Multi-layer wiring structure, magnetic element and manufacturing method thereof

• US 10,068,693 B2
• Filed: 11/03/2015
• Issued: 09/04/2018
• Est. Priority Date: 07/22/2015
• Status: Active Grant

• Current Assignee: Cyntec Co. Ltd. (Delta Electronics Incorporated)
• Original Assignee: Cyntec Co. Ltd. (Delta Electronics Incorporated)
• Inventors: Lin, Chun-Chih, Chen, Yi-Wei, Lai, Yi-Ting, Lin, Chu-keng, Lee, Cheng-Chang
• Primary Examiner(s): Vo, Peter DungBa
• Assistant Examiner(s): Kue, Kaying
• Application Number:
  US14/931,580
• Publication Number:
  US 20170027061A1
• Time in Patent Office: 1,036 Days
• Field of Search: 296021, 29830, 29825
• CPC Class Codes: H01F 2027/2809 on stacked layers
• CPC Class Codes: H01F 27/24 Magnetic cores
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 27/32 Insulating of coils, windings, or parts thereof
• CPC Class Codes: H01F 41/041 Printed circuit coils apparatus or processes for manufacturing printed circuits in general H05K3/00
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 1/09 Use of materials for the conductive, e.g. metallic pattern
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/086 for inductive purposes, e.g. printed inductor with ferrite core
• CPC Class Codes: H05K 3/202 using self-supporting metal foil pattern

Abstract

A multi-layer wiring structure includes a first conductive structure, a second conductive structure and an insulating layer. To manufacturing the multi-layer wiring structure, a first conductive structure and a second conductive structure are provided. The first conductive structure and the second conductive structure include a plurality of wiring patterns. Then, the insulating layer is disposed between the first conductive structure and the second conductive structure. The insulting layer is thinner than the first conductive structure or the second conductive structure. The first conductive structure, the insulating layer and the second conductive structure are laminated to form the multi-layer wiring structure. A planar magnetic element having a compact coil manufactured by the method is also provided.

Claims

1. A manufacturing method of a multi-layer wiring structure, comprising steps of:

providing a first conductive structure and a second conductive structure, each of the first conductive structure and the second conductive structure comprising a plurality of wiring patterns and being a single conductive layer made of a metal material or an alloy material, the first conductive structure or the second conductive structure comprising a confining structure at an edge of the first conductive structure or the second conductive structure or a space between two of the wiring patterns, the first conductive structure comprising a first connection strip and the second conductive structure comprising a second connection strip, the wiring patterns of the first conductive structure having the same shape and being connected to the first connection strip, the wiring patterns of the second conductive structure having the same shape and being connected to the second connection strip;

disposing an insulating layer between the first conductive structure and the second conductive structure;

inserting a first positioning pin in a first positioning hole formed on the confining structure along a laminating direction; and

laminating the first conductive structure, the insulating layer and the second conductive structure to form the multi-layer wiring structure, wherein an entire insulating thickness between the first conductive structure and the second conductive structure is thinner than the single conductive layer of the first conductive structure or the second conductive structure after the laminating step.

2. The manufacturing method according to claim 1, wherein the wiring patterns of the first conductive structure and the second conductive structure are formed by a stamping procedure or an etching procedure.

3. The manufacturing method according to claim 1, wherein the insulating layer is made of prepreg, and the first conductive structure and the second conductive structure are made of copper or an alloy material wherein surfaces of the first conductive structure and the second conductive structure are roughened by brown oxide treatment.

4. The manufacturing method according to claim 1, wherein the entire insulating thickness after the laminating step ranges from 0.015 mm to 0.2 mm, and a thicknesses of the first conductive structure and the second conductive structure after the laminating step range from 0.1 mm to 0.3 mm.

5. The manufacturing method according to claim 1, wherein the first conductive structure, the insulating layer and the second conductive structure are laminated by hot press lamination.

6. The manufacturing method according to claim 5, wherein the laminating step further comprises a step of preheating the first conductive structure and the second conductive structure.

7. The manufacturing method according to claim 1, wherein a second positioning pin is inserted in a second positioning hole formed on the first connection strip and a third positioning hole formed on the second connection strip along a laminating direction during the laminating step.

8. The manufacturing method according to claim 1, further comprising a step of cutting the multi-layer wiring structure to remove the first connection strip and the second connection strip and form a plurality of multi-layer wiring units, a plurality of leads of the wiring patterns being revealed on a cutting surface of each of the multi-layer wiring units.

9. The manufacturing method according to claim 8, further comprising a step of coupling a connecting member to a corresponding one of the multi-layer wiring units to electrically connect the revealed leads of the corresponding multi-layer wiring unit.

10. The manufacturing method according to claim 1, wherein the wiring patterns are ring shaped wiring patterns.

11. A manufacturing method of a multi-layer wiring structure, comprising steps of:

providing a first conductive structure and a second conductive structure, the first conductive structure comprising a first connection strip and a plurality of first wiring patterns connected to the first connection strip, the second conductive structure comprising a second connection strip and a plurality of second wiring patterns connected to the second connection strip, a first positioning hole being formed on the first connection strip and a second positioning hole being formed on the second connection strip;

disposing an insulating layer between the first conductive structure and the second conductive structure;

inserting a first positioning pin in the first positioning hole and the second positioning hole along a laminating direction, the first positioning pin further penetrating through the insulating layer; and

laminating the first conductive structure, the insulating layer and the second conductive structure along the laminating direction to form the multi-layer wiring structure.

12. The manufacturing method according to claim 11, wherein an entire insulating thickness between the first conductive structure and the second conductive structure is thinner than the first conductive structure or the second conductive structure after the laminating step.

13. The manufacturing method according to claim 11, wherein the first wiring patterns of the first conductive structure having the same shape, and the second wiring patterns of the second conductive structure having the same shape.

14. The manufacturing method according to claim 11, wherein the first wiring patterns or the second wiring patterns are ring shaped wiring patterns.

15. The manufacturing method according to claim 11, wherein the first conductive structure or the second conductive structure comprises a confining structure at an edge of the first conductive structure or the second conductive structure or a space between two of the first wiring patterns or the second wiring patterns, a second positioning pin is inserted in a third positioning hole formed on the confining structure along the laminating direction during the laminating step.

16. The manufacturing method according to claim 11, further comprising a step of cutting the multi-layer wiring structure to remove the first connection strip and the second connection strip and form a plurality of multi-layer wiring units, a plurality of leads of the wiring patterns being revealed on a cutting surface of each of the multi-layer wiring units.

17. The manufacturing method according to claim 16, further comprising a step of coupling a connecting member to a corresponding one of the multi-layer wiring units to electrically connect the revealed leads of the corresponding multi-layer wiring unit.