Temperature-measurement probe

• US 10,054,498 B2
• Filed: 07/28/2017
• Issued: 08/21/2018
• Est. Priority Date: 12/31/2009
• Status: Active Grant

• Current Assignee: Welch Allyn Incorporated
• Original Assignee: Welch Allyn Incorporated
• Inventors: Meyerson, Craig M., Quinn, David E., Lane, John A., Wagner, Anthony P., Kinsley, Matthew J., Martin, Scott A., Mullin, Matthew D.
• Primary Examiner(s): Patel, Harshad R
• Assistant Examiner(s): Williams, Jamel
• Application Number:
  US15/662,919
• Publication Number:
  US 20170328787A1
• Time in Patent Office: 389 Days
• CPC Class Codes: G01K 1/02 Means for indicating or recording specially adapted for thermometers
• CPC Class Codes: G01K 1/022 for recording
• CPC Class Codes: G01K 1/024 for remote indication
• CPC Class Codes: G01K 13/20 Clinical contact thermometers for use with humans or animals
• CPC Class Codes: G01K 7/22 the element being a non-linear resistance, e.g. thermistor G01K7/26 takes precedence
• CPC Class Codes: G01K 7/42 Circuits effecting compensation of thermal inertia; Circuits for predicting the stationary value of a temperature
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

An apparatus, system and method for temperature measurement of a target site, such a human body site. The invention includes an intelligent temperature probe configured to physically contact a target site and to communicate with a host device, which can be implemented as a hand-held device or as a personal computer. The host device can compute, store and display an accurate predicted temperature, or an actual temperature at thermal equilibrium, of the target site for each of a plurality of different intelligent temperature probes that each have unique and varied operating characteristics. A set of unique operating characteristics for each temperature probe is represented by information communicated between each respective temperature probe and the host device.

Claims

1. A temperature-measurement probe, comprising:

a probe body;

a first circuit segment residing within the temperature-measurement probe including a communication node and having an electrical characteristic sensitive to a probe temperature at a location within the probe body, the first circuit segment generating circuit measurement data and including a memory configured to store temperature-correlation information, wherein

the temperature-correlation information includes a first customized procedural model correlating the circuit-measurement data with the probe temperature and a target temperature, and in which the communication node is configured for communication with a second circuit segment, the second circuit segment being configured to receive the temperature-correlation information including the first customized procedural model and circuit measurement data from the first circuit segment to estimate the probe temperature and the target temperature, wherein the second circuit segment is configured to process a second customized procedural model of a second temperature-measurement probe interchangeable with the first temperature-measurement probe, and in which the second customized procedural model is different from the first customized procedural model.

2. The temperature-measurement probe according to claim 1, in which the first customized procedural model includes a mathematical expression comprising a temperature prediction variable determined as a function of a plurality of circuit measurement data values, each circuit measurement data value being associated with a coefficient value variable and a time table variable.

3. The temperature-measurement probe according to claim 1, wherein the first circuit segment includes a thermistor or a thermopile.

4. The temperature-measurement probe according to claim 1, wherein the first customized procedural model is represented as a set of computer programming language directives.

5. The temperature-measurement probe according to claim 1, in which the communication node of the first circuit segment is configured to communicate information via one of a wireless communication channel or a wired communication channel to the second circuit segment.

6. The temperature-measurement probe according to claim 5, in which the wired communication channel is a universal serial bus and in which the communication node is electrically connected to a first universal serial bus connector, the first universal serial bus connector being configured to electrically connect to a second universal serial bus connector that is electrically connected to the second circuit segment.

7. The temperature-measurement probe according to claim 1, wherein the second circuit segment is part of a temperature-estimation device and wherein the temperature-measurement probe is configured to establish a physical connection to the temperature-estimation device.

8. The temperature-measurement probe according to claim 7, wherein the physical connection establishes a communication connection between the temperature-measurement probe and the temperature-estimation device.

9. The temperature-measurement probe according to claim 7, wherein the temperature-estimation device is implemented, at least in part, as software residing within a computer.

10. The temperature-measurement probe according to claim 7, in which the physical connection to the temperature-estimation device enables removable attachment.

11. The temperature-measurement probe according to claim 1, wherein the second circuit segment is part of a temperature-estimation device and wherein the temperature-measurement probe is configured to establish a communication connection between the temperature-measurement probe and the temperature-estimation device without requiring a physical connection between the probe and the temperature-estimation device.

12. The temperature-measurement probe according to claim 1, further including a handle portion having a set of control buttons and a set of visual indicators.

13. The temperature-measurement probe according to claim 12, in which the handle portion is attached to a proximal end of the probe body, wherein an opposing distal end of the probe body includes a probe tip.

14. The temperature-measurement probe according to claim 13, in which the probe tip includes a heating element.

15. The temperature-measurement probe according to claim 14, wherein the visual indicators include an indicator indicating when the probe tip has reached a predetermined probe temperature.

16. The temperature-measurement probe according to claim 12, wherein the visual indicators include a data acquisition complete indicator.

17. The temperature-measurement probe according to claim 1, in which the target temperature is the temperature at a target site location.

18. The temperature-measurement probe according to claim 17, wherein the target site location is part of a human patient.

19. The temperature-measurement probe according to claim 1, wherein the first circuit segment performs acquisition and storage of the circuit-measurement data while the temperature-measurement probe is located in physical contact with a target and wherein the second circuit segment is configured to process the circuit-measurement data received from the temperature-measurement probe to estimate the target temperature.