Nested through glass via transformer
First Claim
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1. A method of fabricating a 3D nested transformer, comprising:
- forming a plurality of through substrate vias in a substrate having a first surface and an opposite second surface; and
daisy chaining the through substrate vias together with a plurality of traces, at least some of the plurality of through substrate vias having first and second conductive regions, in which the first conductive regions comprise inner cores of the plurality of through substrate vias and the second conductive regions comprise outer shells of the plurality of through substrate vias, the daisy chaining performed by;
coupling, on the first surface and the second surface of the substrate, a first trace of a first set of traces corresponding to a primary winding to an inner core of a first through substrate via of the plurality of through substrate vias and to an inner core of a second through substrate via of the plurality of through substrate vias,coupling, on each of the first surface and the second surface of the substrate, a second trace of a second set of traces corresponding to a secondary winding to an outer shell of the first through substrate via and to an outer shell of the second through substrate via, andremoving an isolation material deposited between the inner core and the outer shell of the first through substrate via and between the inner core and the outer shell of the second through substrate via.
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Abstract
A 3D nested transformer includes a substrate having a set of through substrate vias daisy chained together with a set of traces. At least some of the through substrate vias have first and second conductive regions. The set of traces also includes a first set of traces coupling together at least some of the first conductive regions of the through substrate vias, and a second set of traces coupling together at least some of the second conductive regions of the through substrate vias.
25 Citations
21 Claims
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1. A method of fabricating a 3D nested transformer, comprising:
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forming a plurality of through substrate vias in a substrate having a first surface and an opposite second surface; and daisy chaining the through substrate vias together with a plurality of traces, at least some of the plurality of through substrate vias having first and second conductive regions, in which the first conductive regions comprise inner cores of the plurality of through substrate vias and the second conductive regions comprise outer shells of the plurality of through substrate vias, the daisy chaining performed by; coupling, on the first surface and the second surface of the substrate, a first trace of a first set of traces corresponding to a primary winding to an inner core of a first through substrate via of the plurality of through substrate vias and to an inner core of a second through substrate via of the plurality of through substrate vias, coupling, on each of the first surface and the second surface of the substrate, a second trace of a second set of traces corresponding to a secondary winding to an outer shell of the first through substrate via and to an outer shell of the second through substrate via, and removing an isolation material deposited between the inner core and the outer shell of the first through substrate via and between the inner core and the outer shell of the second through substrate via. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of fabricating a 3D nested transformer, comprising:
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the step for forming a plurality of through substrate vias in a substrate having a first surface and an opposite second surface; and the step for daisy chaining the through substrate vias together with a plurality of traces, at least some of the plurality of through substrate vias having first and second conductive regions, in which the first conductive regions comprise inner cores of the plurality of through substrate vias and the second conductive regions comprise outer shells of the plurality of through substrate vias, the daisy chaining performed by; the step for coupling, on each of the first surface and the second surface of the substrate, a first trace of a first set of traces corresponding to a primary winding to an inner core of a first through substrate via of the plurality of through substrate vias and to an inner core of a second through substrate via of the plurality of through substrate vias, the step for coupling, on each of the first surface and the second surface of the substrate, a second trace of a second set of traces corresponding to a secondary winding to an outer shell of the first through substrate via and to an outer shell of the second through substrate via, and the step for removing an isolation material deposited between the inner core and the outer shell of the first through substrate via and between the inner core and the outer shell of the second through substrate via. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
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19. A method of fabricating a 3D nested transformer, the method comprising:
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forming a cavity in a substrate having a first surface and an opposite second surface; depositing and patterning a first photoresist layer on the substrate as a patterned first photoresist layer; plating the substrate and sidewalls of the cavity with a first conductive layer along the patterned first photoresist layer; stripping the patterned first photoresist layer; depositing an isolation layer on the plated first conductive layer in the cavity; etching the deposited isolation layer to provide a core cavity; depositing and patterning a second photoresist layer on the etched isolation layer as a patterned second photoresist layer; plating the core cavity and the etched isolation layer with a second conductive layer along the patterned second photoresist layer, in which the first conductive layer comprises an inner core of a first through substrate via and the second conductive layer comprises an outer shell of the first through substrate via; fabricating a first trace corresponding to a primary winding on the substrate, the first trace coupled, on each of the first surface and the second surface of the substrate, to the outer shell of the first through substrate via and to an outer shell of a second through substrate via; fabricating a second trace corresponding to a secondary winding on the substrate, the second trace coupled to the inner core of the first through substrate via and an inner core of the second through substrate via; and removing the etched isolation layer between the inner core and the outer shell of the first through substrate via and between the inner core and the outer shell of the second through substrate via. - View Dependent Claims (20, 21)
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Specification