Stretchable and flexible electrical substrate interconnections

• US 10,039,186 B2
• Filed: 09/16/2016
• Issued: 07/31/2018
• Est. Priority Date: 09/16/2016
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Baxi, Amit Sudhir, Mageshkumar, Vincent S., Elsherbini, Adel A., Oster, Sasha, Eid, Feras, Aleksov, Aleksandar, Swan, Johanna M.
• Primary Examiner(s): Sawyer, Steven T
• Application Number:
  US15/267,872
• Publication Number:
  US 20180084643A1
• Time in Patent Office: 683 Days
• Field of Search: 439 37, 439638
• CPC Class Codes: A61B 2562/164 the sensor is mounted in or on a conformable substrate or carrier
• CPC Class Codes: A61B 2562/166 the sensor is mounted on a specially adapted printed circuit board
• CPC Class Codes: A61B 5/00 Measuring for diagnostic purposes radiation diagnosis A61B6/00; diagnosis by ultrasonic, sonic or infrasonic waves A61B8/00; Identification of persons
• CPC Class Codes: A61B 5/6833 Adhesive patches
• CPC Class Codes: H05K 1/0283 Stretchable printed circuits
• CPC Class Codes: H05K 1/112 directly combined with via connections
• CPC Class Codes: H05K 1/147 at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit H05K1/148 takes precedence
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/10151 Sensor
• CPC Class Codes: H05K 2201/10265 Metallic coils or springs, e.g. as part of a connection element
• CPC Class Codes: H05K 2201/10303 Pin-in-hole mounted pins
• CPC Class Codes: H05K 2201/10318 Surface mounted metallic pins
• CPC Class Codes: H05K 3/365 by abutting, i.e. without alloying process

Abstract

A circuit interconnect may be used in biometric data sensing and feedback applications. A circuit interconnect may be used in device device-to-device connections (e.g., Internet of Things (IoT) devices), including applications that require connection between stretchable and rigid substrates. A circuit interconnect may include a multi-pin, snap-fit attachment mechanism, where the attachment mechanism provides an electrical interconnection between a rigid substrate and a flexible or stretchable substrate. The combination of a circuit interconnect and flexible or stretchable substrate provides improved electrical connection reliability, allows for greater stretchability and flexibility of the circuit traces, and allows for more options in connecting a stretchable circuit trace to a rigid PCB.

Claims

1. An apparatus comprising:

a stretchable substrate;

a first plurality of substrate contacts disposed on a first side of the stretchable substrate;

a biometric sensor disposed on the stretchable substrate and electrically connected to at least one of the first plurality of substrate contacts;

a first molded connector portion disposed on the first side of the stretchable substrate, the first molded connector portion including a first plurality of contact pins in electrical contact with the first plurality of substrate contacts; and

a second molded connector portion disposed on a second side of the stretchable substrate and mechanically connected to the first molded connector portion, the second molded connector portion exerting pressure on the stretchable substrate to increase the electrical conductivity between the first plurality of contact pins and the first plurality of substrate contacts.

2. The apparatus of 1, further including a first plurality of contact traces in electrical contact with the first plurality of substrate contacts.

3. The apparatus of 1, wherein each of the first plurality of contact pins includes a first spring-loaded conductive portion to increase the electrical conductivity between the first plurality of contact pins and the first plurality of substrate contacts.

4. The apparatus of 1, further including a first rigid PCB disposed on and electrically connected to the first molded connector portion.

5. The apparatus of 4, further including a first plurality of electronic components disposed on and electrically connected to the first rigid PCB.

6. The apparatus of 1, further including a compressive insert disposed between the second molded connector portion and the stretchable substrate, the compressive insert to exert pressure on the stretchable substrate to increase the electrical conductivity between the first plurality of contact pins and the first plurality of substrate contacts.

7. The apparatus of 1, further including a connector locking pin to provide a detachable mechanical connection between the second molded connector portion and the first molded connector portion.

