EMI filtered co-connected hermetic feedthrough, feedthrough capacitor and leadwire assembly for an active implantable medical device

• US 10,046,166 B2
• Filed: 05/26/2016
• Issued: 08/14/2018
• Est. Priority Date: 01/16/2012
• Status: Active Grant

• Current Assignee: Greatbatch Limited (Greatbatch Incorporated)
• Original Assignee: Greatbatch Limited (Greatbatch Incorporated)
• Inventors: Stevenson, Robert A., Marzano, Thomas, Seitz, Keith W., Frysz, Christine A.
• Primary Examiner(s): Thomas, Eric
• Application Number:
  US15/164,945
• Publication Number:
  US 20160263384A1
• Time in Patent Office: 810 Days
• CPC Class Codes: A61N 1/05 for implantation or insertion into the body, e.g. heart electrode A61N1/06 takes precedence
• CPC Class Codes: A61N 1/0551 Spinal or peripheral nerve electrodes
• CPC Class Codes: A61N 1/0563 specially adapted for defibrillation or cardioversion
• CPC Class Codes: A61N 1/372 Arrangements in connection with the implantation of stimulators
• CPC Class Codes: A61N 1/37512 Pacemakers
• CPC Class Codes: A61N 1/3754 Feedthroughs
• CPC Class Codes: C22C 29/12 based on oxides
• CPC Class Codes: C22C 32/0015 with only single oxides as main non-metallic constituents
• CPC Class Codes: H01G 2/103 Sealings, e.g. for lead-in wires; Covers
• CPC Class Codes: H01G 4/005 Electrodes
• CPC Class Codes: H01G 4/12 Ceramic dielectrics H01G4/085 takes precedence
• CPC Class Codes: H01G 4/35 Feed-through capacitors or anti-noise capacitors
• CPC Class Codes: H01G 4/40 Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
• CPC Class Codes: H01R 43/00 Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors of trolley lines B60M1/28
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/09 Use of materials for the conductive, e.g. metallic pattern
• CPC Class Codes: H05K 1/095 for polymer thick films, i.e. having a permanent organic polymeric binder
• CPC Class Codes: H05K 1/115 Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 3/4038 Through-connections; Vertical interconnect access [VIA] connections H05K3/403, H05K3/42 take precedence
• CPC Class Codes: H05K 3/4061 for via connections in inorganic insulating substrates
• CPC Class Codes: H05K 5/066 : sealed by fusion of the joining parts without bringing material; sealed by brazing
• CPC Class Codes: Y10T 156/1052 : with cutting, punching, tearing or severing

Abstract

A hermetically sealed feedthrough filter assembly is attachable to an active implantable medical device and includes an insulator substrate assembly and a feedthrough filter capacitor disposed on a device side. A conductive leadwire has a proximal leadwire end extending to a distal leadwire end, wherein the proximal leadwire end is connectable to electronics internal to the AIMD. The distal leadwire end is disposed at least partially through a first passageway of the feedthrough filter capacitor and is in contact with, adjacent to or near a device side conductive fill. A first electrically conductive material makes a three-way electrically connection that electrically connects the device side conductive fill to an internal metallization of the feedthrough filter capacitor and to the distal leadwire end. A second electrically conductive material electrically connects an external metallization of the feedthrough filter capacitor to a ferrule or an AIMD housing.

Claims

1. A hermetically sealed feedthrough filter assembly attachable to an active implantable medical device (AIMD), the feedthrough filter assembly comprising:

a) an insulator substrate assembly, comprising;

i) an insulator body separating a first side from a second side;

ii) a via hole disposed through the insulator body extending from the first side to the second side;

iii) a conductive fill disposed within the via hole forming a filled via electrically conductive between the first side and the second side;

iv) a first hermetic seal between the filled via and the insulator body;

b) a ferrule, comprising;

i) a conductive ferrule body defining a ferrule opening;

ii) a second hermetic seal between the insulator body and the conductive ferrule body, wherein the ferrule opening is hermetically sealed by the insulator body;

c) a feedthrough filter capacitor disposed on the second side, the feedthrough filter capacitor comprising;

i) an active electrode plate disposed parallel and spaced from a ground electrode plate, wherein the plates are disposed within a capacitor dielectric substrate;

ii) a first passageway disposed through the capacitor dielectric substrate and disposed perpendicular to the plates;

iii) an internal metallization disposed within the first passageway electrically connected to the active electrode plate and in non-conductive relation with the ground electrode plate;

