Semiconductor light emitting device

• US 10,056,357 B2
• Filed: 07/06/2017
• Issued: 08/21/2018
• Est. Priority Date: 11/05/2010
• Status: Active Grant

• Current Assignee: ROHM Co., Ltd.
• Original Assignee: ROHM Co., Ltd.
• Inventors: Toyama, Tomoichiro
• Primary Examiner(s): Blum, David S
• Application Number:
  US15/642,501
• Publication Number:
  US 20170309602A1
• Time in Patent Office: 411 Days
• Field of Search: 257 96, 257 98, 257 99
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 27/15 including semiconductor components having potential barriers, specially adapted for light emission
• CPC Class Codes: H01L 33/08 with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body H01L27/15 takes precedence
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

A semiconductor light emitting device includes an LED chip, which includes an n-type semiconductor layer, active layer, and p-type semiconductor layer stacked on a substrate. The LED chip further includes an anode electrode connected to the p-type semiconductor, and a cathode connected to the n-type semiconductor. The anode and cathode electrodes face a case with the LED chip mounted thereon. The case includes a base member including front and rear surfaces, and wirings including a front surface layer having anode and cathode pads formed at the front surface, a rear surface layer having anode and cathode mounting electrodes formed at the rear surface, an anode through wiring connecting the anode pad and the anode mounting electrode and passing through a portion of the base member, and a cathode through wirings connecting the cathode pad and the cathode mounting electrode and passing through a portion of the base member.

Claims

1. A light emitting device package, comprising:

a substrate having a front surface, a side surface, and a rear surface, the front surface of the substrate having a first opening and a second opening;

a first conductive part formed over the front surface of the substrate;

a second conductive part formed over the front surface of the substrate;

a third conductive part formed in the first opening, and connected to the first conductive part;

a fourth conductive part formed in the second opening, and connected to the second conductive part;

a fifth conductive part formed over the rear surface of the substrate, and electrically connected to the first conductive part through the third conductive part;

a sixth conductive part formed over the rear surface of the substrate, and electrically connected to the second conductive part through the fourth conductive part;

an LED chip mounted over the front surface of the substrate, having a front surface and a rear surface, and including an anode electrode, which is connected to the first conductive part and formed over the rear surface of the LED chip, and a cathode electrode, which is connected to the second conductive part and formed over the rear surface of the LED chip, the rear surface of the LED chip facing the front surface of the substrate; and

a resin covering the LED chip, formed over the front surface of the substrate, and transmitting a light from the LED chip,

wherein the third conductive part and the fourth conductive part are formed in a line parallel to the side surface of the substrate.

2. The light emitting device package of claim 1, wherein the first opening and the second opening do not overlap with the LED chip in a plan view.

3. The light emitting device package of claim 1, wherein the LED chip is formed not to overlap with a center of the substrate in a plan view.

4. The light emitting device package of claim 1, wherein the LED chip overlaps with a center of the substrate in a plan view.

5. The light emitting device package of claim 1, wherein the resin includes a first portion covering the LED chip and a second portion covering the first conductive part, and a thickness of the first portion is different from the thickness of the second portion.

6. The light emitting device package of claim 1, wherein the third conductive part and the fourth conductive part are formed at a predetermined distance apart from each other.

7. The light emitting device package of claim 1, wherein the sixth conductive part and the LED chip do not overlap with each other.

8. The light emitting device package of claim 1, wherein the fifth conductive part and the sixth conductive part are adjacent to each other.

9. The light emitting device package of claim 1, wherein a portion of the resin covering the LED chip is a hemisphere shape.

10. The light emitting device package of claim 1, wherein the first opening and the second opening are formed at a substantially equal distance from a center of the LED chip.

11. A light emitting device package, comprising:

a substrate having a front surface, a side surface, and a rear surface, the front surface of the substrate having a first opening and a second opening;

a first lead formed over the front surface of the substrate;

a second lead formed over the front surface of the substrate;

a first electrode formed in the first opening, and connected to the first lead;

a second electrode formed in the second opening, and connected to the second lead;

a third electrode formed over the rear surface of the substrate, and electrically connected to the first lead through the first electrode;

a fourth electrode formed over the rear surface of the substrate, and electrically connected to the second lead through the second electrode; and

an LED chip mounted over the front surface of the substrate, having a front surface and a rear surface, and including an anode electrode, which is connected to the first conductive part and formed over the rear surface of the LED chip, and a cathode electrode, which is connected to the second conductive part and formed over the rear surface of the LED chip, the rear surface of the LED chip facing the front surface of the substrate,

wherein the third conductive part and the fourth conductive part are formed in a line parallel to the side surface of the substrate.

12. The light emitting device package of claim 11, further comprising a resin covering the LED chip, formed over the front surface of the substrate, and transmitting a light from the LED chip.

13. The light emitting device package of claim 12, wherein the resin includes a first portion covering the LED chip and a second portion covering the first lead, and a thickness of the first portion is different from the thickness of the second portion.

14. The light emitting device package of claim 12, wherein a portion of the resin covering the LED chip is a hemisphere shape.

15. The light emitting device package of claim 11, wherein the first electrode and the second electrode are formed at a predetermined distance apart from each other.

16. The light emitting device package of claim 11, wherein the fourth electrode and the LED chip do not overlap with each other.

17. The light emitting device package of claim 11, wherein the third electrode and the fourth electrode are adjacent to each other.

18. The light emitting device package of claim 11, wherein the first opening and the second opening are formed at an equal distance from a center of the LED chip.