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Circuit board structure and manufacturing method thereof

  • US 10,039,184 B2
  • Filed: 02/08/2017
  • Issued: 07/31/2018
  • Est. Priority Date: 11/30/2016
  • Status: Active Grant
First Claim
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1. A circuit board structure, comprising:

  • an inner circuit structure, comprising a core layer having an upper surface and a lower surface opposite to each other, a first patterned circuit layer disposed on the upper surface, a second patterned circuit layer disposed on the lower surface, and a conductive via connecting the first patterned circuit layer and the second patterned circuit layer; and

    a first build-up circuit structure, disposed on the upper surface of the core layer and covering the first patterned circuit layer, wherein the first build-up circuit structure at least has a cavity, the cavity exposes a portion of the first patterned circuit layer, and a cross-sectional profile of an edge of a top surface of the portion of the first patterned circuit layer exposed by the cavity is a curved surface,wherein the first build-up circuit structure further comprises an inner dielectric layer, at least a first dielectric layer, at least a first patterned conductive layer, and at least a first conductive via structure penetrating through the inner dielectric and the first dielectric layer, the first patterned conductive layer and the first dielectric layer are sequentially stacked on the inner dielectric layer, the first patterned conductive layer is electrically connected to the first patterned circuit layer via the first conductive via structure,wherein the cavity further exposes a portion of the inner dielectric layer, the inner dielectric layer comprises a first inner surface and a second inner surface, the first inner surface is higher than the second inner surface, the cavity exposes the second inner surface, and the top surface of the portion of the first patterned circuit layer exposed by the cavity is higher than the second inner surface.

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