Thermoformed electrode arrays
First Claim
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1. A cochlear lead comprising:
- a thermoformed circuit comprising;
a substrate;
electrodes formed on the substrate, wherein the electrodes are shaped to curve around a longitudinal axis of the cochlear lead;
traces formed on the substrate and connected to the electrodes; and
intermediate sections between the electrodes, wherein, when the lead is straight prior to implantation in a cochlea, at least a portion of the intermediate sections are curved around an axis that is orthogonal to the longitudinal axis.
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Abstract
A cochlear lead includes a thermoformed circuit with a substrate with electrodes formed on the substrate and shaped to curve around a longitudinal axis of the cochlear lead. Traces are also formed on the substrate and connected to the electrodes. Intermediate sections between the electrodes may be curved about an axis that is orthogonal to the longitudinal axis.
69 Citations
15 Claims
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1. A cochlear lead comprising:
a thermoformed circuit comprising; a substrate; electrodes formed on the substrate, wherein the electrodes are shaped to curve around a longitudinal axis of the cochlear lead; traces formed on the substrate and connected to the electrodes; and intermediate sections between the electrodes, wherein, when the lead is straight prior to implantation in a cochlea, at least a portion of the intermediate sections are curved around an axis that is orthogonal to the longitudinal axis. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method comprising:
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patterning traces and electrodes on a substrate; bonding the substrate to a thermoplastic layer; thermoforming the substrate and thermoplastic layer into a predetermined shape to form a thermoformed circuit, wherein the predetermined shape comprises electrodes curved around a first longitudinal axis and intermediate portions joining the electrodes, the intermediate portions curved about a second axis that is orthogonal to the longitudinal axis when the circuit is straightened along the longitudinal axis; and liquid injection molding silicone around the thermoformed circuit. - View Dependent Claims (12, 13, 14, 15)
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Specification