Electrode structure of optoelectronic device

• US 10,056,429 B2
• Filed: 08/07/2017
• Issued: 08/21/2018
• Est. Priority Date: 05/19/2014
• Status: Active Grant

• Current Assignee: Epistar Corporation
• Original Assignee: Epistar Corporation
• Inventors: Chen, Chao Hsing, Wang, Jia Kuen, Shen, Chien Fu, Ko, Chun Teng
• Primary Examiner(s): Hoang, Quoc
• Application Number:
  US15/670,620
• Publication Number:
  US 20170338278A1
• Time in Patent Office: 379 Days
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 27/156 two-dimensional arrays
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements
• CPC Class Codes: H01L 33/644 in intimate contact or integrated with parts of the device other than the semiconductor body

Abstract

An optoelectronic device includes a first optoelectronic unit; a second optoelectronic unit; a third optoelectronic unit formed between the first optoelectronic unit and the second optoelectronic unit; a first electrode formed on and electrically connected to the first optoelectronic unit; a second electrode formed on and electrically connected to the second optoelectronic unit; a first pad electrically insulated from the third optoelectronic unit wherein the first pad is formed on the third optoelectronic unit or disposed between the first electrode and the second electrode; and a plurality of conductor arrangement structures electrically connected to the first optoelectronic unit, the second optoelectronic unit, and the third optoelectronic unit.

Claims

1. An optoelectronic device, comprising:

a first optoelectronic unit;

a second optoelectronic unit;

a plurality of third optoelectronic units electrically connected to the first optoelectronic unit and the second optoelectronic unit;

a plurality of first electrodes respectively formed on the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units;

a plurality of second electrodes respectively formed on the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units;

a third electrode formed on at least two of the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units;

a fourth electrode formed on at least another two of the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units; and

a plurality of conductor arrangement structures respectively formed between adjacent two of the first optoelectronic unit, the second optoelectronic unit, and the plurality of third optoelectronic units.

2. The optoelectronic device of claim 1, wherein the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units are arranged in a matrix or a line.

3. The optoelectronic device of claim 2, wherein the first optoelectronic unit and the second optoelectronic unit are disposed at two ends of a diagonal line of the matrix.

4. The optoelectronic device of claim 3, wherein the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units are connected as a zigzag.

5. The optoelectronic device of claim 2, wherein the first optoelectronic unit and the second optoelectronic unit are disposed at same column of the matrix, and/or one of the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units is arranged across another adjacent two of the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units of the matrix.

6. The optoelectronic device of claim 2, wherein a connection direction between adjacent two of the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units, and a connection direction between one of the adjacent two optoelectronic units and another one optoelectronic unit adjacent to the one of the adjacent two optoelectronic units are different.

7. The optoelectronic device of claim 1, wherein the conductor arrangement structures are separated from one another.

8. The optoelectronic device of claim 1, wherein each of the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units comprises a first semiconductor layer, a second semiconductor layer, and an active layer formed between the first semiconductor layer and the second semiconductor layer.

9. The optoelectronic device of claim 8, further comprising a contact layer or a metal reflection layer formed on the second semiconductor layer of one of the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units.

10. The optoelectronic device of claim 1, further comprising a carrier plate formed under the third electrode and the fourth electrode.

11. The optoelectronic device of claim 1, further comprising a first insulating layer and a second insulating layer formed on opposite sides of the plurality of conductor arrangement structures, wherein the second insulating layer comprises a thickness greater than a thickness of the first insulating layer.

12. The optoelectronic device of claim 1, further comprising a trench formed between adjacent two of the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units, and each of the plurality of conductor arrangement structures is conformally disposed in the trench.

13. The optoelectronic device of claim 1, wherein the plurality of conductor arrangement structures comprises a reflectivity of more than 80% for a light emitting from the first optoelectronic unit, the second optoelectronic unit, or the plurality of third optoelectronic units.

14. The optoelectronic device of claim 1, further comprising a substrate wherein the first optoelectronic unit, the second optoelectronic unit, and the plurality of third optoelectronic units are formed on a first side of the substrate.

15. The optoelectronic device of claim 14, further comprising a supporting device, wherein the supporting device is formed on a second side of the substrate and covers a side wall of the substrate.

16. The optoelectronic device of claim 14, wherein the third electrode or the fourth electrode comprises an outer boundary, the substrate comprises a first outer boundary, and the outer boundary is beyond the first outer boundary.

17. The optoelectronic device of claim 16, further comprising an optical layer surrounding the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units, wherein the optical layer comprises a second outer boundary and the first outer boundary is formed in the second outer boundary.

18. The optoelectronic device of claim 1, wherein the first optoelectronic unit, the second optoelectronic unit and the plurality of third optoelectronic units comprises three kinds of shapes.

19. The optoelectronic device of claim 1, further comprising a first insulating layer and a second insulating layer formed on opposite sides of the plurality of conductor arrangement structures, wherein the second insulating layer comprises a distributed bragg reflector structure.

20. The optoelectronic device of claim 1, further comprising a heat dissipation pad comprising a portion formed between the third electrode and the fourth electrode, and not covered by the third electrode and the fourth electrode.