Apparatus with 3D inductors

• US 10,062,494 B2
• Filed: 11/02/2015
• Issued: 08/28/2018
• Est. Priority Date: 11/03/2014
• Status: Active Grant

• Current Assignee: Qorvo US, Inc. (Qorvo, Inc.)
• Original Assignee: Qorvo US, Inc. (Qorvo, Inc.)
• Inventors: Leipold, Dirk Robert Walter, Maxim, George, Granger-Jones, Marcus, Scott, Baker
• Primary Examiner(s): Enad, Elvin G
• Assistant Examiner(s): Barnes, Malcolm
• Application Number:
  US14/929,608
• Publication Number:
  US 20160126007A1
• Time in Patent Office: 1,030 Days
• CPC Class Codes: H01F 2027/2809 on stacked layers
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01L 21/0276 using an anti-reflective coating anti-reflective coating for lithography in general G03F7/09
• CPC Class Codes: H01L 28/10 Inductors
• CPC Class Codes: H01P 7/06 Cavity resonators
• CPC Class Codes: H01P 7/065 integrated in a substrate
• CPC Class Codes: H01P 7/08 Strip line resonators
• CPC Class Codes: H03H 7/38 Impedance-matching networks
• CPC Class Codes: H03H 7/463 Duplexers
• CPC Class Codes: H03H 9/24 Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
• CPC Class Codes: H04B 1/40 Circuits
• CPC Class Codes: H04J 1/08 Arrangements for combining channels branching filters H01P1/213, H03H7/46

Abstract

Embodiments of an apparatus are disclosed that includes a first three dimensional (3D) inductor and a second 3D inductor. The first three dimensional (3D) inductor has a first conductive path shaped as a first two dimensional (2D) lobe laid over a first 3D volume. In addition, the second 3D inductor has a second conductive path, wherein the second 3D inductor is inserted into the first 3D inductor so that the second conductive path at least partially extends through the first 3D volume. Since second 3D inductor is inserted into the first 3D inductor, the 3D inductors may be coupled to one another. Depending on orientation and distances of structures provided by the 3D inductors, the 3D inductors may be weakly or moderately coupled.

Claims

1. An apparatus comprising:

a first three dimensional (3D) inductor having a first conductive path shaped as a first two dimensional (2D) lobe laid over a first 3D volume, wherein;

the first 3D inductor comprises a first elongated via column that forms part of the first conductive path;

the first elongated via column is elongated along a first plane to define a first column surface that faces toward an interior of the first 3D inductor; and

the first 2D lobe is open so as to define a first gap; and

a second 3D inductor having a second conductive path shaped as a second 2D lobe laid over a second 3D volume, wherein;

the second 3D inductor is inserted into the first 3D inductor so that the second 3D volume at least partially overlaps the first 3D volume;

the second 3D inductor comprises a second elongated via column that forms part of the second conductive path;

the second elongated via column extends through the first 3D volume;

the second elongated via column is elongated along a second plane to define a second column surface that faces toward an exterior of the second 3D inductor and towards the first column surface of the first elongated via column;

the second 2D lobe is open so as to define a second gap; and

the first gap does not coincide with the second gap.

2. The apparatus of claim 1 wherein the first conductive path is shaped as the first 2D lobe laid over the first 3D volume such that, in response to a current being provided through the first conductive path, the first conductive path is configured to generate a magnetic field that predominately embraces the first conductive path along the interior of the first 3D inductor.

3. The apparatus of claim 1 wherein:

the second conductive path only partially extends through the first 3D volume; and

the first 3D inductor is also inserted within the second 3D inductor so that the first conductive path partially extends through the second 3D volume.

4. The apparatus of claim 1 wherein the first conductive path and the second conductive path are interleaved such that the second conductive path only partially extends through the first 3D volume and the first conductive path partially extends through the second 3D volume.

5. The apparatus of claim 1 wherein the first plane and the second plane are oriented substantially the same but are positioned so that the first column surface and the second column surface are displaced.

6. The apparatus of claim 1 wherein:

the first 3D inductor further comprises a third elongated via column that forms another part of the first conductive path, wherein the third elongated via column extends through the second 3D volume and wherein the third elongated via column is elongated along a third plane to define a third column surface that faces toward an exterior of the first 3D inductor; and

the second 3D inductor further comprises a fourth elongated via column that forms another part of the second conductive path, wherein the fourth elongated via column is elongated along a fourth plane to define a fourth column surface that faces toward an interior of the second 3D inductor and towards the third column surface of the third elongated via column.

7. The apparatus of claim 6 wherein the first plane, the second plane, the third plane and the fourth plane are oriented substantially the same but are positioned so that the first column surface, the second column surface, the third column surface, and the fourth column surface are displaced.

