Surface-textured encapsulations for use with light emitting diodes

• US 10,043,957 B2
• Filed: 08/01/2016
• Issued: 08/07/2018
• Est. Priority Date: 02/11/2010
• Status: Active Grant

• Current Assignee: Bridgelux Incorporated
• Original Assignee: Bridgelux Incorporated
• Inventors: Xu, Tao
• Primary Examiner(s): Raabe, Christopher
• Application Number:
  US15/225,752
• Publication Number:
  US 20160343919A1
• Time in Patent Office: 736 Days
• Field of Search: 362330, 362332, 362339
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 27/156 two-dimensional arrays
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 2933/0091 Scattering means in or on the semiconductor body or semiconductor body package H01L33/22 takes precedence
• CPC Class Codes: H01L 33/48 characterised by the semiconductor body packages
• CPC Class Codes: H01L 33/502 Wavelength conversion materials
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

Surface-textured encapsulations for use with light emitting diodes. In an aspect, a light emitting diode (LED) array apparatus includes a plurality of LEDs mounted to a substrate and an encapsulation covering the LEDs and having a surface texturing configured to extract light, wherein the surface texturing is includes at least one light extracting feature having a diameter larger than two or more of the LEDs.

Claims

1. A light emitting diode (LED) array apparatus comprising:

a plurality of LEDs mounted to a substrate; and

an encapsulation comprising a plurality of regions, the encapsulation covering the plurality of LEDs and each region of the encapsulation having a different surface texture texturing configured to extract light, wherein the each surface texture texturing comprises one or more light extracting features;

wherein the light extracting features have varying dimensions.

2. The apparatus of claim 1, wherein each of the one or more light extracting features has a diameter that is greater than 1 millimeter.

3. The apparatus of claim 1, wherein each of the one or more light extracting features has a diameter less than 50 millimeters.

4. The apparatus of claim 1, wherein one or more light extracting features comprises first and second light extracting features having respective diameters larger than two or more of the LEDs.

5. The apparatus of claim 4, wherein the respective diameters of the first and second light extracting features are either the same or different.

6. The apparatus of claim 4, wherein each of the first and second light extracting features are selected from a set of features comprising hemispheres, cones, pyramids, and random shapes.

7. The apparatus of claim 1, wherein said encapsulation comprises at least one material selected from silicone and phosphor.

8. The apparatus of claim 1, wherein said encapsulating is formed using a process selected from a set of processes comprising stamping, molding, pattern transferring, and thin film deposition.

9. The apparatus of claim 1, wherein the one or more light extracting features is selected from a set comprising hemispheres, cones, pyramids, and random shapes.

10. The apparatus of claim 1, wherein said encapsulation has an overall shape that is substantially flat.

11. The apparatus of claim 1, wherein said encapsulation has an overall shape that is domed wherein a center portion is higher than side portions.

12. A method for forming a light emitting diode (LED) array apparatus comprising:

mounting a plurality of LEDs to a substrate; and

encapsulating the plurality of LEDs with an encapsulation comprising a plurality of regions, each region of the encapsulation having a different surface texture texturing configured to extract light, wherein each the surface texture texturing comprises one or more light extracting features;

wherein the light extracting features have varying dimensions.

13. The method of claim 12, wherein said encapsulating comprises forming the surface texture using at least one process selected from a set of processes comprising stamping, molding, pattern transferring, and thin film deposition.

14. The method of claim 12, further comprising selecting the plurality of light extracting features from a set of features comprising hemispheres, cones, pyramids, and random shapes.

15. The method of claim 12 further comprising configuring the plurality of light extracting features to comprises first and second light extracting features having respective diameters larger than two or more of the LEDs.

16. The method of claim 15, further comprising setting the respective diameters of the first and second light extracting features to be either the same or different.

17. The method of claim 12, wherein said encapsulating comprises encapsulating at least one of the plurality of light extracting feature so that the diameter is greater than 1 millimeter.

18. The method of claim 12, wherein said encapsulating comprises encapsulating at least one of the plurality of light extracting feature so that the diameter is less than 50 millimeters.

19. The method of claim 12, wherein said encapsulating encapsulation comprises encapsulating the plurality of LEDs with at least one material selected from silicone and phosphor.

20. A lamp having a light emitting diode (LED) array apparatus comprising:

a package;

a plurality of LEDs mounted to a substrate; and

an encapsulation comprising a plurality of regions, the encapsulation covering the plurality of LEDs and with each region of the encapsulation having a different surface texture texturing configured to extract light, wherein the each surface texture texturing comprises one or more light extracting features;

wherein the light extracting features have varying dimensions.