iv) an external metallization disposed on an outside surface of the capacitor dielectric substrate and electrically connected to the ground electrode plate and in non-conductive relation with the active electrode plate;

d) a conductive leadwire having a proximal leadwire end extending to a distal leadwire end, wherein the proximal leadwire end is connectable to electronics internal to the AIMD, and wherein the distal leadwire end is disposed at least partially through the first passageway of the feedthrough filter capacitor and is in contact with or adjacent to the second side conductive fill;

e) a first electrically conductive material forming at least a three-way electrical connection electrically connecting the second side conductive fill to the internal metallization of the feedthrough filter capacitor and to the distal leadwire end; and

f) a second electrically conductive material electrically connecting the external metallization of the feedthrough filter capacitor to the ferrule.

2. The feedthrough filter assembly of claim 1, wherein the first electrically conductive material is selected from the group consisting of a solder, a solder BGA, a solder paste, an epoxy, and a polyimide.

3. The feedthrough filter assembly of claim 1, wherein the first hermetic seal has a leak rate no greater than 1×

10<sup>−

7</sup> std cc He/sec.

4. The feedthrough filter assembly of claim 1, wherein the conductive fill of the filled via comprises a substantially closed pore and fritless platinum fill.

5. The feedthrough filter assembly of claim 4, wherein the first hermetic seal comprises a tortuous and mutually conformal knitline between the via hole and the platinum fill.

6. The feedthrough filter assembly of claim 5, wherein the knitline comprises a glass that is at least about 60% silica.

7. The feedthrough filter assembly of claim 1, wherein the insulator body comprises at least 96% alumina.

8. The feedthrough filter assembly of claim 1, wherein the insulator body comprises at least 99% alumina.

9. The feedthrough filter assembly of claim 1, including an adhesion metallization disposed on an outer surface of the insulator body.

10. The feedthrough filter assembly of claim 9, including a wetting metallization disposed on the adhesion metallization.

11. The feedthrough filter assembly of claim 10, wherein the second hermetic seal comprises a gold braze, wherein the gold braze connects between the wetting metallization and the conductive ferrule body.

12. The feedthrough filter assembly of claim 11, wherein the second hermetic seal has a leak rate no greater than 1×

10<sup>−

7</sup> std cc He/sec.

13. The feedthrough filter assembly of claim 11, wherein the second electrically conductive material is in contact with the gold braze of the second hermetic seal.

14. The feedthrough filter assembly of claim 1, wherein an insulative washer is disposed between the insulator substrate assembly and the feedthrough filter capacitor.

15. The feedthrough filter assembly of claim 1, wherein the via hole extending through the insulator body to the first side and second side is staggered.

16. The feedthrough filter assembly of claim 1, wherein the ferrule is configured to be joined to an AIMD housing by a laser weld or braze.

17. The feedthrough filter assembly of claim 1, wherein the ferrule is formed from and as a continuous part of an AIMD housing.

18. The feedthrough filter assembly of claim 1, wherein the first side is a body fluid side and the second side is a device side.

19. The feedthrough filter assembly of claim 1, wherein at least the proximal leadwire end is provided with a pre-tin layer selected from the group consisting of tin, solder, silver, and gold.

20. A hermetically sealed feedthrough filter assembly attachable to an active implantable medical device (AIMD), the feedthrough filter assembly comprising:

a) an alumina insulator substrate assembly, comprising;

i) an alumina insulator body defining and separating a body fluid side from a device side;

ii) a via hole disposed through the alumina insulator body extending from the body fluid side to the device side;

iii) a conductive fill disposed within the via hole forming a filled via electrically conductive between the device side and the body fluid side;

iv) a first hermetic seal between the filled via and the alumina insulator body, the first hermetic seal having a having a leak rate no greater than 1×

10<sup>−

7</sup> std cc He/sec;

v) an insulator metallization disposed on an outer surface of the alumina insulator body;

b) a ferrule, comprising;

i) a conductive ferrule body defining a ferrule opening;

ii) a second hermetic seal between the insulator metallization of the alumina insulator body and the conductive ferrule body, wherein the second hermetic seal comprises a gold braze, and wherein the ferrule opening is hermetically sealed having a leak rate no greater than 1×

