Thermal block assemblies and instruments providing low thermal non-uniformity for rapid thermal cycling

• US 10,049,895 B2
• Filed: 09/01/2010
• Issued: 08/14/2018
• Est. Priority Date: 09/01/2009
• Status: Active Grant

• Current Assignee: Life Technologies Corporation (Thermo Fisher Scientific Incorporated)
• Original Assignee: Life Technologies Corporation (Thermo Fisher Scientific Incorporated)
• Inventors: Wojtowicz, Janusz, Dahlhoff, Geoffrey, Grunewald, Douglas W., Conner, Thomas A.
• Primary Examiner(s): KAPLAN VERBITSKY, GAIL
• Application Number:
  US12/874,112
• Publication Number:
  US 20110056661A1
• Time in Patent Office: 2,904 Days
• Field of Search: 374 10- 12, 374 5, 374 43- 45, 374102, 374 29, 374137, 374141, 374208, 257706, 361709-712
• CPC Class Codes: B01L 2300/0829 Multi-well plates; Microtitration plates
• CPC Class Codes: B01L 2300/1822 using Peltier elements
• CPC Class Codes: B01L 7/52 with provision for submitting samples to a predetermined sequence of different temperatures, e.g. for treating nucleic acid samples amplification or hybridisation processes per se C12Q1/68; controlling sequential reactions for synthesis B01J19/0046
• CPC Class Codes: F28D 2021/0029 Heat sinks
• CPC Class Codes: H01L 21/4882 Assembly of heatsink parts
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The present teachings disclose various embodiments of a thermal block assembly having low thermal non-uniformity throughout the thermal block assembly. Accordingly, various embodiments of thermal block assemblies having such low thermal non-uniformity provide for desired performance of bioanalysis instrumentation utilizing such thermal block assemblies.

Claims

1. A thermal block assembly for thermal cycling comprising:

a sample block having a first surface and a second surface opposing the first surface having a sample block footprint wherein the first surface is adapted for receiving a sample support device;

a heat sink comprising a base having a first surface having a first surface footprint, a second surface, and a plurality of fins pendent the second surface, wherein a space between each fin provides flow paths for air passing from an inlet side of the plurality of fins to an outlet side of the plurality of fins wherein the height of the plurality of fins varies to provide flow paths along the heat sink parallel to the second surface of the heat sink and longest near the base of the heat sink; and

a plurality of thermal electric devices adjoined in the X-Y plane, positioned between the sample block and the heat sink;

wherein the height of the plurality of fins varies along at least a portion of the heat sink that spans an active footprint of the plurality of thermal electric devices.

2. The thermal block assembly of claim 1, wherein a dynamic thermal non-uniformity of the sample block is an average value of between about 0.05°

C. to about 0.25°

C.

3. The thermal block assembly of claim 1, wherein a static thermal non-uniformity of the sample block is an average value of between about 0.05°

C. to about 0.25°

C.

4. The thermal block assembly of claim 1, wherein a time to reach an essentially stable thermal non-uniformity of the sample block after reaching a target setpoint temperature is up to about 5 seconds.

5. The thermal block assembly of claim 4, wherein the target setpoint temperature is a value based on a temperature measured in a plurality of samples in the sample support device.

6. The thermal block assembly of claim 4, wherein the target setpoint temperature is a value based on a temperature measured in a plurality of positions in the sample block.

7. The thermal block assembly of claim 4, wherein the essentially stable thermal non-uniformity of the sample block is an average value of between about 0.05°

C. to about 0.25°

C.

8. The thermal block assembly of claim 1, wherein a static thermal non-uniformity and a dynamic thermal non-uniformity of the sample block are essentially the same.

9. The thermal block assembly of claim 8, wherein the dynamic thermal non-uniformity and the static non-uniformity of the sample block are each an average value of between about 0.05°

C. to about 0.25°

C.

10. The thermal block assembly of claim 8, wherein the static thermal non-uniformity and the dynamic thermal non-uniformity of the sample block are essentially the same at a defined time during a thermal cycle.

11. The thermal block assembly of claim 10, wherein the defined time during a thermal cycle is a defined clock start.

12. The thermal block assembly of claim 11, wherein the defined clock start is initiated within about 1°

C. of a target setpoint temperature of a thermal cycle.

13. The thermal block assembly of claim 12, wherein the setpoint temperature is a value based on a temperature measured in a plurality of samples in the sample support device.

14. The thermal block assembly of claim 12, wherein the setpoint temperature is a value based on a temperature measured in a plurality of positions in the sample block.

