Communication module alignment

• US 10,049,801 B2
• Filed: 10/16/2015
• Issued: 08/14/2018
• Est. Priority Date: 10/16/2015
• Status: Active Grant

• Current Assignee: Molex LLC (KOCH Industries Incorporated)
• Original Assignee: Keyssa Licensing, Inc.
• Inventors: Venuti, Stephen Robert, Novak, Steve
• Primary Examiner(s): Tran, Binh
• Application Number:
  US14/885,953
• Publication Number:
  US 20170110229A1
• Time in Patent Office: 1,033 Days
• Field of Search: 361145, 361147, 361257, 361741, 361748, 361754, 361756, 361757, 361764, 361783, 174353, 174391
• CPC Class Codes: H01F 7/0242 Magnetic drives, magnetic coupling devices
• CPC Class Codes: H05K 1/18 Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/0707 Shielding
• CPC Class Codes: H05K 2201/10098 Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
• CPC Class Codes: H05K 2203/104 Using magnetic force, e.g. to align particles or for a temporary connection during processing
• CPC Class Codes: H05K 2203/166 Alignment or registration; Control of registration
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

Systems, and apparatus for aligning structures are provided. One of the apparatus includes a first communication module including: a printed circuit board, one or more integrated circuit packages mounted on the printed circuit board, and one or more magnets positioned relative to the one or more integrated circuit packages, wherein the one or more magnets are configured to attractively couple the first communication module to a second communication module positioned in proximity to the first communication module.

Claims

1. An apparatus comprising:

a first communication module of a first device including;

a printed circuit board,

one or more integrated circuit packages mounted on the printed circuit board, wherein each of the one or more integrated circuit packages comprise a wireless transceiver, transmitter, or receiver, and

one or more magnets positioned relative to the one or more integrated circuit packages,

wherein the one or more magnets are configured to move within the first device such that, when in an engaged position, the one or more magnets attractively couple the first communication module to a second communication module of a second device positioned in proximity to the first communication module.

2. The apparatus of claim 1, wherein the first communication module further comprises a respective signal guiding structure surrounding a perimeter formed by each of the one or more integrated circuit packages, wherein each signal guiding structure is configured to insulate the respective integrated circuit package from extraneous signals and to form a channel providing a pathway for data communications.

3. The apparatus of claim 2, wherein the one or more magnets include one or more magnets surrounding a portion of each signal guiding structure.

4. The apparatus of claim 2, wherein the one or more magnets includes a center magnet positioned between a first signal guiding structure and a second signal guiding structure.

5. The apparatus of claim 1, wherein the one or more integrated circuit packages comprises a transmitter integrated circuit package and a receiver integrated circuit package.

6. The apparatus of claim 5, wherein the one or more magnets comprise one or more magnets surrounding at least a portion of the transmitter integrated circuit package and one or more magnets surrounding at least a portion of the receiver integrated circuit package.

7. The apparatus of claim 5, wherein the one or more magnets further comprise a central magnet positioned between the transmitter integrated circuit package and the receiver integrated circuit package.

8. The apparatus of claim 1, wherein the first communication module is configured to move within the first device between an engaged position and a disengaged position.

9. The apparatus of claim 8, wherein moving the first communication module between the engaged position and the disengaged position comprises moving the printed circuit board.

10. The apparatus of claim 9, wherein the printed circuit board is biased to the disengaged position when the one or more magnets are not attracted to magnets of the second communication module.

11. The apparatus of claim 1, wherein at least one of the magnets is biased to a disengaged position when the one or more magnets are not attracted to magnets of the second communication module.

12. The apparatus of claim 8, wherein the first communication module moves to the engaged position in response to the second communication module being positioned in proximity to the first communication module.

13. The apparatus of claim 12, wherein the magnets in the engaged position align at least one of the one or more integrated circuit packages with an integrated circuit package of the second communication module.

14. An apparatus comprising:

a first device comprising;

a movable communication module including;

a printed circuit board,

one or more integrated circuit packages mounted on the printed circuit board, wherein each of the one or more integrated circuit packages comprise a wireless transceiver, transmitter, or receiver, and

one or more magnets positioned relative to the one or more integrated circuit packages,

wherein the movable communication module is configured to move within the first device between an engaged position and a disengaged position, wherein the movable communication module is in an engaged position when coupled to a second device and in a disengaged position when not coupled to the second device.