Semiconductor package

• US 10,068,817 B2
• Filed: 03/20/2017
• Issued: 09/04/2018
• Est. Priority Date: 03/18/2016
• Status: Active Grant

• Current Assignee: MACOM Technology Solutions Holdings, Inc.
• Original Assignee: MACOM Technology Solutions Holdings, Inc.
• Inventors: Bovaird, Paul, D'Agostino, Stefano, Manan, Vikas
• Primary Examiner(s): Taylor, Earl
• Application Number:
  US15/464,100
• Publication Number:
  US 20170271221A1
• Time in Patent Office: 533 Days
• CPC Class Codes: H01L 2223/6616 Vertical connections, e.g. vias
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/055 the leads having a passage through the base H01L23/057 takes precedence
• CPC Class Codes: H01L 23/367 Cooling facilitated by shape of device H01L23/38, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/16251 Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate

Abstract

A semiconductor package and die assembly with a package having an exterior surface and an interior space, the interior space defined by a first side wall, and a second side wall that opposes the first side wall. Also part of the assembly is a package floor and a package ceiling. The package floor includes package floor conductors. The package ceiling opposes the package floor and includes package ceiling conductors in the package ceiling. One or more semiconductor dies are on the floor of the package floor. Electrical conductors electrically connect the one or more floor dies to the package floor conductors. One or more semiconductor dies are located on the package ceiling. Electrical conductors are configured to electrically connect the one or more ceiling dies to the package ceiling conductors. An air space is located between the package floor and the package ceiling.

Claims

1. A semiconductor package and die assembly comprising:

a package having an exterior surface and an interior space, the interior space defined by;

a first side wall;

a second side wall that opposes the first side wall;

a package floor, the package floor including package floor conductors in the package floor; and

a package ceiling having an interior side that opposes the package floor, the package ceiling including package ceiling conductors in the package ceiling;

one or more floor dies comprising semiconductor dies located on the package floor;

electrical conductors electrically connecting the one or more floor dies to the package floor conductors;

one or more ceiling dies comprising semiconductor dies located on the package ceiling;

electrical conductors electrically connecting the one or more ceiling dies to the package ceiling conductors;

an upper heat sink located on the package ceiling; and

two or more heat conductors in the package ceiling that extend from the interior side of the package ceiling, through the package ceiling, and connect to the heat sink, the two or more heat conductors being separate elements from the upper heat sink.

2. The assembly of claim 1 further comprising an air space locate between the package floor and the package ceiling, the air space extending from the first side wall to the second side wall.

3. The assembly of claim 1 further comprising wall conductors located in the first side wall, the second side wall or both, the wall conductors electrically connecting the package ceiling conductors to the package floor conductors.

4. The assembly of claim 3 wherein the wall conductors comprise RF and DC interconnection via.

5. The assembly of claim 1 further comprising a high frequency connector.

6. The assembly of claim 5 wherein the high frequency connector is located in either the first side wall or the second side wall, or third side wall or a fourth side wall.

7. The assembly of claim 1 wherein the package ceiling is further configured as a heat sink.

8. A semiconductor package comprising:

a package floor having an upper surface, the package floor including package floor conductors in or on the upper surface of the package floor;

one or more side walls that extend upward from the package floor;

a package ceiling having an exterior surface and an interior surface, the interior surface opposing the upper surface of the package floor and connecting to the one or more package walls, the package ceiling including package ceiling conductors in or on the interior surface of the package ceiling;

one or more floor dies comprising semiconductor dies located on the package floor;

one or more ceiling dies comprising semiconductor die located on the package ceiling;

one or more electrical conductors electrically connecting at least one of the package floor conductor to at least one of the package ceiling conductors;

an upper heat sink located above the package ceiling; and

two or more heat conductors in the package ceiling that extend through the package ceiling to connect to the heat sink such that the two or more heat conductors do not extend below the interior surface of the package ceiling.

9. The semiconductor package of claim 8 wherein the one or more side walls are at an outer edge of package floor.

10. The semiconductor package of claim 8 further comprising a high frequency connector in at least one of the one or more side walls.

11. The semiconductor package of claim 8 wherein the electrical conductors electrically connecting at least one of the package floor conductor to at least one of the package ceiling conductors comprise RF and DC interconnection vias.

12. The semiconductor package of claim 8 further comprising an air space locate between the package floor and the package ceiling.

13. The semiconductor package of claim 12 wherein the air space extends from a first side wall to a second side wall.