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Packaged microelectronic device for a package-on-package device

  • US 10,043,779 B2
  • Filed: 11/16/2016
  • Issued: 08/07/2018
  • Est. Priority Date: 11/17/2015
  • Status: Active Grant
First Claim
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1. A method for forming a packaged microelectronic device, comprising:

  • forming interconnect structures in and coupled to an outer region of a redistribution layer of the packaged microelectronic device;

    providing a microelectronic device in and coupled to an inner region of a redistribution layer of the packaged microelectronic device inside the outer region;

    forming a dielectric layer surrounding at least portions of shafts of the interconnect structures and along sides of the microelectronic device; and

    the interconnect structures having first ends thereof protruding above an upper surface of the dielectric layer a distance and having second ends thereof coupled to the redistribution layer, the first ends and the second ends corresponding thereto facing away from one another.

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