Molded composite enclosure for integrated circuit assembly
First Claim
1. An enclosure for an integrated circuit (IC) assembly, the enclosure comprising:
- a composite lid structure havinga body portion, anda side portion that extends from the body portion and forms a cavity, wherein the body portion and the side portion share a contiguous interior material comprising a polymer and share a contiguous exterior material comprising a metal, and the contiguous interior material has an opening formed in the body portion; and
wherein the contiguous exterior material is thermally coupleable with the IC assembly placed within the cavity of the side portion by a thermal interface material through the opening of the contiguous interior material.
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Accused Products
Abstract
Embodiments of the present disclosure are directed toward a molded composite enclosure for an integrated circuit (IC) assembly. In one embodiment, an enclosure for an integrated circuit (IC) assembly may include a molded lid structure having a body portion, and a side portion that extends from the body portion and forms a cavity configured to house the IC assembly, wherein the body portion and the side portion share a contiguous interior material comprising a polymer and share a contiguous exterior material comprising a metal, the contiguous interior material having an opening formed in the body portion such that the IC assembly can be thermally coupled with the contiguous exterior material through the opening. Other embodiments may be described and/or claimed.
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Citations
20 Claims
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1. An enclosure for an integrated circuit (IC) assembly, the enclosure comprising:
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a composite lid structure having a body portion, and a side portion that extends from the body portion and forms a cavity, wherein the body portion and the side portion share a contiguous interior material comprising a polymer and share a contiguous exterior material comprising a metal, and the contiguous interior material has an opening formed in the body portion; and wherein the contiguous exterior material is thermally coupleable with the IC assembly placed within the cavity of the side portion by a thermal interface material through the opening of the contiguous interior material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A solid-state drive (SSD) comprising:
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a composite lid structure having; a body portion, and a side portion that extends from the body portion and forms a cavity, wherein the body portion and the side portion share a contiguous interior material comprising a polymer and share a contiguous exterior material comprising a metal, and the contiguous interior material has an opening formed in the body portion; and
wherein the contiguous exterior material is thermally coupleable with an integrated circuit (IC) assembly placed within the cavity of the side portion by a thermal interface material through the opening of the contiguous interior material; anda base structure coupled with the composite lid structure such that the cavity is disposed between the base structure and the composite lid structure. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
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Specification