8. The apparatus of 1, further including a hinged junction between the second molded connector portion and the first molded connector portion, the hinged junction to facilitate separating the second molded connector portion from the first molded connector portion to facilitate installation or removal of the stretchable substrate.

9. A method comprising:

disposing a first plurality of substrate contacts on a first side of a stretchable substrate;

disposing a biometric sensor on the stretchable substrate;

electrically connecting the biometric sensor to at least one of the first plurality of substrate contacts;

disposing a first molded connector portion on the first side of the stretchable substrate such that a first plurality of contact pins within the first molded connector portion are in electrical contact with the first plurality of substrate contacts;

disposing a second molded connector portion a second side of the stretchable substrate; and

mechanically connecting the second molded connector portion to the first molded connector portion, the second molded connector portion exerting pressure on the stretchable substrate to increase an electrical conductivity between the first plurality of contact pins and the first plurality of substrate contacts.

10. The method of 9, further including disposing a first rigid PCB on the first molded connector portion.

11. At least one machine-readable storage medium, comprising a plurality of instructions that, responsive to being executed with processor circuitry of a computer-controlled device, cause the computer-controlled device to:

dispose a first plurality of substrate contacts on a first side of a stretchable substrate;

dispose a biometric sensor on the stretchable substrate;

electrically connect the biometric sensor to at least one of the first plurality of substrate contacts

dispose a first molded connector portion on the first side of the stretchable substrate such that a first plurality of contact pins within the first molded connector portion are in electrical contact with the first plurality of substrate contacts;

dispose a second molded connector portion a second side of the stretchable substrate; and

mechanically connect the second molded connector portion to the first molded connector portion, the second molded connector portion exerting pressure on the stretchable substrate to increase an electrical conductivity between the first plurality of contact pins and the first plurality of substrate contacts.

12. The at least one machine-readable storage medium of 11, the instructions further causing the computer-controlled device to electrically connect the biometric sensor to at least one of a first plurality of contact traces, the first plurality of contact traces in electrical contact with the first plurality of substrate contacts.

13. The at least one machine-readable storage medium of 11, the instructions further causing the computer-controlled device to dispose a first rigid PCB on the first molded connector portion.

14. The method of 9, further including disposing a first molded connector portion on the first side of the stretchable substrate such that a first plurality of contact pins within the first molded connector portion are in electrical contact with the first plurality of substrate contacts, wherein each of the first plurality of contact pins includes a first spring-loaded conductive portion to increase the electrical conductivity between the first plurality of contact pins and the first plurality of substrate contacts.

15. The method of 9, further including disposing a compressive insert between the second molded connector portion and the stretchable substrate, the compressive insert to exert pressure on the stretchable substrate to increase the electrical conductivity between the first plurality of contact pins and the first plurality of substrate contacts.

16. The method of 9, further including securing a connector locking pin to provide a detachable mechanical connection between the second molded connector portion and the first molded connector portion.

17. The at least one machine-readable storage medium of 11, the instructions further causing the computer-controlled device to dispose a first molded connector portion on the first side of the stretchable substrate such that a first plurality of contact pins within the first molded connector portion are in electrical contact with the first plurality of substrate contacts, wherein each of the first plurality of contact pins includes a first spring-loaded conductive portion to increase the electrical conductivity between the first plurality of contact pins and the first plurality of substrate contacts.

18. The at least one machine-readable storage medium of 11, the instructions further causing the computer-controlled device to dispose a compressive insert between the second molded connector portion and the stretchable substrate, the compressive insert to exert pressure on the stretchable substrate to increase the electrical conductivity between the first plurality of contact pins and the first plurality of substrate contacts.

19. The at least one machine-readable storage medium of 11, the instructions further causing the computer-controlled device to secure a connector locking pin to provide a detachable mechanical connection between the second molded connector portion and the first molded connector portion.