High resistivity metal fan out
First Claim
1. A touch sensor panel comprising:
- a substrate including a plurality of first bond pads and a plurality of second bond pads and having a first side and a second side, the first side opposite the second side;
one or more columns formed from a first layer of a first conductive material disposed along the first side of the substrate and electrically coupled to the plurality of first bond pads;
one or more rows formed from a second layer of the first conductive material disposed along the second side of the substrate and electrically coupled to the plurality of second bond pads,wherein the plurality of first bond pads and the plurality of the second bond pads are located to reduce stray capacitance; and
a flex circuit comprising;
a first portion bonded to the plurality of first bond pads to electrically couple to the one or more columns, anda second portion bonded to the plurality of second bond pads to electrically couple to the one or more rows,wherein the plurality of first bond pads and the plurality of second bond pads are located in different locations along a plane of the substrate.
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Accused Products
Abstract
A touch sensor panel having column traces that can terminate at a short edge of a substrate is disclosed. A flex circuit can have a wide flex circuit portion extending the full width of the short edge that can bond to the bond pads on the top side of the substrate. It can be undesirable to have column traces (e.g., sense lines) and row traces (e.g., drives lines) cross over each other at the bonding area, and it can also be undesirable to have bond pads formed on directly opposing sides of the substrate because such areas can generate unwanted stray mutual capacitance and coupling of signals. Row traces can be routed to the same short edge of the substrate as column traces using wide conductive traces running along the borders of the substrate.
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Citations
20 Claims
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1. A touch sensor panel comprising:
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a substrate including a plurality of first bond pads and a plurality of second bond pads and having a first side and a second side, the first side opposite the second side; one or more columns formed from a first layer of a first conductive material disposed along the first side of the substrate and electrically coupled to the plurality of first bond pads; one or more rows formed from a second layer of the first conductive material disposed along the second side of the substrate and electrically coupled to the plurality of second bond pads, wherein the plurality of first bond pads and the plurality of the second bond pads are located to reduce stray capacitance; and a flex circuit comprising; a first portion bonded to the plurality of first bond pads to electrically couple to the one or more columns, and a second portion bonded to the plurality of second bond pads to electrically couple to the one or more rows, wherein the plurality of first bond pads and the plurality of second bond pads are located in different locations along a plane of the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A flex circuit, comprising:
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a first portion including a plurality of third bond pads, the first portion configured to bond to a plurality of first bond pads located on a first side of a substrate; and a second portion including a plurality of fourth bond pads, the second portion configured to bond to a plurality of second bond pads located on a second side of the substrate, the second side opposite the first side, wherein the plurality of first bond pads and the plurality of second bond pads are located in different locations along a plane of the substrate to reduce stray capacitance. - View Dependent Claims (13, 14, 15, 16)
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17. A method of routing a plurality of signals from a plurality of sensors to a plurality of bond pads, the method comprising:
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coupling a plurality of columns of the plurality of sensors to a first plurality of bond pads located on a first side of a substrate; and coupling a plurality of rows of the plurality of sensors to a second plurality of bond pads located on a second side of the substrate, the second side opposite the first side, wherein the plurality of first bond pads and the plurality of second bond pads are located in different locations along a plane of the substrate to reduce stray capacitance. - View Dependent Claims (18, 19, 20)
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Specification