10<sup>−

7</sup> std cc He/sec;

c) a feedthrough filter capacitor disposed on the device side, the feedthrough filter capacitor comprising;

i) at least one active electrode plate disposed parallel and spaced from at least one ground electrode plate, wherein the plates are disposed within a capacitor dielectric substrate;

ii) a first passageway disposed through the capacitor dielectric substrate and disposed perpendicular to the plates;

iii) an internal metallization disposed within the first passageway electrically connected to the at least one active electrode plate and in non-conductive relation with the at least one ground electrode plate;

iv) an external metallization disposed on an outside surface of the capacitor dielectric substrate and electrically connected to the at least one ground electrode plate and in non-conductive relation with the at least one active electrode plate;

d) a conductive leadwire having a proximal leadwire end extending to a distal leadwire end, wherein the proximal leadwire end is connectable to electronics internal to the AIMD, and wherein the distal leadwire end is disposed at least partially through the first passageway of the feedthrough filter capacitor and is in contact with or adjacent to the device side conductive fill;

e) a first electrically conductive material forming at least a three-way electrical connection electrically connecting the device side conductive fill to the internal metallization of the feedthrough filter capacitor and to the distal leadwire end; and

f) a second electrically conductive material electrically connecting the external metallization of the feedthrough filter capacitor to the ferrule.

21. The feedthrough filter assembly of claim 20, wherein the ferrule is formed from and as a continuous part of an AIMD housing.

22. The feedthrough filter assembly of claim 20, wherein the ferrule is configured to be joined to an AIMD housing by a laser weld or braze.

23. The feedthrough filter assembly of claim 20, wherein the first electrically conductive material is selected from the group consisting of a solder, a solder BGA, a solder paste, an epoxy, and a polyimide.

24. The feedthrough filter assembly of claim 20, wherein the insulator metallization comprises an adhesion metallization disposed on the outer surface of the insulator body and a wetting metallization disposed on the adhesion metallization.

25. The feedthrough filter assembly of claim 20, wherein the second electrically conductive material is in contact with the gold braze of the second hermetic seal.

26. The feedthrough filter assembly of claim 20, wherein at least the proximal leadwire end is provided with a pre-tin layer selected from the group consisting of tin, solder, silver, and gold.

27. A feedthrough filter assembly attachable to a ferrule or a housing of an active implantable medical device (AIMD), the feedthrough filter assembly comprising:

a) an insulator substrate assembly, comprising;

i) an insulator body separating a first side from a second side;

ii) a via hole disposed through the insulator body extending from the first side to the second side;

iii) a conductive fill disposed within the via hole forming a filled via electrically conductive between the first side and the second side;

iv) a first hermetic seal between the filled via and the insulator body;

b) a feedthrough filter capacitor disposed on the second side, the feedthrough filter capacitor comprising;

i) an active electrode plate disposed parallel and spaced from a ground electrode plate, wherein the plates are disposed within a capacitor dielectric substrate;

ii) a first passageway disposed through the capacitor dielectric substrate and disposed perpendicular to the plates;

iii) an internal metallization disposed within the first passageway electrically connected to the active electrode plate and in non-conductive relation with the ground electrode plate;

iv) an external metallization disposed on an outside surface of the capacitor dielectric substrate and electrically connected to the ground electrode plate and in non-conductive relation with the active electrode plate;

c) a conductive leadwire having a proximal leadwire end extending to a distal leadwire end, wherein the proximal leadwire end is connectable to electronics internal to the AIMD, and wherein the distal leadwire end is disposed at least partially through the first passageway of the feedthrough filter capacitor and is in contact with or adjacent to second side conductive fill;

d) a first electrically conductive material forming at least a three-way electrical connection electrically connecting the second side conductive fill to the internal metallization of the feedthrough filter capacitor and to the distal leadwire end.

28. The feedthrough filter assembly of claim 27, wherein at least the proximal leadwire end is provided with a pre-tin layer selected from the group consisting of tin, solder, silver, and gold.

29. A method for forming a feedthrough filter assembly, comprising the steps of:

a) providing an electrically conductive ferrule comprising a ferrule opening, wherein the ferrule is configured to be attachable to an opening in a housing of an active implantable medical device;

b) forming an insulator substrate assembly, comprising;

i) an insulator body separating a first side from a second side, wherein the insulator body at least partially resides in the ferrule opening;

ii) a via hole disposed through the insulator body extending from the first side to the second side;

iii) a conductive fill disposed within the via hole forming a filled via electrically conductive between the first side and the second side;

iv) a first hermetic seal between the filled via and the insulator body; and

v) a second hermetic seal hermetically and electrically connecting the insulator body to the ferrule;

