High-frequency module

• US 10,063,212 B2
• Filed: 04/12/2017
• Issued: 08/28/2018
• Est. Priority Date: 10/16/2014
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Mizoguchi, Shinya
• Primary Examiner(s): Jones, Stephen E
• Application Number:
  US15/485,252
• Publication Number:
  US 20170222617A1
• Time in Patent Office: 503 Days
• Field of Search: 333 33, 333133, 333187, 333188, 333193, 333194, 333195, 333196
• CPC Class Codes: H03H 7/01 Frequency selective two-port networks
• CPC Class Codes: H03H 7/38 Impedance-matching networks
• CPC Class Codes: H03H 9/0009 using surface acoustic wave devices
• CPC Class Codes: H03H 9/1071 the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
• CPC Class Codes: H03H 9/25 Constructional features of resonators using surface acoustic waves devices for manipulating acoustic surface waves in general G10K11/36
• CPC Class Codes: H03H 9/64 using surface acoustic waves
• CPC Class Codes: H03H 9/706 Duplexers
• CPC Class Codes: H03H 9/725 Duplexers
• CPC Class Codes: H04B 1/525 with means for reducing leakage of transmitter signal into the receiver

Abstract

A high-frequency module includes a propagation path that has a simple structure and improves filter characteristics by causing an inductor and a matching network to electromagnetic field couple with each other such that attenuation characteristics outside of a frequency band of a transmission signal are improved without increasing the size of the high-frequency module. In addition, unintended electromagnetic field coupling between a first filter and the inductor is significantly reduced or prevented by a shield electrode. Therefore, unintended propagation of a high-frequency signal is significantly reduced or prevented. Therefore, the attenuation characteristics outside of the frequency band of transmission signal input to the transmission terminal are improved more effectively.

Claims

1. A high-frequency module comprising:

a filter component including;

a first terminal to which a first high-frequency signal is input;

a first filter through which the first high-frequency signal input to the first terminal passes;

a second terminal that outputs the first high-frequency signal that has passed through the first filter; and

a third terminal that is connected to the first filter;

a matching network that is connected to the second terminal;

a module substrate on which the filter component is mounted;

an inductor that adjusts characteristics of the first filter and is provided inside the module substrate, the inductor including a first end connected to the third terminal and a second end thereof connected to ground; and

a shield electrode between the inductor and the filter component;

wherein

the inductor and the matching network define a propagation path by electromagnetic field coupling with each other;

the matching network and the filter component do not electromagnetic field couple with each other; and

the shield electrode is located to suppress electromagnetic field coupling between the inductor and the filter component.

2. The high-frequency module according to claim 1, wherein

the matching network and the first filter do not electromagnetic field couple with each other;

and

the shield electrode is located to suppress electromagnetic field coupling between the inductor and the first filter.

3. The high-frequency module according to claim 2, wherein a distance between the matching network and the first filter is larger than a distance between the matching network and the inductor.

4. The high-frequency module according to claim 1, wherein

the matching network includes a chip circuit component that is mounted on a mounting electrode provided on a mounting surface of the module substrate;

and

the circuit component and the shield electrode are not superposed with each other in plan view.

5. The high-frequency module according to claim 1, wherein

the module substrate includes a plurality of dielectric layers;

the matching network is provided inside the module substrate; and

the shield electrode is provided between the matching network and the first filter.

6. The high-frequency module according to claim 5, wherein the matching network is provided on a same dielectric layer as the inductor among the plurality of dielectric layers.

7. The high-frequency module according to claim 5, wherein the matching network is provided on a different dielectric layer from the inductor among the plurality of dielectric layers, and the matching network and the inductor are partially superposed with each other in plan view.

8. The high-frequency module according to claim 6, wherein

the matching network includes wiring electrodes provided across the plurality of dielectric layers;

and

the inductor includes wiring electrodes provided across the plurality of dielectric layers.

9. The high-frequency module according to claim 1, wherein the inductor is not superposed with the first filter in plan view.

10. The high-frequency module according to claim 1, wherein a portion of the inductor is not superposed with the shield electrode.

11. The high-frequency module according to claim 1, wherein the inductor and the matching network electrically field couple with each other.

12. The high-frequency module according to claim 1, wherein the shield electrode is mounted on a mounting surface of the module substrate.

13. The high-frequency module according to claim 1, wherein the matching network includes wiring electrodes inside the module substrate.

14. The high-frequency module according to claim 13, wherein another shield electrode is located between the matching network and the filter component.

15. The high-frequency module according to claim 1, wherein the matching network includes another inductor located on a same dielectric layer of the plurality of dielectric layers as the inductor.

16. The high-frequency module according to claim 1, wherein the matching network includes another inductor defined by wiring electrodes inside of the module substrate.

17. The high-frequency module according to claim 16, wherein a ground via is located between the another inductor and the inductor.

18. The high-frequency module according to claim 16, wherein a wiring pattern is located between the another inductor and the inductor.

19. A mobile communication terminal comprising the high-frequency module according to claim 1.

20. The mobile communication terminal according to claim 19, wherein the mobile communication terminal is one of a cellular phone and a mobile information terminal.