Method of fabricating a semiconductor module with a inclined groove formed in resin side surface

• US 10,049,952 B2
• Filed: 07/26/2017
• Issued: 08/14/2018
• Est. Priority Date: 08/05/2016
• Status: Active Grant

• Current Assignee: DENSO Corporation
• Original Assignee: Toyota Jidosha Kabushiki Kaisha (Toyota Motor Corporation)
• Inventors: Kadoguchi, Takuya, Hirano, Takahiro, Hanaki, Yuuji, Hayashida, Shigeru
• Primary Examiner(s): Chambliss, Alonzo
• Application Number:
  US15/659,914
• Publication Number:
  US 20180040542A1
• Time in Patent Office: 384 Days
• CPC Class Codes: H01L 21/31058 of organic layers
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/33181 On opposite sides of the body
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/4334 Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 23/49524 the additional leads being a tape carrier or flat leads
• CPC Class Codes: H01L 23/49562 for devices being provided for in H01L29/00
• CPC Class Codes: H01L 23/49568 specifically adapted to facilitate heat dissipation
• CPC Class Codes: H01L 23/49575 Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 25/115 the devices being arranged next to each other
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/181 Encapsulation

Abstract

A manufacturing method of a semiconductor module includes: sealing an assembly with resin, the assembly including a semiconductor chip, a heat-dissipation plate on the semiconductor chip, and multiple terminals, such that the resin includes a first surface, a second surface located opposite to the first surface, and a side surface, a groove extends in the side surface from the first surface to the second surface, an inner surface of the groove includes a first tapered surface, and a second tapered surface provided between the first tapered surface and the first surface, the second tapered surface inclining toward the first surface at a greater inclination angle than an inclination angle of the first tapered surface; and cutting the first surface within an area located on a first surface side from a boundary between the first tapered surface and the second tapered surface such that the heat-dissipation plate exposes.

Claims

1. A manufacturing method of a semiconductor module comprising:

(a) sealing an assembly with resin, the assembly including a semiconductor chip, a heat-dissipation plate connected to the semiconductor chip, and multiple terminals connected to the semiconductor chip, such that

the resin after the assembly is sealed includes a first surface, a second surface located opposite to the first surface, and a side surface connecting the first surface to the second surface,

the multiple terminals projects from the side surface,

a groove is provided between the multiple terminals in the side surface in a manner as to extend from the first surface to the second surface,

an inner surface of the groove includes a first tapered surface inclining toward the first surface, and a second tapered surface provided between the first tapered surface and the first surface, the second tapered surface inclining toward the first surface at a greater inclination angle than an inclination angle of the first tapered surface; and

(b) cutting the first surface within an area located on a first surface side from a boundary between the first tapered surface and the second tapered surface such that the heat-dissipation plate exposes on the first surface.

2. The manufacturing method of the semiconductor module according to claim 1, wherein

the side surface includes:

a third tapered surface inclining toward the first surface; and

a fourth tapered surface provided between the third tapered surface and the first surface, the fourth tapered surface inclining toward the first surface at a greater inclination angle than an inclination angle of the third tapered surface, and

in the step of (b), the first surface is cut within an area located on the first surface side from a boundary between the third tapered surface and the fourth tapered surface.

3. The manufacturing method of the semiconductor module according to claim 2, wherein

the third tapered surface and the fourth tapered surface are provided in portion of the side surface including outside of the groove.

4. A semiconductor module comprising:

an assembly including a semiconductor chip, a heat-dissipation plate disposed on a surface of the semiconductor chip, and multiple terminals connected to the semiconductor chip, and

resin provided such that the resign seals the assembly, the resin including a first surface in contact with the heat-dissipation plate, a second surface located opposite to the first surface, and side surfaces connecting the first surface to the second surface, wherein

the multiple terminals project from the side surface,

a groove is provided between the multiple terminals in the side surface such that the groove extends from the first surface to the second surface,

an inner surface of the groove includes a first tapered surface inclining toward the first surface, and a second tapered surface provided between the first tapered surface and the first surface, the second tapered surface inclining toward the first surface at a greater inclination angle than an inclination angle of the first tapered surface, and

the resin has an opening at which the heat-dissipation plate is exposed on the first surface, the opening being provided from an area located on a first surface side from a boundary between the first tapered surface and the second tapered surface across the first surface.

5. The semiconductor module according to claim 4, wherein

the side surface includes a third tapered surface inclining toward the first surface, and a fourth tapered surface provided between the third tapered surface and the first surface, the fourth tapered surface inclining toward the first surface at a greater inclination angle than an inclination angle of the third tapered surface, and

the opening is provided within an area located on the first surface side from a boundary between the third tapered surface and the fourth tapered surface.

6. The semiconductor module according to claim 5, wherein

the third tapered surface and the fourth tapered surface are provided in portions of the side surface including outside of the groove.