Infrared detector array with selectable pixel binning systems and methods

• US 10,051,210 B2
• Filed: 06/24/2015
• Issued: 08/14/2018
• Est. Priority Date: 06/10/2011
• Status: Active Grant

• Current Assignee: Teledyne FLIR LLC (Teledyne Technologies Incorporated)
• Original Assignee: FLIR Systems, Inc. (Teledyne Technologies Incorporated)
• Inventors: Nussmeier, Mark, Kurth, Eric A., Hogasten, Nicholas, Hoelter, Theodore R., Strandemar, Katrin, Boulanger, Pierre, Sharp, Barbara
• Primary Examiner(s): Truong, Nguyen
• Application Number:
  US14/748,873
• Publication Number:
  US 20150319379A1
• Time in Patent Office: 1,147 Days
• Field of Search: 348165
• CPC Class Codes: G01J 2005/0077 Imaging
• CPC Class Codes: G01J 2005/202 Arrays
• CPC Class Codes: G01J 5/20 using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
• CPC Class Codes: G01J 5/22 Electrical features thereof
• CPC Class Codes: H04N 23/23 from thermal infrared radiation
• CPC Class Codes: H04N 23/50 Constructional details
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• CPC Class Codes: H04N 23/60 Control of cameras or camera modules
• CPC Class Codes: H04N 23/6812 based on additional sensors, e.g. acceleration sensors
• CPC Class Codes: H04N 25/46 by combining or binning pixels
• CPC Class Codes: H04N 25/70 SSIS architectures; Circuits associated therewith
• CPC Class Codes: H04N 25/71 Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
• CPC Class Codes: H04N 25/76 Addressed sensors, e.g. MOS or CMOS sensors
• CPC Class Codes: H04N 5/268 Signal distribution or switching
• CPC Class Codes: H04N 5/33 Transforming infrared radiation cameras or camera modules for generating image signals from infrared radiation H04N23/20; circuitry of SSIS for transforming infrared radiation into image signals H04N25/20

Abstract

Various techniques are provided for binning (e.g., clustering or grouping) two or more infrared sensors of a focal plane array (FPA) to permit configuration of the FPA to various dimensions and/or pixel sizes. For example, according to one or more embodiments, switchable interconnects may be implemented within the FPA, wherein the switchable interconnects comprise a plurality of switches adapted to selectively connect or disconnect infrared sensors of the FPA to/from column lines, row lines, and between each other. The switchable interconnects may also comprise another set of switches adapted to selectively connect adjacent column lines together. By selectively opening and closing appropriate switches of the switchable interconnects, two or more neighboring infrared sensors may be binned together to form a binned detector. Advantageously, the binned detector, along with the array and associated circuitry, may provide increased sensitivity, reduced power consumption, and/or increased frame rate.

Claims

1. A device comprising:

a focal plane array (FPA) adapted to capture image frames of a scene, the FPA comprising;

a plurality of bolometers arranged in an array to provide a corresponding plurality of pixels;

a plurality of column lines adapted to supply a bias voltage to the bolometers;

a plurality of row lines adapted to provide a reference voltage to the bolometers; and

a first plurality of switches adapted to selectively connect two or more adjacent column lines to group two or more of the bolometers to form binned bolometers in the array, wherein each binned bolometer comprises a corresponding group of the bolometers and is adapted to provide;

separate output currents from each bolometer of the group while the adjacent column lines are disconnected in a first mode, and

a combined output current from the bolometers of the group while the adjacent column lines are connected in a second mode.

2. The device of claim 1, wherein the FPA further comprises:

a second plurality of switches adapted to selectively connect some of the bolometers to row lines;

a third plurality of switches adapted to selectively connect some of the bolometers to column lines;

a fourth plurality of switches adapted to selectively connect some of the bolometers in a series; and

wherein the first, second, third, and fourth plurality of switches are adapted to be selectively opened or closed to bin every two or more of the neighboring bolometers together to form the binned bolometers.

3. The device of claim 2, wherein the binned bolometers are formed when the first and fourth switches are closed and the second and third switches are open.

4. The device of claim 1, wherein each of the binned bolometers has a resistance substantially equal to a resistance of each individual bolometer of the group.

5. The device of claim 1, wherein each binned bolometer comprises four of the bolometers in a two-by-two configuration.

6. The device of claim 1, wherein:

the FPA further comprises a read out integrated circuitry (ROIC) electrically connected to the column lines and adapted to provide the image frames; and

the ROIC is further adapted to increase a rate at which the image frames are provided when the binned bolometers are formed in the array.

7. The device of claim 1, wherein:

the FPA further comprises a read out integrated circuitry (ROIC) electrically connected to the column lines and adapted to provide the bias voltage to the bolometers; and

the ROIC is further adapted to increase the bias voltage when the binned bolometers are formed so as to increase sensitivity of the binned bolometers.

8. The device of claim 1, wherein the bolometers are adapted to receive the bias voltage from a range of 0.2 volts to 0.7 volts.

9. The device of claim 1, wherein:

the FPA is adapted to capture an intentionally blurred image frame of the scene; and

the device further comprises a processor adapted to;

communicate with the FPA,

determine a plurality of non-uniform correction (NUC) terms based on the intentionally blurred image frame, and

apply the NUC terms to the image frames to remove noise from the image frames.

10. A method of binning bolometers of a focal plane array (FPA) adapted to capture imaging frames of a scene, the method comprising:

selectively connecting adjacent column lines of the FPA using a first plurality of switches, wherein the column lines are adapted to supply a bias voltage to the bolometers;

selectively connecting some of the bolometers to row lines of the FPA using a second plurality of switches, wherein the row lines are adapted to provide a reference voltage to the bolometers;

selectively connecting some of the bolometers to the column lines using a third plurality of switches;

selectively connecting some of the bolometers in series using a fourth plurality of switches, wherein the selectively connecting using the first, second, third, and fourth plurality of switches group every two or more of the neighboring bolometers together to form binned bolometers within the array, wherein each binned bolometer comprises a corresponding group of the bolometers;

providing separate output currents from each bolometer of the group while the adjacent column lines are disconnected in a first mode, and

providing a combined output current from the bolometers of the group while the adjacent column lines are connected in a second mode.

11. The method of claim 10, wherein the binned bolometers are formed when the first and fourth switches are closed and the second and third switches are open.

12. The method of claim 10, wherein each of the binned bolometers has a resistance substantially equal to a resistance of each individual bolometer of the group.

13. The method of claim 10, wherein the selectively connecting using the first, second, third, and fourth plurality of switches group four of the bolometers in a two-by-two configuration to form each binned bolometer.

14. The method of claim 10, further comprising increasing a rate at which the image frames are provided from the FPA when the binned bolometers are formed in the array.

15. The method of claim 10, further comprising increasing the bias voltage supplied by the column lines when the binned bolometers are formed so as to increase sensitivity of the binned bolometers.

16. The method of claim 10, further comprising providing, to the bolometers, the bias voltage selected from a range of 0.2 volts to 0.7 volts.

17. The method of claim 10, wherein:

capturing, using the FPA, an intentionally blurred image frame of the scene;

determining a plurality of non-uniform correction (NUC) terms based on the intentionally blurred image frame; and

applying the NUC terms to the image frames to remove noise from the image frames.