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Integrated circuit package including miniature antenna

  • US 10,056,691 B2
  • Filed: 08/09/2017
  • Issued: 08/21/2018
  • Est. Priority Date: 11/07/2002
  • Status: Active Grant
First Claim
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1. A device comprising:

  • a substrate enclosed by a first rectangular area having first and second sides shorter than third and fourth sides;

    at least one chip disposed in a first area of the substrate; and

    a first antenna disposed in a second area of the substrate, the first antenna comprising a conducting pattern, wherein a perimeter of the conducting pattern defines a curve comprising at least five segments, wherein;

    the first antenna fits inside a second rectangular area having a longer side shorter than one-fifth of a longest free-space operating wavelength of the first antenna; and

    the second area is located closer to the first side of the first rectangular area than to the second side of the first rectangular area, a longest side of the second rectangular area being arranged substantially parallel to the first side of the first rectangular area.

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