Implantable device for the brain
First Claim
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1. A neural stimulator comprising:
- a hermetic package enclosing electronics suitable to be implanted within a head;
a flange defining a plurality of voids around the hermetic package suitable to accept screws adapted for mounting the hermetic package to the cranium;
a return electrode formed as part of said hermetic package and electrically coupled to said electronics anda flexible thin film electrode array electrically coupled to said electronics suitable for direct contact with and direct stimulation of the brain including a flexible polymer base layer;
patterned metal traces deposited on said flexible polymer base layer, the metal traces forming a bond pad portion connected to the hermetic electronics package, an electrode portion adapted for contact with the brain and a cable portion connecting the bond pad portion to the electrode portion; and
a flexible polymer top layer deposited on said flexible polymer base layer and said metal traces and defining voids exposing said electrodes.
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Abstract
The present invention consists of an implantable device with at least one package that houses electronics that receives input data or signals, and optionally, power, from an external system through at least one coil attached to the at least one package, processes the input data and delivers electrical pulses to neural tissue through at least one array of multiple electrodes that is/are attached to the at least one package. The invention, or components thereof, is/are intended to be installed in the head, or on or in the cranium, or on the dura, or on or in the brain.
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Citations
14 Claims
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1. A neural stimulator comprising:
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a hermetic package enclosing electronics suitable to be implanted within a head; a flange defining a plurality of voids around the hermetic package suitable to accept screws adapted for mounting the hermetic package to the cranium; a return electrode formed as part of said hermetic package and electrically coupled to said electronics and a flexible thin film electrode array electrically coupled to said electronics suitable for direct contact with and direct stimulation of the brain including a flexible polymer base layer; patterned metal traces deposited on said flexible polymer base layer, the metal traces forming a bond pad portion connected to the hermetic electronics package, an electrode portion adapted for contact with the brain and a cable portion connecting the bond pad portion to the electrode portion; and a flexible polymer top layer deposited on said flexible polymer base layer and said metal traces and defining voids exposing said electrodes. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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Specification