Methods and systems for making piezoelectric cantilever actuators
First Claim
1. A method of fabricating a microelectronic device comprising:
- providing a substrate comprising a first bottom surface;
providing a mold comprising a first top surface with first projections;
punching the first projections through the first bottom surface to define anchors, pre-cantilevers, and cavities in the substrate;
providing a cutter with a second bottom surface with second projections; and
stamping a second top surface of the substrate to release the pre-cantilevers and define cantilevers and recess areas.
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Accused Products
Abstract
A method of fabricating a microelectronic device comprising providing a substrate comprising a first bottom surface, providing a mold comprising a first top surface with first projections, and punching the first projections through the first bottom surface to define anchors, pre-cantilevers, and cavities in the substrate. A piezoelectric cantilever actuator system array prepared by a process comprising the steps of providing a substrate comprising a first bottom surface, providing a mold comprising a first top surface with first projections, and punching the first projections through the first bottom surface to define anchors, pre-cantilevers, and cavities in the substrate. A microelectronic device comprising a base, a first anchor coupled to the base, and a first cantilever coupled to the first anchor, wherein the base, the first anchor, and the first cantilever are an integral structure formed from the same substrate material.
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Citations
16 Claims
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1. A method of fabricating a microelectronic device comprising:
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providing a substrate comprising a first bottom surface; providing a mold comprising a first top surface with first projections; punching the first projections through the first bottom surface to define anchors, pre-cantilevers, and cavities in the substrate; providing a cutter with a second bottom surface with second projections; and stamping a second top surface of the substrate to release the pre-cantilevers and define cantilevers and recess areas.
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2. A method of fabricating a microelectronic device comprising:
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providing a substrate comprising a first bottom surface; providing a mold comprising a first top surface with first projections; punching the first projections through the first bottom surface to define anchors, pre-cantilevers, and cavities in the substrate; fabricating additional circuitry on top of the pre-cantilevers after the providing the substrate, the providing the mold, and the punching; depositing a bottom electrode layer; and patterning the bottom electrode layer to define bottom contact pads and bottom electrodes corresponding to the pre-cantilevers. - View Dependent Claims (3, 4, 5, 6, 7)
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8. A piezoelectric cantilever actuator system array prepared by a process comprising the steps of:
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providing a substrate comprising a first bottom surface; providing a mold comprising a first top surface with first projections; punching the first projections through the first bottom surface to define anchors, pre-cantilevers, and cavities in the substrate; providing a cutter with a second bottom surface with second projections; and stamping a second top surface of the substrate to the pre-cantilevers and define cantilevers and recess areas.
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9. A piezoelectric cantilever actuator system array prepared by a process comprising the steps of:
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providing a substrate comprising a first bottom surface; providing a mold comprising a first top surface with first projections; punching the first projections through the first bottom surface to define anchors, pre-cantilevers, and cavities in the substrate; fabricating additional circuitry on top of the pre-cantilevers after the providing the substrate, the providing the mold, and the punching; depositing a bottom electrode layer; patterning the bottom electrode layer to define bottom contact pads and bottom electrodes corresponding to the pre-cantilevers; depositing gate dielectric layers; and depositing a piezoelectric layer on top of the bottom contact pads, the bottom electrodes, and the gate dielectric layers for thin-film transistors (TFTs). - View Dependent Claims (10, 11)
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12. A microelectronic device comprising:
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a base; a first anchor coupled to the base and comprising a first anchor top surface; a first cantilever coupled to the first anchor and comprising a first cantilever top surface, wherein the base, the first anchor, and the first cantilever are an integral structure formed from the same substrate material; a first set of active layers coupled to the first anchor and the first cantilever, configured to form a first piezoelectric cantilever actuator with the first cantilever, and covering part of the first anchor top surface and all of the first cantilever top surface; a second anchor coupled to the base and comprising a second anchor top surface; a second cantilever coupled to the second anchor and comprising a second cantilever top surface; and a second set of active layers coupled to the second anchor and the second cantilever, configured to form a second piezoelectric cantilever actuator with the second cantilever, and covering part of the second anchor top surface and all of the second cantilever top surface. - View Dependent Claims (13, 14, 15, 16)
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Specification