Fingerprint sensing unit and fingerprint sensing module

• US 10,061,965 B2
• Filed: 05/17/2016
• Issued: 08/28/2018
• Est. Priority Date: 09/10/2015
• Status: Expired due to Fees

• Current Assignee: J-Metrics Technology Co., Ltd.
• Original Assignee: J-Metrics Technology Co., Ltd.
• Inventors: Lin, Wei-Ting, Kuo, Shih-Chun
• Primary Examiner(s): Mandala, Michelle
• Application Number:
  US15/156,950
• Publication Number:
  US 20170076134A1
• Time in Patent Office: 833 Days
• Field of Search: None
• CPC Class Codes: G06V 40/1329 Protecting the fingerprint sensor against damage caused by the finger
• CPC Class Codes: H01L 2224/13082 Two-layer arrangements
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/17181 On opposite sides of the body
• CPC Class Codes: H01L 2224/29011 comprising apertures or cavities
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73207 Bump and wire connectors
• CPC Class Codes: H01L 2224/73215 Layer and wire connectors
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2224/81191 wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81193 wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/8185 using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83851 being an anisotropic conductive adhesive
• CPC Class Codes: H01L 2225/06513 Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/60 Protection against electrostatic charges or discharges, e.g. Faraday shields
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/17 : of a plurality of bump connectors
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15158 : the die mounting substrate being other than a cuboid

Abstract

A fingerprint sensing unit includes a carrier substrate, a fingerprint sensing chip on an upper surface of the carrier substrate, a molding layer, a light-pervious cover layer on the molding layer, and an adhesive layer between the light-pervious cover layer and the molding layer. The fingerprint sensing chip is electrically connected to the carrier substrate. The molding layer covers the fingerprint sensing chip.

Claims

1. A fingerprint sensing unit, comprising:

a carrier substrate;

a fingerprint sensing chip disposed on an upper surface of the carrier substrate and electrically connected to the carrier substrate;

a molding layer, covering the fingerprint sensing chip;

a light-pervious cover layer on the molding layer;

an adhesive layer between the light-pervious cover layer and the molding layer; and

an outer conductive ring member, surrounding the molding layer and electrically connected to the fingerprint sensing chip through the carrier substrate, wherein the outer conductive ring member is electrically connected to a gold finger pattern on a lower surface of the carrier substrate or at least on metal layer exposed from the lateral of the carrier substrate.

2. The fingerprint sensing unit of claim 1, wherein the fingerprint sensing unit further comprises a color layer, and the color layer is located between the light-pervious cover layer and the adhesive layer.

3. The fingerprint sensing unit of claim 1, wherein the fingerprint sensing unit further comprises an inner conductive ring member, the inner conductive ring member is located between the light-pervious cover layer and the molding layer, and the inner conductive ring member is electrically connected to the fingerprint sensing chip.

6. The fingerprint sensing unit of claim 3, wherein the fingerprint sensing unit further comprises at least one bump, the bump is disposed on the fingerprint sensing chip, and the inner conductive ring member is electrically connected to the fingerprint sensing chip through the bump.

7. The fingerprint sensing unit of claim 3, wherein the adhesive layer is located under the light-pervious cover layer, and the adhesive layer is disposed on the inner side of the inner conductive ring member and contacts the fingerprint sensing chip.

8. The fingerprint sensing unit of claim 3, wherein the adhesive layer is disposed on the inner side of the inner conductive ring member and contacts the molding layer.

9. The fingerprint sensing unit of claim 3, wherein the fingerprint sensing unit further comprises an outer conductive ring member, and the outer conductive ring member surrounds the molding layer and is electrically connected to the inner conductive ring member exposed through at least one side surface of the molding layer.

4. A fingerprint sensing unit, comprising:

a carrier substrate;

a fingerprint sensing chip disposed on an upper surface of the carrier substrate and electrically connected to the carrier substrate;

a molding layer, covering the fingerprint sensing chip;

a light-pervious cover layer on the molding layer;

an adhesive layer between the light-pervious cover layer and the molding layer; and

an outer conductive ring member, surrounding the molding layer and electrically connected to the fingerprint sensing chip through the carrier substrate, wherein the outer conductive ring member comprises an attaching layer and a conductive layer, the attaching layer is located between the conductive layer and the molding layer, the attaching layer contacts the molding layer, and the conductive layer contacts the attaching layer.

5. The fingerprint sensing unit of claim 4, wherein the outer conductive ring member further comprises an isolation layer, and the conductive layer is located between the isolation layer and the attaching layer.

10. A fingerprint sensing module, comprising:

a carrier substrate having an upper surface and a lower surface opposite to the upper surface;

a fingerprint sensing chip on the upper surface and electrically connected to the carrier substrate;

a molding layer, covering the fingerprint sensing chip;

a light-pervious cover layer on the molding layer; and

an adhesive layer between the light-pervious cover layer and the molding layer;

a circuit board disposed on the lower surface and electrically connected to the carrier substrate; and

an outer conductive ring member, electrically connected to a gold finger pattern on the lower surface of the carrier substrate.

11. The fingerprint sensing module of claim 10, wherein the circuit board is electrically connected to the gold finger pattern.

12. The fingerprint sensing module of claim 10, wherein the outer conductive ring member comprises an attaching layer, a conductive layer, and an isolation layer, the attaching layer contacts the molding layer, and the conductive layer is located between the isolation layer and the attaching layer.

13. The fingerprint sensing module of claim 12, wherein the fingerprint sensing unit further comprises a conductive bezel, the conductive bezel surrounds the molding layer and contacts the isolation layer, the conductive bezel is electrically connected to the circuit board so that the conductive bezel is grounded.

14. The fingerprint sensing module of claim 13, wherein the conductive bezel comprises a cover frame, the isolation layer is disposed on the conductive layer and extends towards a surface of the light-pervious cover layer, and the cover frame contacts the isolation layer and extends towards the central of the conductive bezel, and the cover frame covers a part of the surface of the light-pervious cover layer.