Camera module for vehicle

• US 10,057,467 B2
• Filed: 06/26/2012
• Issued: 08/21/2018
• Est. Priority Date: 11/08/2011
• Status: Active Grant

• Current Assignee: LG Innotek Company Limited (LG Corporation)
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: Han, Sangyeal, Cho, Bumsig, Kim, Daeseung, Lee, Seungho
• Primary Examiner(s): Vo, Tung
• Assistant Examiner(s): Becker, Joseph
• Application Number:
  US14/357,110
• Publication Number:
  US 20140320657A1
• Time in Patent Office: 2,247 Days
• Field of Search: 348148
• CPC Class Codes: B60R 11/04 Mounting of cameras operative during drive; Arrangement of controls thereof relative to the vehicle
• CPC Class Codes: H04N 23/51 Housings
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

A camera module for a vehicle according to the present invention includes a first Printed Circuit Board (PCB) configured to have an image sensor mounted on its surface; a second PCB configured to supply a power source to the first PCB; an outer shield installed to surround the side of the first and the second PCBs and to shield the first and the second PCBs from electromagnetic interference (EMI); and a plurality of support units disposed at positions where the supports units interfere with the first and the second PCBs of the outer shield and configured to support the first and the second PCBs.

Claims

1. A camera module for a vehicle, comprising:

a first PCB (printed circuit board) including a first ground portion;

a second PCB including a second ground portion spaced apart from the first ground portion; and

an outer shield including a tension spring bent at a portion of a first lateral surface of the outer shield,

wherein the tension spring includes a first tension spring and a second tension spring spaced apart from the first tension spring,

wherein the first tension spring is in contact with the first ground portion,

wherein the second tension spring is in contact with the second ground portion, and

wherein each of the first ground portion and the second ground portion includes conductive material,

wherein the first lateral surface of the outer shield comprises a first hole and a second hole, and

wherein a part of the first tension spring is disposed in the first hole and a part of the second tension spring is disposed in the second hole.

2. The camera module of claim 1, wherein the first ground portion and the second ground portion are each formed at a lateral surface of the first and second PCBs, an upper surface of the first and second PCBs, or a bottom surface of the first and second PCBs.

3. The camera module of claim 2, wherein the first PCB comprises a plurality of ground portions formed along a circumference of the first PCB, and wherein the second PCB comprises a plurality of ground portions formed along a circumference of the second PCB.

4. The camera module of claim 1, wherein the first and second tension springs support the first and second ground portions, respectively.

5. The camera module of claim 2, wherein the first hole and second hole are vertically arranged in a pair on the first lateral surface of the outer shield.

6. The camera module of claim 1, wherein each of the first and second PCBs has a shape corresponding to that of the outer shield.

7. The camera module of claim 1, wherein the outer shield is conductively connected to the first and second ground portions, and wherein the first and second PCBs are configured to be grounded via the outer shield.

8. The camera module of claim 1, further comprising:

a lens module;

an image sensor; and

a cover member configured to cover the lens module, the image sensor, and an upper surface of the first PCB.

9. The camera module of claim 1, wherein the outer shield supports at least three surfaces of the first PCB and at least three surfaces of the second PCB.

10. A vehicle comprising the camera module of claim 1.

11. The camera module of claim 1, wherein the first PCB and the second PCB are disposed in the outer shield.

12. The camera module of claim 1, wherein the first PCB and the second PCB are disposed between an upper end portion of the first lateral surface and a bottom end portion of the first lateral surface.

13. The camera module of claim 12, wherein a part of lateral surface of the first PCB directly contacts with the first lateral surface of the outer shield, and

wherein a part of lateral surface of the second PCB directly contacts with the first lateral surface of the outer shield.

14. The camera module of claim 1, wherein the outer shield comprises a second lateral surface, a third tension spring, and a fourth tension spring;

wherein the second lateral surface of the outer shield comprises a third hole and a fourth hole, and

wherein a part of the third tension spring is disposed in the third hole and a part of the fourth tension spring is disposed in the fourth hole.

15. The camera module of claim 14, wherein the first PCB comprises a third ground portion and the second PCB comprises a fourth ground portion,

wherein the third tension spring contacts with the third ground portion and the fourth tension spring contacts with the fourth ground portion.

16. A camera module, comprising:

a first PCB (printed circuit board);

a second PCB configured to supply power to the first PCB; and

an outer shield of conductive material distancing the first PCB from the second PCB at a predetermined distance,

wherein the first PCB includes a first ground portion formed of conductive material,

wherein the second PCB includes a second ground portion formed of conductive material and spaced apart from the first ground portion,

wherein the outer shield includes a tension spring bent at a portion thereof and foamed at a location corresponding to that of the first ground portion and the second ground portion,

wherein the outer shield includes at least three lateral surfaces and is formed in one body of conductive material,

wherein the outer shield electrically connects the first and second PCBs via the tension spring,

wherein a first lateral surface of the lateral surfaces of the outer shield comprises first and second through holes, and

wherein at least a part of the first tension spring is disposed in the first through hole and at least a part of the second tension spring is disposed in the second through hole.

17. The camera module of claim 16, wherein the tension spring contacts the first and second ground portions to electrically connect the outer shield to the first and second PCBs.

18. The camera module of claim 16, wherein the tension spring is integrally formed at a lateral wall of the outer shield.

19. The camera module of claim 16, further comprising:

a lens module;

an image sensor; and

a cover member configured to cover the lens module, the image sensor, and an upper surface of the first PCB.

20. The camera module of claim 16, wherein the tension spring includes a first pressure portion configured to contact the first ground portion of the first PCB, and a second pressure portion configured to the second ground portion of the second PCB.

21. The camera module of claim 20, wherein the first and second pressure portions are vertically arranged in a pair on a lateral wall of the outer shield, and

wherein the outer shield supports the first PCB and the second PCB.