Pressure-sensitive adhesive strip for moisture-insensitive peelable adhesive bonds
First Claim
1. A method of separating two substrates bonded in a bond plane with a redetachable, pressure-sensitive adhesive strip, the adhesive strip bonded between the two substrates, comprising:
- a) a core layer which has a breaking extension of at least 300%,b) an outer carrier layer which has a breaking extension of not more than 120% and which is connected to the core layer such that it separates from the core layer when the core layer is extensionally stretched, andc) a first adhesive layer which is applied to the side of the outer carrier layer that is opposite the side connected to the core layer;
the method comprising;
stretching the core layer in the bond plane, starting from a region which has been made nonadhesive, until the core layer releases from the outer carrier layer so that the two substrates are separated from one another and at least one of the two substrates remains bonded to the outer carrier layer via the first adhesive layer, andpeeling the outer carrier layer together with the first adhesive layer from the other substrate at an angle of removal of greater than 45°
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Accused Products
Abstract
A method of separating two substrates bonded with a redetachable, at least single-sidedly pressure-sensitive adhesive strip composed at least of a) a core layer which has a breaking extension of at least 300%, b) an outer carrier layer which has a breaking extension of not more than 120% and which at least sectionally is connected to the core layer such that it separates from the core layer when the latter is extensionally stretched, and c) a first adhesive layer which is applied at least sectionally to the side of the outer carrier layer that is opposite the side connected to the core layer, in which the core layer is stretched in the direction of the bond plane, starting from a region which has been made nonadhesive, until the core layer releases from at least one of the outer carrier layers so that the two substrates are separated from one another.
38 Citations
15 Claims
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1. A method of separating two substrates bonded in a bond plane with a redetachable, pressure-sensitive adhesive strip, the adhesive strip bonded between the two substrates, comprising:
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a) a core layer which has a breaking extension of at least 300%, b) an outer carrier layer which has a breaking extension of not more than 120% and which is connected to the core layer such that it separates from the core layer when the core layer is extensionally stretched, and c) a first adhesive layer which is applied to the side of the outer carrier layer that is opposite the side connected to the core layer; the method comprising; stretching the core layer in the bond plane, starting from a region which has been made nonadhesive, until the core layer releases from the outer carrier layer so that the two substrates are separated from one another and at least one of the two substrates remains bonded to the outer carrier layer via the first adhesive layer, and peeling the outer carrier layer together with the first adhesive layer from the other substrate at an angle of removal of greater than 45°
. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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Specification