MEM relay assembly for calibrating automated test equipment

• US 10,048,348 B2
• Filed: 08/05/2015
• Issued: 08/14/2018
• Est. Priority Date: 08/05/2015
• Status: Active Grant

• Current Assignee: Teradyne Incorporated
• Original Assignee: Teradyne Incorporated
• Inventors: Hussey, Alan
• Primary Examiner(s): Nguyen, Vincent Q
• Application Number:
  US14/819,213
• Publication Number:
  US 20170038453A1
• Time in Patent Office: 1,105 Days
• Field of Search: 324601, 324637-650
• CPC Class Codes: G01R 31/2834 Automated test systems [ATE]; using microprocessors or computers G01R31/317 takes precedence; ATE for detection of defective computer hardware G06F11/2736
• CPC Class Codes: G01R 31/3191 Calibration
• CPC Class Codes: G01R 31/31917 Stimuli generation or application of test patterns to the device under test [DUT]
• CPC Class Codes: G01R 35/005 Calibrating; Standards or reference devices, e.g. voltage or resistance standards, "golden" references G01R33/0035, G01R35/002 take precedence
• CPC Class Codes: H01H 59/0009 making use of micromechanics

Abstract

Apparatus and methods for calibrating tester channels of an automated test system. A relay matrix assembly including a plurality of microelectromechanical (MEM) switches may be used to connect a plurality of tester channels to an analyzer calibration instrument rapidly without requiring serial, robotic probing of the test channels. The relay matrix assembly may be constructed on a printed circuit board that can be attached to an interface on the tester. Calibration parameters for the test channels may be calculated from waveforms received through the relay matrix assembly and that have been corrected to remove waveform distortion introduced by the relay matrix assembly. Parameters to correct for distortion in the relay matrix assembly may be measured in advance and stored for use when calibration is to be performed.

Claims

1. A method for calibrating a plurality of tester channels of an automated test equipment, the method comprising:

connecting inputs of a relay matrix assembly to a plurality of tester channel contacts of the plurality of tester channels, wherein the relay matrix assembly comprises a plurality of microelectromechanical (MEM) relays configured to form a plurality of paths between the inputs of the relay matrix assembly and an output of the relay matrix assembly; and

successively actuating portions of the MEM relays of the plurality of MEM relays to successively connect tester channels of the plurality of tester channels to a calibration instrument coupled to the output of the relay matrix assembly,

measuring with the calibration instrument, a first waveform at the output connector, the waveform passing from a first tester channel through a first path of the plurality of paths; and

adjusting the first waveform, based on measured parameters of the first path, and

computing calibration parameters for the first channel based on the adjusted waveform.

2. The method of claim 1, wherein adjusting the first waveform, based on measured parameters of the first path, comprises accessing over a network a computing device storing previously derived calibration parameters for the relay matrix assembly to obtain calibration parameters based on measured parameters of the first path.

3. The method of claim 1, wherein actuating the MEM relay to connect the first tester channel is done in less than approximately 0.1 ms.

4. The method of claim 1, wherein the connecting the relay matrix assembly to the plurality of tester channel contacts comprises physically contacting at least a first plurality of the tester channel contacts to a second plurality of input contacts of the relay matrix assembly.

5. The method of claim 4, wherein connecting to the plurality of tester channel contacts are disposed in at least one region having a contact density greater than 32 contacts per square inch.

6. A method for calibrating a plurality of tester channels of an automated test equipment with a relay matrix assembly comprising a plurality of microelectromechanical (MEM) relays configured to form a plurality of paths between the inputs of the relay matrix assembly and an output of the relay matrix assembly, the method comprising:

measuring signal distortion in the plurality of paths, wherein measuring signal distortion comprises measuring S parameters of the plurality of paths;

computing calibration parameters for each of the plurality of paths based on the measured signal distortion, wherein computing calibration parameters comprises computing calibration parameters based on at least one clipped S parameter, and wherein the at least one clipped S parameter comprises an S₂₁ parameter assigned a constant value above a threshold frequency; and

storing, in computer readable media, the computed calibration parameters.

7. The method of claim 6, wherein the computing the calibration parameters comprises determining a transfer function for each of the plurality of paths.

8. The method of claim 6, wherein computing calibration parameters comprises computing an inverse transfer function from the at least one clipped S parameter.

9. The method of claim 6, wherein the relay matrix assembly comprises an M×

N MEM switch, where M is an integer greater than 1 and N is an integer equal to or greater than 1.

10. A relay matrix assembly for calibrating a plurality of tester channels of an automated test system, the relay matrix assembly comprising:

a printed circuit board; and

a plurality of relay matrix modules having a plurality of microelectromechanical (MEM) relays, the plurality of relay matrix modules being arranged on the printed circuit board and configured to enable connection of any one of M input contacts of the relay matrix assembly with any one of N output contacts of the relay matrix assembly,

wherein;

the relay matrix modules have inputs connected to contacts on the printed circuit board;

the contacts on the printed circuit board are arranged in a plurality of localized regions having a contact density of greater than 64 contacts per square inch, and the relay matrix modules are mounted to the printed circuit board such that inputs of at least two of the relay matrix modules are connected to contacts on the printed circuit board in a localized region of the localized regions.

11. The relay matrix assembly of claim 10, wherein a portion of the at least two of the relay matrix modules connected to contacts on the printed circuit board overlays the localized region.

12. The relay matrix assembly of claim 10, wherein the density of the M input contacts is greater than 32 per square inch in a plurality of localized regions.

13. The relay matrix assembly of claim 10, wherein each of the MEM relays has a switching time of less than 0.1 ms.

14. The relay matrix assembly of claim 10, further comprising computer readable medium storing numerical calibration parameters for a plurality of paths through the relay matrix assembly formed by selective activation of MEM relays, wherein the calibration parameters, when applied to a waveform transmitted through a path of the plurality of paths, compensates for waveform distortion introduced by the path.

15. The relay matrix assembly of claim 10, wherein the printed circuit board comprises a high-speed printed circuit board configured to transmit digital signals at data rates greater than 10 Gb/s.