15. The thermal block assembly of claim 1, further comprising a fan sub-assembly comprising a fan and a duct, wherein the fan sub-assembly is positioned to provide airflow through the flow paths of the fins from the inlet side of the plurality of fins to the outlet side of the plurality of fins.

16. The thermal block assembly of claim 15, wherein the duct provides a uniform flow path from the fan to the inlet side of plurality of fins.

17. The thermal block assembly of claim 15, wherein the duct is positioned proximal to the inlet side of the plurality of fins, such that the width of a gap between the duct and the inlet side may be not more than the width provided by the flow paths.

18. The thermal block assembly of claim 1, wherein the sample block comprises a flange optimized by modeling to reduce the horizontal flow of heat, thereby reducing the sample block thermal non-uniformity.

19. The thermal block assembly of claim 1, wherein the sample block comprises a first side surface, a second side surface, a third side surface, and a fourth side surface, and wherein the uniform thermal mass across the sample block is achieved by a combination of removing and adding mass from selected regions of each of the side surface.

20. An apparatus comprising:

a control system; and

a thermal block assembly comprising;

a sample block having a first surface and a second surface opposing the first surface having a sample block footprint wherein the first surface is adapted for receiving a sample support device;

a heat sink comprising a base having a first surface, a first surface footprint, a second surface and a plurality of fins pendent the second surface, wherein a space between each fin provides flow paths for air passing from an inlet side of the plurality of fins to an outlet side the plurality of fins, wherein the height of the plurality of fins varies to provide flow paths along the heat sink parallel to the second surface of the heat sink and longest near the base of the heat sink; and

a plurality of thermal electric devices adjoined in the X-Y plane, positioned between the sample block and the heat sink;

wherein the height of the plurality of fins varies along at least a portion of the heat sink that spans an active footprint of the plurality of thermal electric devices.

21. The apparatus of claim 20, wherein a dynamic thermal non-uniformity of the sample block is an average value of between about 0.05°

C. to about 0.25°

C.

22. The apparatus of claim 20, wherein a static thermal non-uniformity of the sample block is an average value of between about 0.05°

C. to about 0.25°

C.

23. The apparatus of claim 20, wherein a time to reach an essentially stable thermal non-uniformity of the sample block after reaching a target setpoint temperature is up to about 5 seconds.

24. The apparatus of claim 23, wherein the target setpoint temperature is a value based on a temperature measured in a plurality of samples in the sample support device.

25. The apparatus of claim 23, wherein the target setpoint temperature is a value based on a temperature measured in a plurality of positions in the sample block.

26. The apparatus of claim 23, wherein the essentially stable thermal non-uniformity of the sample block is an average value of between about 0.05°

C. to about 0.25°

C.

27. The apparatus of claim 20, wherein a static thermal non-uniformity and a dynamic thermal non-uniformity of the sample block are essentially the same.

28. The apparatus of claim 27, wherein the dynamic thermal non-uniformity and the static non-uniformity of the sample block are each an average value of between about 0.05°

C. to about 0.25°

C.

29. The apparatus of claim 27, wherein the static thermal non-uniformity and the dynamic thermal non-uniformity of the sample block are essentially the same at a defined time during a thermal cycle.

30. The apparatus of claim 29, wherein the defined time during a thermal cycle is a defined clock start.

31. The apparatus of claim 30, wherein the defined clock start is initiated within about 1°

C. of a target setpoint temperature of a thermal cycle.

32. The apparatus of claim 31, wherein the setpoint temperature is a value based on a temperature measured in a plurality of samples in the sample support device.

33. The apparatus of claim 31, wherein the setpoint temperature is a value based on a temperature measured in a plurality of positions in the sample block.

34. The apparatus of claim 20, further comprising a fan sub-assembly comprising a fan and a duct, wherein the fan sub-assembly is positioned to provide airflow through the flow paths of the fins from the inlet side of the plurality of fins to the outlet side of the plurality of fins.

35. The apparatus of claim 34, wherein the duct provides a uniform flow path from the fan to the inlet side of plurality of fins.

36. The apparatus of claim 34, wherein the duct is positioned proximal to the inlet side of the plurality of fins, such that the width of a gap between the duct and the inlet side may be not more than the width provided by the flow paths.

37. The apparatus of claim 20, wherein the sample block comprises a flange optimized by modeling to reduce the horizontal flow of heat, thereby reducing the sample block thermal non-uniformity.

38. The apparatus of claim 20, wherein the sample block comprises a first side surface, a second side surface, a third side surface, and a fourth side surface, and wherein the uniform thermal mass across the sample block is achieved by a combination of removing and adding mass from selected regions of each of the side surfaces.