Co-fired passive integrated circuit devices
First Claim
1. A method comprising:
- receiving a carrier substrate;
forming at least one passive device structure on the carrier substrate;
firing the carrier substrate after the forming of the at least one passive device structure;
bonding the carrier substrate to a circuit substrate via a bonding structure that facilitates electrical coupling and a dummy bonding structure that facilitates physical coupling without electrical coupling, wherein the bonding includes electrically coupling the at least one passive device structure to a circuit element of the circuit substrate; and
separating the carrier substrate from the at least one passive device structure after the bonding.
2 Assignments
0 Petitions
Accused Products
Abstract
A variety of integrated circuit devices and a method for their formation and integration are provided. The integrated circuit devices may include inductors, capacitors, and/or other passive devices. In an exemplary embodiment, a first substrate is received and a conductive material is applied to the first substrate such that a loop of the conductive material is formed on the first substrate. A magnetic material is applied to the first substrate and surrounds at least a portion of the loop. A thermal process is performed on the first substrate having the conductive material and the magnetic material applied thereupon. The conductive material is bonded to a second substrate, and thereafter, the conductive material and the magnetic material are separated from the first substrate.
18 Citations
20 Claims
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1. A method comprising:
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receiving a carrier substrate; forming at least one passive device structure on the carrier substrate; firing the carrier substrate after the forming of the at least one passive device structure; bonding the carrier substrate to a circuit substrate via a bonding structure that facilitates electrical coupling and a dummy bonding structure that facilitates physical coupling without electrical coupling, wherein the bonding includes electrically coupling the at least one passive device structure to a circuit element of the circuit substrate; and separating the carrier substrate from the at least one passive device structure after the bonding. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method comprising:
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forming an inductor and a capacitor over a carrier substrate; thereafter, firing the carrier substrate; thereafter, bonding the carrier substrate to a circuit substrate via a bonding structure that facilitates electrical coupling and a dummy bonding structure that facilitates physical coupling without electrical coupling, such that the inductor and the capacitor are electrically coupled to the circuit substrate; and thereafter, separating the carrier substrate from the inductor and the capacitor. - View Dependent Claims (13, 14, 15)
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16. A method comprising:
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forming a passive device over a carrier substrate; thereafter, firing the carrier substrate; thereafter, forming a bonding structure between the passive device and a circuit substrate that electrically couples the passive device to the circuit substrate and a dummy bonding structure between the passive device and the circuit substrate that physically couples the passive device to the circuit substrate; and thereafter, separating the carrier substrate from the passive device. - View Dependent Claims (17, 18, 19, 20)
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Specification