Semiconductor packages with thermal management features for reduced thermal crosstalk
First Claim
Patent Images
1. A package comprising:
- a first die coupled to a first side of a substrate;
a second die coupled to the first side of the substrate;
a heat dissipating structure attached to the first side of the substrate, the heat dissipating structure comprising;
a contour ring attached to the first side of the substrate and around the first die and the second die; and
a contour lid attached to the contour ring and over the first die and the second die, the contour lid having an opening exposing the second die; and
a heat spreader over the heat dissipating structure and having a first portion and a second portion, the first portion being attached to an upper surface of the contour lid, and the second portion extending into the opening and attached to the second die.
0 Assignments
0 Petitions
Accused Products
Abstract
An embodiment package includes a first die stack on a surface of a package component, a second die stack on the surface of the package component, and a contour lid over the first die stack and second die stack. The contour lid includes a first thermal conductive portion over the first die stack, a second thermal conductive portion over the second die stack, and a thermal barrier portion between the first thermal conductive portion and the second thermal conductive portion. The thermal barrier portion includes a low thermal conductivity material.
-
Citations
20 Claims
-
1. A package comprising:
-
a first die coupled to a first side of a substrate; a second die coupled to the first side of the substrate; a heat dissipating structure attached to the first side of the substrate, the heat dissipating structure comprising; a contour ring attached to the first side of the substrate and around the first die and the second die; and a contour lid attached to the contour ring and over the first die and the second die, the contour lid having an opening exposing the second die; and a heat spreader over the heat dissipating structure and having a first portion and a second portion, the first portion being attached to an upper surface of the contour lid, and the second portion extending into the opening and attached to the second die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
-
-
13. A package comprising:
-
a first die and a second die, wherein the first die and the second die are bonded to a package component; a ring attached to the package component and encircling the first die and the second die; and a lid attached to an upper surface of the ring and disposed over the first die and second die, wherein the lid comprises; a first thermal conductive portion; a second thermal conductive portion; and a first thermal barrier between and contacting the first thermal conductive portion and the second thermal conductive portion, wherein each of the first thermal conductive portion and the second thermal conductive portion has a thermal conductivity higher than a thermal conductivity of the first thermal barrier. - View Dependent Claims (14, 15, 16, 17)
-
-
18. A package comprising:
-
a first die and a second die, the first die and the second die being attached to a first side of a substrate; a heat conductive feature attached to the first side of the substrate, wherein the heat conductive feature surrounds the first die and the second die, wherein the heat conductive feature comprises a lid, the lid having a first portion, a second portion, and an opening between the first portion and the second portion, wherein the first portion of the lid covers the first die, and the opening of the lid exposes the second die; a first thermal interface material (TIM) over the first portion of the lid; an adhesive over the second portion of the lid, wherein a thermal conductivity of the adhesive is lower than a thermal conductivity of the first TIM; and a heat spreader attached to the lid, the heat spreader having a first thermal conductive portion, a second thermal conductive portion and a thermal barrier, wherein the thermal barrier is between and contacts the first thermal conductive portion and the second thermal conductive portion, wherein the first thermal conductive portion is over the first portion of the lid with the first TIM disposed therebetween, and wherein the second thermal conductive portion is over the second portion of the lid with the adhesive disposed therebetween. - View Dependent Claims (19, 20)
-
Specification