c) forming a feedthrough filter capacitor, comprising;

i) an active electrode plate disposed parallel and spaced from a ground electrode plate, wherein the plates are disposed within a capacitor dielectric substrate;

ii) a first passageway disposed through the capacitor dielectric substrate and disposed perpendicular to the plates;

iii) an internal metallization disposed within the first passageway electrically connected to the active electrode plate and in non-conductive relation with the ground electrode plate;

iv) an external metallization disposed on an outside surface of the capacitor dielectric substrate and electrically connected to the ground electrode plate and in non-conductive relation with the active electrode plate;

d) forming a conductive leadwire having a proximal leadwire end extending to a distal leadwire end, wherein the proximal leadwire end is connectable to electronics internal to the AIMD;

e) disposing a first electrically conductive material on the second side conductive fill of the insulator substrate assembly and/or on the internal metallization of the feedthrough filter capacitor;

f) placing the insulator substrate assembly adjacent to the feedthrough filter capacitor wherein the first electrically conductive material is between the second side conductive fill of the insulator substrate assembly and the internal metallization of the feedthrough filter capacitor;

g) inserting the distal leadwire end at least partially through an exposed end of the first passageway of the feedthrough filter capacitor, wherein the distal leadwire end is in contact with or adjacent to the second side conductive fill; and

h) forming at least a three-way electrical connection with the first electrically conductive material, the first electrically conductive material electrically connecting the second side conductive fill to the internal metallization of the feedthrough filter capacitor and to the distal leadwire end.

30. The method of claim 29, including selecting the first electrically conductive material from the group consisting of a solder, a solder BGA, a solder paste, an epoxy, and a polyimide.

31. The method of claim 29, including providing at least the proximal leadwire end with a pre-tin layer selected from the group consisting of tin, solder, silver, and gold.

32. A hermetically sealed and internally grounded feedthrough filter assembly attachable to an active implantable medical device (AIMD), the feedthrough filter assembly comprising:

a) an alumina insulator substrate assembly, comprising;

i) an alumina insulator body defining and separating a body fluid side from a device side;

ii) a grounded via hole disposed through the alumina insulator body extending from the body fluid side to the device side;

iii) a conductive fill disposed within the grounded via hole forming a grounded filled via electrically conductive between the device side and the body fluid side;

iv) a first hermetic seal between the grounded filled via and the alumina insulator body, the first hermetic seal having a having a leak rate no greater than 1×

10<sup>−

7</sup> std cc He/sec;

v) an insulator metallization disposed on an outer surface of the alumina insulator body;

vi) at least one grounded insulator electrode plate disposed within the alumina insulator body, the at least one grounded insulator electrode plate electrically connected to the insulator metallization and the grounded filled via;

b) a ferrule configured to be connectable to a housing of the AIMD, the ferrule comprising;

i) a conductive ferrule body defining a ferrule opening;

ii) a second hermetic seal between the insulator metallization of the alumina insulator body and the conductive ferrule body, wherein the second hermetic seal comprises a gold braze, and wherein the ferrule opening is hermetically sealed having a leak rate no greater than 1×

10<sup>−

7</sup> std cc He/sec;

c) a feedthrough filter capacitor disposed on the device side, the feedthrough filter capacitor comprising;

i) at least one active electrode plate disposed parallel and spaced from at least one ground electrode plate, wherein the plates are disposed within a capacitor dielectric substrate;

ii) a first passageway disposed through the capacitor dielectric substrate and disposed perpendicular to the plates;

iii) an internal metallization disposed within the first passageway electrically connected to the at least one ground electrode plate and in non-conductive relation with the at least one active electrode plate;

d) a conductive leadwire having a proximal leadwire end extending to a distal leadwire end, wherein the proximal leadwire end is connectable to electronics internal to the AIMD, and wherein the distal leadwire end is disposed at least partially through the first passageway of the feedthrough filter capacitor and is in contact with or adjacent to the device side grounded filled via; and

e) a first electrically conductive material forming at least a three-way electrical connection electrically connecting the device side grounded filled via to the internal metallization of the feedthrough filter capacitor and to the distal leadwire end.

33. The feedthrough filter assembly of claim 32, wherein the first electrically conductive material is selected from the group consisting of a solder, a solder BGA, a solder paste, an epoxy, and a polyimide.

34. The feedthrough filter assembly of claim 32, wherein at least the proximal leadwire end is provided with a pre-tin layer selected from the group consisting of tin, solder, silver, and gold.