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Wire splicing device, wire splicing method, and method for manufacturing splice structure

  • US 10,044,176 B2
  • Filed: 01/06/2017
  • Issued: 08/07/2018
  • Est. Priority Date: 05/28/2013
  • Status: Active Grant
First Claim
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1. A wire splicing method comprising:

  • disposing an end portion of a tape-like first wire and an end portion of a tape-like second wire in a holding base in an overlapping manner with solder interposed therebetween,pressing a heating body to the first wire and the second wire via a pressing plate, and pressing together and heating the first wire and the second wire so as to melt the solder;

    keeping the first wire and the second wire pressed together by the pressing plate;

    separating the heating body from the pressing plate; and

    cooling the pressing plate to solidify the solder, and thereby connecting the first wire and the second wire together.

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