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Automated optical inspection of unit specific patterning

  • US 10,056,304 B2
  • Filed: 05/18/2017
  • Issued: 08/21/2018
  • Est. Priority Date: 11/19/2014
  • Status: Active Grant
First Claim
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1. An automated optical inspection (AOI) system, comprising:

  • aligning a wafer comprising a plurality of unit specific patterns formed on the wafer;

    creating a plurality of unique reference standards as a plurality of electrical nets by generating with a computer of the AOI system an electrical net for each of the unit specific patterns, each of the plurality of electrical nets comprising a start point and an end point;

    capturing an image of each of the plurality of unit specific patterns on the wafer with a camera;

    processing the image with the computer to provide a plurality of extracted boundaries of contiguous electrically conductive regions;

    detecting defects in the plurality of unit specific patterns, if present, by comparing each of the extracted boundaries of contiguous electrically conductive regions to a corresponding one of the plurality of unique reference standards; and

    creating an output of known good die from the plurality of unit specific patterns without defects.

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