Display device

• US 10,062,320 B2
• Filed: 03/01/2012
• Issued: 08/28/2018
• Est. Priority Date: 04/07/2011
• Status: Active Grant

• Current Assignee: OSRAM OLED GMBH (Ams-Osram AG)
• Original Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Inventors: Illek, Stefan, von Malm, Norwin, Ruegheimer, Tilman
• Primary Examiner(s): Adediran, Abdul-Samad A
• Application Number:
  US14/110,412
• Publication Number:
  US 20140085169A1
• Time in Patent Office: 2,371 Days
• Field of Search: 313498, 372 36, 382124, 349 65, 257 40, 257 79
• CPC Class Codes: G09G 3/32 semiconductive, e.g. using light-emitting diodes [LED]
• CPC Class Codes: G09G 3/3208 organic, e.g. using organic light-emitting diodes [OLED]
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other

Abstract

A display device includes a multiplicity of pixels, at least one connection carrier, and a multiplicity of inorganic light-emitting diode chips. The connection carrier includes a multiplicity of switches. Each pixel contains at least one light-emitting diode chip. Each light-emitting diode chip is mechanically fixed and electrically connected to the connection carrier. Each switch is designed for driving at least one light-emitting diode chip and the light-emitting diode chips are imaging elements of the display device.

Claims

1. A display device comprising:

a multiplicity of pixels;

a connection carrier comprising a multiplicity of switches;

a multiplicity of inorganic light-emitting diode chips, each pixel containing at least one of the light-emitting diode chips;

a contact layer electrically conductively connecting at least two light-emitting diode chips to one another; and

an optical body disposed downstream of and proximate to at least a portion of the light-emitting diode chips, wherein each light-emitting diode chip is mechanically fixed and electrically connected to the connection carrier, wherein each switch is designed to drive at least one light-emitting diode chip or each switch is assigned one-to-one to a light-emitting diode chip, wherein the light-emitting diode chips are imaging elements of the display device, wherein electromagnetic radiation generated by the light-emitting diode chips during operation at least partly passes through the optical body, wherein the electromagnetic radiation is optically expanded upon passing through the optical body, and wherein the contact layer at least in places directly adjoins the light-emitting diode chips and the optical body, the contact layer electrically conductively connecting the light-emitting diode chips to one another.

2. The display device according to claim 1,

wherein radiation passage areas are formed at a side of the light-emitting diode chips which faces away from the connection carrier,

wherein the contact layer is embodied in a radiation-transmissive fashion in places,

wherein the contact layer is formed in places with a material that is reflective to electromagnetic radiation generated by the light-emitting diode chips during operation,

wherein the electromagnetic radiation generated by the light-emitting diode chips during operation at least partly passes through the optical body,

wherein the optical body comprises radiation-nontransmissive separating structures, which optically separate adjacent pixels from one another,

wherein the separating structures extend from a side of a main body of the optical body which faces the light-emitting diode chips to a side of the main body which faces away from the light-emitting diode chips, the separating structures do not completely extend through the main body, and

wherein the separating structures are formed by cutouts in the main body of the optical body which are filled with at least one of TiO₂ and Al₂O₃.

3. The display device according to claim 1,

wherein the contact layer is embodied in a radiation-transmissive fashion at least in places, and

wherein the contact layer covers at least in places radiation passage areas of the light-emitting diode chips electrically conductively connected to one another by the contact layer.

4. The display device according to claim 3, wherein the radiation passage areas are formed at a side of the light-emitting diode chips which faces away from the connection carrier.

5. The display device according to claim 1,

wherein the contact layer is embodied in a radiation-transmissive fashion at least in places, and

wherein the contact layer is formed at least in places with a material that is reflective to electromagnetic radiation generated by the light-emitting diode chips during operation.

6. The display device according to claim 1, wherein the contact layer is formed in places with a transparent conductive oxide.

7. The display device according to claim 1, wherein the contact layer is formed in places with a reflective metal.

8. The display device according to claim 1, wherein the optical body comprises radiation-nontransmissive separating structures that optically separate adjacent pixels from one another.

9. The display device according to claim 8,

wherein the optical body comprises scattering structures for scattering the electromagnetic radiation passing through, and

wherein the separating structures are formed by diffusely reflective regions.

10. The display device according to claim 8, wherein the separating structures are formed by cutouts in a main body of the optical body which are filled with at least one of TiO₂ and Al₂O₃.

11. The display device according to claim 8, wherein the separating structures extend from a side of a main body of the optical body which faces the light-emitting diode chips to a side of the main body which faces away from the light-emitting diode chips, the separating structures do not completely extend through the main body.

12. The display device according to claim 1, wherein the optical body comprises scattering structures for scattering the electromagnetic radiation passing through.

13. The display device according to claim 1,

wherein a p-type side and an n-type side of each of the light-emitting diode chips are directly connected from a side of the connection carrier,

wherein each light-emitting diode chip comprises an n-conducting region, a p-conducting region and an active region provided for generating radiation, the active region being arranged between the two regions, and

wherein the p-conducting region is contact-connected via at least one plated-through hole in the n-conducting region.

14. The display device according to claim 1, wherein each switch is designed to drive at least one light-emitting diode chip.

15. The display device according to claim 14, wherein each switch is assigned one-to-one to a light-emitting diode chip.

16. The display device according to claim 1, wherein each switch is assigned one-to-one to a light-emitting diode chip.

17. A display device comprising:

a multiplicity of pixels;

a connection carrier comprising a main body and a multiplicity of switches; and

a multiplicity of inorganic light-emitting diode chips, wherein each light-emitting diode chip is mechanically fixed and electrically connected to the connection carrier, wherein each switch is interposed between and proximate to a light-emitting diode chip and the main body of the connection carrier, wherein each switch is designed to drive at least one light-emitting diode chip or each switch is assigned one-to-one to a light-emitting diode chip, the light-emitting diode chips being individually energized by the switches, wherein each pixel comprises at least one light-emitting diode chip, wherein the light-emitting diode chips are imaging elements, and wherein the pixels of the display device are configured to generate and display an image.