned circuit layer exposed by the cavity is a curved surface,

wherein the first build-up circuit structure further comprises an inner dielectric layer, at least a first dielectric layer, at least a first patterned conductive layer, and at least a first conductive via structure penetrating through the inner dielectric layer and the first dielectric layer, the first patterned conductive layer and the first dielectric layer are sequentially stacked on the inner dielectric layer, the first patterned conductive layer is electrically connected to the first patterned circuit layer via the first conductive via structure,

wherein the cavity further exposes a portion of the inner dielectric layer, the inner dielectric layer comprises a first inner surface and a second inner surface, the first inner surface is higher than the second inner surface, the cavity exposes the second inner surface, and the top surface of the portion of the first patterned circuit layer exposed by the cavity is aligned with the second inner surface.