14. The apparatus of claim 1 further comprising a third 3D inductor having a third conductive path, wherein the third 3D inductor is inserted into the first 3D inductor so that the third conductive path at least partially extends through the first 3D volume.

15. The apparatus of claim 1 wherein the second 3D inductor has the second conductive path so that the second conductive path extends entirely within the first 3D volume.

16. The apparatus of claim 15 wherein:

the first 3D inductor has the first conductive path such that the first conductive path is shaped to form a first turn, a second turn, and a third turn, wherein the first turn and the second turn face one another and are symmetrical relative to a first plane and wherein the first turn is connected to the second turn so as to form the third turn such that the third turn faces a second plane, wherein the second plane is traverse to the first plane; and

the second conductive path is shaped to form a fourth turn that faces the third turn but the fourth turn has a transverse rotational orientation with respect to the third turn relative to the second plane.

17. The apparatus of claim 15 wherein:

the first 3D inductor has the first conductive path such that the first conductive path is shaped to form a first turn, a second turn, and a third turn, wherein the first turn and the second turn face one another and are symmetrical relative to a first plane and wherein the first turn is connected to the second turn so as to form the third turn such that the third turn faces a second plane that is transverse to the first plane; and

the second 3D inductor has the first conductive path such that the second conductive path is shaped to form a fourth turn, a fifth turn, and a sixth turn, wherein the fourth turn and the fifth turn face one another and are symmetrical relative to a third plane that is transverse to the first plane and the second plane and wherein the fourth turn is connected to the fifth turn so as to form the sixth turn that faces the third turn but the sixth turn has a transverse rotational orientation with respect to the to the third turn relative to the second plane.

18. The apparatus of claim 15 wherein:

the first 3D inductor comprises a first elongated via column, a second elongated via column, a third elongated via column, a fourth elongated via column, a first connector plate, a second connector plate, and a third connector plate to form the first conductive path wherein;

the first connector plate connects the first elongated via column and the second elongated via column;

the second connector plate connects the third elongated via column and the fourth elongated via column; and

the third connector plate connects the second elongated via column to the third elongated via column; and

the second 3D inductor comprises a fifth elongated via column, a sixth elongated via column, a seventh elongated via column, an eighth elongated via column, a fourth connector plate, a fifth connector plate, a sixth connector plate, a seventh connector plate, a first terminal plate a second terminal plate and a bridge to form the second conductive path wherein;

the fourth connector plate connects the fifth elongated via column and the eighth elongated via column;

the fifth connector plate connects the sixth elongated via column and the seventh elongated via column;

the first terminal plate connects to the second elongated via column and extends toward the eighth elongated via column;

the second terminal plate connected to eighth elongated via column and extends toward the second elongated via column, wherein the first terminal plate and the second terminal plate form a gap;

the sixth connector plate connects to the fifth elongated via column and extends towards the seventh elongated via column;

the seventh connector plate connects to the seventh via column and extends towards the first elongated via column; and

the bridge is connects the sixth connector plate to the seventh connector plate, wherein the configured to go around the first connector plate and the second connector plate.

19. The apparatus of claim 1 further comprising a substrate having a substrate body and a metallic structure integrated into the substrate body wherein the first 3D inductor and the second 3D inductor are formed by the metallic structure.

20. The apparatus of claim 1 wherein at least one of the first 3D inductor and the second 3D inductor has two or more turns.

8. An apparatus comprising:

a first three dimensional (3D) inductor having a first conductive path shaped as a first two dimensional (2D) lobe laid over a first 3D volume, wherein;

the first 3D inductor comprises a first elongated via column, a second elongated via column, a third elongated via column, a fourth elongated via column, a first connector plate, a second connector plate, and a third connector plate to form the first conductive path;

the first connector plate connects the first elongated via column and the second elongated via column;

the second connector plate connects the third elongated via column and the fourth elongated via column;

the third connector plate connects the second elongated via column to the third elongated via column; and

the first 2D lobe is open so as to define a first gap; and

a second 3D inductor having a second conductive path shaped as a second 2D lobe laid over a second 3D volume, wherein;

the second 3D inductor comprises a fifth elongated via column, a sixth elongated via column, a seventh elongated via column, an eighth elongated via column, a fourth connector plate, a fifth connector plate, and a sixth connector plate to form the second conductive path;

the fourth connector plate connects the fifth elongated via column and the sixth elongated via column;

the fifth connector plate connects the seventh elongated via column and the eighth elongated via column;

the sixth connector plate connects the sixth elongated via column to the seventh elongated via column;

the second 3D inductor is inserted into the first 3D inductor so that the second 3D volume at least partially overlaps the first 3D volume;

the second 2D lobe is open so as to define a second gap; and

the first gap does not coincide with the second gap.

