Ultrasonic device, probe, electronic device, and ultrasonic imaging apparatus
First Claim
1. An ultrasonic device comprising:
- a base which defines a plurality of openings disposed in an array, and in which a base layer is formed and arranged respectively corresponding to each one of the openings;
an interconnect layer which is a conductor, and is formed on the base layer in a thickness direction of the base;
an insulating film that is formed on the interconnect layer in the thickness direction of the base, the insulating film and the base layer establishing a laminated structure to form a vibrating film, the insulating film and the base layer sandwiching the interconnect layer therebetween;
a plurality of piezoelectric elements that are separated from the interconnect layer by the insulating film, the piezoelectric elements each including a first electrode and a second electrode that sandwich a piezoelectric film on the insulating film; and
a through conductor that passes through the insulating film in the thickness direction of the base, and connects at least one of the first electrode and the second electrode to the conductor constituting the interconnect layer.
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Accused Products
Abstract
An ultrasonic device includes a base in which a base layer of a vibrating film is formed in every opening that is disposed in an array; an interconnect layer, which is a conductor, formed on the base layer; an insulating film that is formed on the interconnect layer, and forms a laminated structure with respect to the base layer; a plurality of piezoelectric elements that are separated from the interconnect layer by the insulating film, the piezoelectric elements each including a first electrode and a second electrode that sandwich a piezoelectric film on the insulating film; and a through conductor that passes through the insulating film, and connects at least one of the first electrode and the second electrode to the conductor constituting the interconnect layer.
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Citations
7 Claims
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1. An ultrasonic device comprising:
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a base which defines a plurality of openings disposed in an array, and in which a base layer is formed and arranged respectively corresponding to each one of the openings; an interconnect layer which is a conductor, and is formed on the base layer in a thickness direction of the base; an insulating film that is formed on the interconnect layer in the thickness direction of the base, the insulating film and the base layer establishing a laminated structure to form a vibrating film, the insulating film and the base layer sandwiching the interconnect layer therebetween; a plurality of piezoelectric elements that are separated from the interconnect layer by the insulating film, the piezoelectric elements each including a first electrode and a second electrode that sandwich a piezoelectric film on the insulating film; and a through conductor that passes through the insulating film in the thickness direction of the base, and connects at least one of the first electrode and the second electrode to the conductor constituting the interconnect layer. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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Specification
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- Resources
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Current AssigneeSeiko Epson Corporation (Seiko Group)
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Original AssigneeSeiko Epson Corporation (Seiko Group)
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InventorsKiyose, Kanechika, Matsuda, Hiroshi, Nakanishi, Daisuke
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Primary Examiner(s)Alsomiri, Isam A
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Assistant Examiner(s)Armstrong, Jonathan D
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Application NumberUS14/495,145Publication NumberTime in Patent Office1,413 DaysField of Search367140US Class CurrentCPC Class CodesA61B 8/4494 characterised by the arrang...B06B 1/0629 Square arrayG01S 15/8925 the array being a two-dimen...G01S 7/52017 particularly adapted to sho...H10N 30/101 with electrical and mechani...
