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Woven signal-routing substrate for wearable electronic devices

  • US 10,041,195 B2
  • Filed: 01/06/2016
  • Issued: 08/07/2018
  • Est. Priority Date: 07/07/2015
  • Status: Active Grant
First Claim
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1. An article of manufacture comprising a woven layer, comprising:

  • a plurality of insulative warps having a first thickness interleaved with and parallel to a plurality of conductive warps having a second thickness that is less than the first thickness of the insulative warps;

    a plurality of insulative wefts interleaved with and parallel to a plurality of conductive wefts, wherein the warps are woven with the wefts; and

    one or more woven electrical cross-connections, each comprising at least one conductive warp physically contacting at least one conductive weft, wherein;

    the relative thicknesses between the insulative warps and the conductive warps enable at least one conductive warp to cross at least one conductive weft without making physical contact at an intersection not having an electrical cross-connection.

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