9. The apparatus of claim 8 wherein:

the fifth elongated via column of the second conductive path of the second 3D inductor extends through the first 3D volume; and

the sixth elongated via column, the seventh elongated via column, the eighth elongated via column, the fifth connector plate, and the sixth connector plate of the second conductive path of the second 3D inductor are outside of the first 3D volume.

10. The apparatus of claim 8 wherein:

the first elongated via column has a first interior column surface facing toward an interior of the first 3D inductor and a first exterior column surface that faces toward an exterior of the first 3D inductor;

the second elongated via column has a second interior column surface facing toward the interior of the first 3D inductor and a second exterior column surface that faces toward the exterior of the first 3D inductor;

the third elongated via column has a third interior column surface facing toward the interior of the first 3D inductor and a third exterior column surface that faces toward the exterior of the first 3D inductor;

the fourth elongated via column has a fourth interior column surface facing toward the interior of the first 3D inductor and a fourth exterior column surface that faces toward the exterior of the first 3D inductor;

the fifth elongated via column has a fifth interior column surface facing toward an interior of the second 3D inductor and a fifth exterior column surface that faces toward an exterior of the second 3D inductor, the first interior column surface faces the fifth exterior column surface;

the sixth elongated via column has a sixth interior column surface facing toward the interior of the second 3D inductor and a sixth exterior column surface that faces toward the exterior of the second 3D inductor, wherein the second elongated via column and the sixth elongated via column are adjacent to one another such that the second interior column surface and the sixth interior column surface are oriented in substantially the same manner and such that the second exterior column surface and the sixth exterior column surface are oriented in substantially the same manner;

the seventh elongated via column has a seventh interior column surface facing toward the interior of the second 3D inductor and a seventh exterior column surface that faces toward the exterior of the second 3D inductor, wherein the third exterior column surface faces the seventh interior column surface; and

the eighth elongated via column has an eighth interior column surface facing toward the interior of the second 3D inductor and a eighth exterior column surface that faces toward the exterior of the second 3D inductor, wherein the fourth elongated via column and the eighth elongated via column are adjacent to one another such that the fourth interior column surface and the eighth interior column surface are oriented in substantially the same manner and such that the fourth exterior column surface and the eighth exterior column surface are oriented in substantially the same manner.

11. The apparatus of claim 10 wherein more than two 3D inductors are disposed in a chain configuration.

12. The apparatus of claim 8 wherein:

the sixth elongated via column of the second conductive path of the second 3D inductor extends through the first 3D volume; and

the fifth elongated via column, the seventh elongated via column, the eighth elongated via column, and the fifth connector plate of the second conductive path of the second 3D inductor are outside of the first 3D volume.

13. The apparatus of claim 8 wherein:

the first elongated via column has a first interior column surface facing toward an interior of the first 3D inductor and a first exterior column surface that faces toward an exterior of the first 3D inductor;

the second elongated via column has a second interior column surface facing toward the interior of the first 3D inductor and a second exterior column surface that faces toward the exterior of the first 3D inductor;

the third elongated via column has a third interior column surface facing toward the interior of the first 3D inductor and a third exterior column surface that faces toward the exterior of the first 3D inductor;

the fourth elongated via column has a fourth interior column surface facing toward the interior of the first 3D inductor and a fourth exterior column surface that faces toward the exterior of the first 3D inductor;

the fifth elongated via column has a fifth interior column surface facing toward an interior of the second 3D inductor and a fifth exterior column surface that faces toward an exterior of the second 3D inductor, the fourth elongated via column and the fifth elongated via column are adjacent to one another such that the fourth interior column surface and the fifth interior column surface are oriented in substantially the same manner and such that the fourth exterior column surface and the fifth exterior column surface are oriented in substantially the same manner;

the sixth elongated via column has a sixth interior column surface facing toward the interior of the second 3D inductor and a sixth exterior column surface that faces toward the exterior of the second 3D inductor, wherein the sixth interior column surface faces the third interior column surface and the sixth exterior column surface faces the first interior column surface;

the seventh elongated via column has a seventh interior column surface facing toward the interior of the second 3D inductor and a seventh exterior column surface that faces toward the exterior of the second 3D inductor, the second elongated via column and the seventh elongated via column are adjacent to one another such that the second interior column surface and the seventh interior column surface are oriented in substantially the same manner and such that the second exterior column surface and the seventh exterior column surface are oriented in substantially the same manner; and

the eighth elongated via column has an eighth interior column surface facing toward the interior of the second 3D inductor and an eighth exterior column surface that faces toward the exterior of the second 3D inductor, wherein the eighth interior column surface faces the third exterior column surface.