Smart soft good product, circuitry layer, and methods
First Claim
1. A method for fabricating a soft good product comprising:
- applying a first mask to a first side of a fabric substrate coated with a conductive material, wherein, after the first mask is applied, a first portion of the first side of the fabric substrate is covered by the first mask and a second portion of the first side of the fabric substrate is not covered by the first mask;
applying a second mask to a second side of the fabric substrate opposite the first side, wherein, after the second mask is applied, a first portion of the second side of the fabric substrate is covered by the second mask and a second portion of the second side of the fabric substrate is not covered by the second mask, wherein the first portion of the first side of the fabric substrate is opposite the first portion of the second side of the fabric substrate, and wherein the second portion of the first side of the fabric substrate is opposite the second portion of the second side of the fabric substrate;
applying a chemical to the fabric substrate to remove conductive material outside of the first mask;
after applying the chemical, fastening a component carrier to the first side of the fabric substrate, wherein the component carrier comprises;
a flexible substrate,a rigid electrical component having a terminal, wherein the rigid electrical component is mounted to the flexible substrate, anda conductive interface pad extending from the terminal across a region of the flexible substrate;
creating a circuitry layer by assembling and forming an electrical connection between the conductive interface pad and an electrode formed of conductive material on the first side of the fabric substrate; and
incorporating the circuitry layer into a soft good.
2 Assignments
0 Petitions
Accused Products
Abstract
One variation of a method for fabricating a garment includes: applying a first mask to a first side of a fabric substrate coated with a conductive material; applying a second mask—mirrored image of the first mask—to a second side of the fabric substrate opposite the first side; applying an etchant to the fabric substrate to remove conductive material outside of the first mask; arranging a conductive interface pad of a component carrier over an electrode defined by remaining conductive material on the fabric substrate, the component carrier including a flexible substrate and a rigid electrical component mounted to the flexible substrate, the conductive interface pad extending from a terminal of the rigid electrical component across a region of the flexible substrate; mechanically fastening the component carrier to the fabric substrate to form a garment insert including an electrical circuit; and incorporating the garment insert into the garment.
31 Citations
20 Claims
-
1. A method for fabricating a soft good product comprising:
-
applying a first mask to a first side of a fabric substrate coated with a conductive material, wherein, after the first mask is applied, a first portion of the first side of the fabric substrate is covered by the first mask and a second portion of the first side of the fabric substrate is not covered by the first mask; applying a second mask to a second side of the fabric substrate opposite the first side, wherein, after the second mask is applied, a first portion of the second side of the fabric substrate is covered by the second mask and a second portion of the second side of the fabric substrate is not covered by the second mask, wherein the first portion of the first side of the fabric substrate is opposite the first portion of the second side of the fabric substrate, and wherein the second portion of the first side of the fabric substrate is opposite the second portion of the second side of the fabric substrate; applying a chemical to the fabric substrate to remove conductive material outside of the first mask; after applying the chemical, fastening a component carrier to the first side of the fabric substrate, wherein the component carrier comprises; a flexible substrate, a rigid electrical component having a terminal, wherein the rigid electrical component is mounted to the flexible substrate, and a conductive interface pad extending from the terminal across a region of the flexible substrate; creating a circuitry layer by assembling and forming an electrical connection between the conductive interface pad and an electrode formed of conductive material on the first side of the fabric substrate; and incorporating the circuitry layer into a soft good. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
-
9. A soft good product comprising:
-
an outer layer comprising a textile; a lining comprising a textile; a circuitry layer interposed between the outer layer and the lining and comprising; a fabric substrate having a first side and a second side, wherein the first side of the fabric substrate includes traces of an electrical circuit, wherein the traces are formed by; applying a first mask to the first side of the fabric substrate coated with a conductive material, wherein, after the first mask is applied, a first portion of the first side of the fabric substrate is covered by the first mask and a second portion of the first side of the fabric substrate is not covered by the first mask; applying a second mask to the second side of the fabric substrate opposite the first side of the fabric substrate, wherein, after the second mask is applied, a first portion of the second side of the fabric substrate is covered by the second mask and a second portion of the second side of the fabric substrate is not covered by the second mask, wherein the first portion of the first side of the fabric substrate is opposite the first portion of the second side of the fabric substrate, and wherein the second portion of the first side of the fabric substrate is opposite the second portion of the second side of the fabric substrate; and applying a chemical to the fabric substrate to remove conductive material outside of the first mask; and a component carrier comprising; a flexible substrate, a rigid electrical component mounted to the flexible substrate, and a first conductive interface pad extending from a first terminal of the rigid electrical component; wherein the first conductive interface pad is electrically coupled to at least one of the traces. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
-
-
17. A circuitry layer configured to be sewn into a soft good product, the circuitry layer comprising:
-
a fabric substrate having a first side and a second side, wherein the first side of the fabric substrate includes traces of an electrical circuit, wherein the traces include at least one electrode, wherein the traces are formed by; applying a first mask to the first side of a fabric substrate coated with a conductive material, wherein, after the first mask is applied, a first portion of the first side of the fabric substrate is covered by the first mask and a second portion of the first side of the fabric substrate is not covered by the first mask; applying a second mask to a second side of the fabric substrate opposite the first side of the fabric substrate, wherein, after the second mask is applied, a first portion of the second side of the fabric substrate is covered by the second mask and a second portion of the second side of the fabric substrate is not covered by the second mask, wherein the first portion of the first side of the fabric substrate is opposite the first portion of the second side of the fabric substrate, and wherein the second portion of the first side of the fabric substrate is opposite the second portion of the second side of the fabric substrate; and applying a chemical to the fabric substrate to remove conductive material outside of the first mask; a volume of a substance comprising a conductive particulate, a polymer, and a solvent applied over the electrode; a component carrier comprising; a flexible substrate, an electrical component mounted to the flexible substrate, and a conductive interface pad arranged on the substrate and extending from a terminal of the electrical component; wherein the conductive interface pad is in contact with the volume of the substance; and a filament passing through the fabric substrate and the component carrier and configured to constrain the fabric substrate and the component carrier against the volume of the substance. - View Dependent Claims (18, 19, 20)
-
Specification