Light emitting diode (LED) packages and related methods

• US 10,043,960 B2
• Filed: 11/15/2011
• Issued: 08/07/2018
• Est. Priority Date: 11/15/2011
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Andrews, Peter Scott, Britt, Jeffrey Carl
• Primary Examiner(s): Malek, Maliheh
• Application Number:
  US13/296,812
• Publication Number:
  US 20130119417A1
• Time in Patent Office: 2,457 Days
• Field of Search: 257 13, 257 79, 257 88, 257 98, 257703, 257724, 257E33056, 257E23009, 438 26- 28
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12032 Schottky diode
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/641 characterized by the materials
• CPC Class Codes: H05K 1/0269 for visual or optical inspection
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 2201/0338 Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer etched tri-metal structure H05K2201/0361
• CPC Class Codes: H05K 2201/09036 Recesses or grooves in insulating substrate recess in metallic substrate H05K2201/09745
• CPC Class Codes: H05K 2201/09227 Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/2054 Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
• CPC Class Codes: H05K 3/06 the conductive material being removed chemically or electrolytically, e.g. by photo-etch process semi-additive methods H05K3/108
• CPC Class Codes: H05K 3/16 by cathodic sputtering

Abstract

Light emitting diode (LED) packages and methods are disclosed herein. In one aspect, a light emitting package is disclosed. The light emitting package includes one or more areas of conductive material having a thickness of less than approximately 50 microns (μm). The package can further include at least one light emitting diode (LED) electrically connected to the conductive material and at least one thin gap disposed between areas of conductive material.

Claims

1. A light emitting package comprising:

a first area and a second area of conductive material; and

a plurality of light emitting diode (LED) chips electrically connected to one or more of the first and second areas of conductive material,

wherein the first and second areas are each divided into a plurality of interlocked traces via a plurality of gaps,

wherein the first area is substantially circular,

wherein the second area is substantially ring shaped and is disposed outside a circumference of the first area,

wherein each trace of the plurality of traces comprises a substantially uniform thickness of approximately 25 microns (μ

m) or less, and

wherein each gap of the plurality of gaps comprises a width that is approximately equal to the thickness of each trace of the plurality of traces.

2. The light emitting package of claim 1, further comprising a submount, the submount comprising a ceramic material.

3. The light emitting package of claim 2, wherein the ceramic material comprises aluminum nitride (AlN).

4. The light emitting package of claim 1, wherein the conductive material comprises copper (Cu).

5. The light emitting package of claim 1, wherein each gap of the plurality of gaps comprises a depth approximately equal to the thickness of the plurality of traces.

6. The light emitting package of claim 1, wherein the first and second areas of conductive material comprise a thickness of approximately 20 μ

m.

7. The light emitting package of claim 2, wherein the first and second areas of conductive material cover approximately 70 percent (%) or more of a surface area of the submount.

8. The light emitting package of claim 1, wherein the first and second areas of conductive material comprise a thickness of approximately 10 μ

m or less.

9. The light emitting package of claim 8, wherein each gap comprises a depth of approximately 10 μ

m or less.

10. The light emitting package of claim 1, wherein the first and second areas of conductive material comprise a range of thickness from approximately 3 μ

m to approximately 5 μ

m.

11. The light emitting package of claim 10, wherein each gap comprises a depth ranging from approximately 3 μ

m to approximately 5 μ

m.

12. The light emitting package of claim 1, wherein a reflective material is at least partially disposed over the first and second areas of conductive material.

13. The light emitting package of claim 12, wherein the reflective material comprises silver (Ag).

14. The light emitting package of claim 1, wherein each gap comprises a width of approximately 4 to 100 percent (%) of the thickness of each LED chip.

15. The light emitting package of claim 1, wherein each gap comprises a width of less than approximately 25 percent (%) of the length of each LED chip.

16. The light emitting package of claim 1, wherein each gap comprises a width of less than approximately 20 percent (%) of the width of each LED chip.

17. The light emitting package of claim 1, further comprising electrically conductive vias.

18. A light emitting package comprising:

a ceramic submount;

at least a first electrically conductive trace and a second electrically conductive trace disposed on and contacting the submount, wherein each of the first and second traces comprises a substantially uniform thickness measuring approximately 25 microns (μ

m) or less, the second trace comprising an outer portion in a substantially ring shape disposed outside a periphery of the first trace;

one or more light emitting diodes (LEDs) at least partially disposed over the first trace; and

at least one gap disposed between the first and second traces, the gap comprising a width measuring approximately 25 μ

m or less,

wherein the first trace is divided into a plurality of interlocked traces via the at least one gap.

19. The light emitting package of claim 18, wherein the ceramic submount comprises aluminum nitride (AlN).

20. The light emitting package of claim 18, wherein the gap comprises a depth approximately equal to the thickness of the first and second traces.

21. The light emitting package of claim 18, wherein the first and second traces comprise a thickness of approximately 20 μ

m.

22. The light emitting package of claim 18, comprising a plurality of LEDs disposed over some of the traces.

23. The light emitting package of claim 18, wherein the first and second traces comprise a thickness of approximately 10 μ

m or less.

24. The light emitting package of claim 23, wherein the gap comprises a depth of approximately 10 μ

m or less.

25. The light emitting package of claim 18, wherein the first and second traces comprise a range of thickness from approximately 3 μ

m to approximately 5 μ

m.

26. The light emitting package of claim 25, wherein the gap comprises a depth ranging from approximately 3 μ

m to approximately 5 μ

m.

27. The light emitting package of claim 18, wherein a reflective material is at least partially disposed over the first and second traces.

28. The light emitting package of claim 27, wherein the reflective material comprises silver (Ag).

29. The light emitting package of claim 18, wherein the first and second traces comprise copper (Cu).

30. The light emitting package of claim 18, wherein the gap width ranges from approximately 4 to 100 percent (%) of a thickness of the one or more LEDs.

31. The light emitting package of claim 18, wherein the gap width is less than approximately 25 percent (%) of a length of the one or more LEDs.

32. The light emitting package of claim 18, wherein the gap width is less than approximately 20 percent (%) of a width of the one or more LEDs.

33. The light emitting package of claim 18, further comprising electrically conductive vias.