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High over-pressure capable silicon die pressure sensor

  • US 10,060,813 B2
  • Filed: 09/27/2016
  • Issued: 08/28/2018
  • Est. Priority Date: 09/29/2015
  • Status: Active Grant
First Claim
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1. A sensor comprising:

  • a diaphragm having a bonding portion and a main boss separated from the bonding portion by at least one channel, the main boss having a first side face, a second side face and a chamfered corner face connecting the first side face to the second side face;

    a base having a first contact area aligned with the main boss and separated from the main boss, wherein the bonding portion of the diaphragm is bonded to the base; and

    at least one sensing element that senses movement of the diaphragm.

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